JPS6189247A - Epoxy resin composition for semiconductor sealing - Google Patents

Abstract

PURPOSE:To obtain the titled composition of both high formability and moisture resistance with low internal stress such as showing high crack resistance when subjected to thermal shock, by incorporating epoxy resin with polyalkylene glycol diglycidyl ether. CONSTITUTION:$/The objective composition can be obtained by incorporating (A) an epoxy resin (e.g., bisphenol-type epoxy resin, novolak-type epoxy resin) with (B) 0.1-5wt% based on the final composition, of a polyalkylene glycol diglycidyl ether of formula I [m and n are each >=2; R1 and R2 are each of formula II (l is 2-12), cyclohexylene, etc.] (e.g., polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether) and (C) other ingredients such as curing agent (pref. phenol novolak), curing accelerator, filler, releasing agent, surface-treating agent.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a low stress epoxy resin composition that has excellent crack resistance when subjected to thermal shock and moisture resistance, and its characteristics are as follows. The purpose is to add polyalkylene glycol diglycidyl ether having epoxy groups at both ends.

[Prior art]

In recent years, advances in semiconductor-related technology have been remarkable, and the degree of integration of LSIs has been improving year by year, with interconnections becoming finer and chip sizes becoming larger. This trend is reflected in resin-sealed LS
Failures such as I/M wiring deformation, pad page cracks, and resin cracks became more serious. In order to solve these problems, what is currently required of resins for semiconductor encapsulation are:
It reduces stress.

Epoxy resin compositions are widely used for semiconductor encapsulation because they have better moisture resistance than phenol resin compositions and polyester resin compositions. Conventionally, in order to obtain a low stress epoxy resin composition, synthetic rubber was used (Japanese Patent Application Laid-Open No. 58-1769).
58, JP-A-57-18Q626, JP-A-58-17
4416) and the use of silicones (Unexamined Japanese Patent Publication No. 58-21
0920, JP-A-57-3821), but all of them have problems such as poor moldability (especially hardening properties, mold release properties), and impairing the moisture resistance of epoxy resins. there were.

[Purpose of the invention]

6 The present invention was developed as a result of research aimed at obtaining a low-stress epoxy resin composition with excellent moldability and moisture resistance, which could not be obtained by conventionally using synthetic rubber or silicones. By adding glycidyl ether], it has excellent moldability and moisture resistance,
It has been discovered that a low-stress epoxy resin composition having excellent crack resistance when subjected to thermal shock can be obtained.

[Structure of the invention]

- The present invention is composed of an epoxy resin, a curing agent, a curing accelerator, a filler, a mold release agent, a surface treatment agent, etc., characterized by containing 0.1 to 5 weight 1 t% of polyalkylene glycol diglycidyl ether. This is an epoxy resin composition for semiconductor encapsulation.

ζThe polyalkylene glycol diglycidyl ether referred to here refers to all those represented by the following general formula.

(m and n are integers of 2 or more, in the formula, R1 and R2 are C1H
2t - (t = 2 to 12), cyclohexylene, naphthylene, biphenylene, alkyl group ψ alkoxy group
Represents phenylene substituted with halogen, etc.]
The molecular weight of alkylene glycol is 200 to 10
QOOO, preferably 200 to IQ000, particularly preferably 300 to L000. Examples of such substances include polyethylene glycol diglycidyl, polypropylene glycol diglycidyl ether, and the like.

Such polyalkylene glycol diglycidyl ether has excellent compatibility with epoxy resins and curing agents, and is easy to disperse uniformly.It also reacts quickly with the curing agent during curing, so it has excellent moldability, moisture resistance, and heat resistance. It is possible to provide a low-stress epoxy resin composition that has excellent crack resistance when subjected to impact.

The curing agent mentioned here is preferably phenol novolacs, but may also include acid anhydrides and amines. These may be used alone or in combination. Phenol novolacs refer to all compounds containing a phenolic hydroxyl group or a derivative thereof in the novolak skeleton. Phenols (phenol, alkylphenol, resorcinol, etc.) O Includes not only single-component novolacs, but also co-condensed novolaks made of any combination of phenols, and co-condensed novolacs of phenols and other resins.

Moreover, the epoxy resin referred to herein refers to all resins having an epoxy group. For example, by adjusting the amount of O polyalkylene glycol diglycidyl ether, which refers to bisphenol type epoxy resin, novolac type epoxy resin, triazine nucleus-containing epoxy resin, etc., the characteristics of low-resistance carboxy resin can be maximized. can be pulled out. If it is too small, the crack resistance will be poor, and if it is too large, the curing properties will be poor.

For semiconductor encapsulation applications, it is desirable that the composition contains KO11 to 5N.

〔Effect of the invention〕

According to the method of the present invention, it is possible to obtain a low-stress epoxy resin composition that has excellent moldability, moisture resistance, and crack resistance when subjected to thermal shock. especially,
In today's world, where it is expected that dantic packaging will become more and more popular in semiconductor encapsulation applications, and where plastics are required to have lower stress, the present invention will play an extremely important role in industry.

〔Example〕

The following is an explanation using a study example of a molding material for semiconductor encapsulation. All parts used in the examples are parts by weight. The examples according to the present invention are superior to the comparative examples according to the prior art in terms of moldability, moisture resistance and crack resistance, and have high added value that can be used industrially.

The polyalkylene glycol diglycidyl ether used in this example is as follows.

A: Polypropylene glycol diglycidyl ether (
Epoxy equivalent [190, viscosity 45 cps) B: Polypropylene glycol diglycidyl ether (epoxy equivalent 320, viscosity 75 cps) C: yt! I) Polymer glycol diglycidyl coneef.

(epoxy equivalent f150, viscosity 25 cps) D: Polyethylene glycol diglycidyl ether (epoxy equivalent 285, viscosity 180 cps) Examples 1 to 6 70 parts of fused silica (LTI Mori) and a surface treatment agent (Nippon Unicar A-186) ) and polyalkylene glycol diglycidyl ethers A, B, and CSD in the weight parts shown in the table were added and mixed in a mixer. Additionally, 20 parts of epoxy resin (Asahi Ciba: ECN-1273), 10 parts of phenol novolac (manufactured by Sumitomo Bakelite), and 0.
After mixing, 2 parts of pigment (Mitsubishi Kasei), 0.5 part of pigment (Mitsubishi Kasei), and 0.4 part of mold release agent (Hoechst Japan: Hechs OP/Hoechst 5 = 171) were mixed, kneaded in a co-kneader to form five types of epoxy resin compositions. Obtained. As a result of measuring the moldability and crack resistance of these molding materials, it was found that they were superior to the comparative examples as shown in the table. Moreover, the more polyalkylene glycol diglycidyl ether is added, the better the crack resistance is, but when it is too much, the moldability is poor.

Comparative Example: 70 parts of fused silica, 20 parts of epoxy resin, 10 parts of phenol novolak, 0.4 part of surface treatment agent, 0 part of curing accelerator.
2 parts of pigment, 0.5 part of pigment, and 0.4 part of mold release agent (all the same raw materials as in Examples) were mixed and kneaded in a co-kneader to obtain an epoxy resin composition. As shown in the table, the moldability, crack resistance, and moisture resistance of this molding material are significantly inferior to those of the Examples.

1.

*1.16 Determine the degree of paring on the lead bin when molding pin DIP When the distance to a part of the tie bar is less than ζ: A1 to No. B1X to 9: C1 or more (exceeds the tie bar) D *2 TCT, 16 pin DIP sealed with a simulated element of size 4 yz x 9 tea at -65°C
(30 minutes), sato temperature (5 minutes), = 150℃ (30 minutes) thermal shock was applied for 200 cycles and determined by the number of cracks generated/total number *3TST, a simulated element with a size of 4 m x 6 ■ was sealed. The 16 pin DIF was subjected to 200 cycles of thermal shock at -165°C (2 minutes) and -150'C (2 minutes), and judged by the number of cracks generated/Wg number *4 Moisture resistance, aluminum simulated element was sealed. 1 6 pin
DxP for 1000hr at 135℃ and 100'e
Judgment based on defective rate/total number due to storage aluminum corrosion Patent issued Sumitomo Bakelite Co., Ltd.

Claims (1)

[Claims] 0 polyalkylene glycol diglycidyl ether
．． An epoxy resin composition for semiconductor encapsulation characterized by containing 1 to 5% by weight.