JPH05259316A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To improve mold release characteristics from a mold of a cured substance and heat resistance by using an epoxy resin manufactured by epoxidizing the condensate of alkylphenols and hydroxybenzaldehyde for sealing. CONSTITUTION:A semiconductor element is sealed with an epoxy resin composition employing (a) an epoxy resin shown in formula, (where R<1>, R<2> R<3> and R<4> represent hydrogen or an alkyl group, and n>=0 holds.) (b) a curing agent, (c) fillers, (d) a mold release agent as essential ingredients as a sealing resin. Accordingly, mold release characteristics from a mold of a cured substance and heat resistance can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an epoxy resin composition.

[0002]

2. Description of the Related Art In recent years, in the field of resin-encapsulated semiconductor devices, miniaturization of each functional unit on the element and increase in size of the element itself have been rapidly advancing along with high integration of semiconductor elements.
Further, when mounting a gate array called ASIC (Application Specific IC) or a surface mount type package represented by a standard cell type LSI, processes such as vapor phase reflow, infrared reflow and solder dipping are adopted. There is. Thus, in these processes, the package is exposed to high temperature (215 to 260 ° C.),
In a conventional resin-encapsulated semiconductor device that has been encapsulated with a conventional encapsulating resin, a small amount of water that has penetrated into the resin and invades into the inside of the semiconductor device rapidly evaporates, causing cracks in the resin. As a result, when the crack reaches the outside, there is a big problem that the moisture resistance reliability cannot be guaranteed. In addition, the phenomenon that the resin cannot be mounted due to swelling of the resin occurs. Further, PSG (phosphosilicate glass) or SiN (silicon nitride) used as a passivation film for a wiring layer made of aluminum or the like often has problems such as cracks or disconnection of Au bonding wires. As a measure against these problems,

1) The stress of the encapsulating resin with respect to the internal enclosure is reduced, and the PS of the encapsulating resin and the surface of the semiconductor element is reduced.
Improve adhesion with G, SiN, polyimide film and lead frame. 2) To impart high-temperature strength and moisture absorption strength corresponding to the mounting temperature to the sealing resin and reduce the amount of moisture absorption. The demands such as are increasing mainly in the resin-encapsulated semiconductor device of a large package.

From such a viewpoint, recently, a highly heat-resistant sealing resin using a polyfunctional epoxy resin or a polyfunctional phenol resin curing agent has been proposed. However, these encapsulating resins have a problem that the release property of the cured product from the mold is poor. This problem can be solved by adding a sufficient amount of the release agent, but this reduces the adhesion between the cured product and the semiconductor element or the lead frame. As a result, the resin-encapsulated semiconductor device encapsulated with the encapsulating resin has a problem that package cracks are likely to occur in the mounting process and the moisture resistance reliability is poor.

[0005]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention that a cured product as a sealing resin has excellent mold releasability from a mold and is excellent. Another object of the present invention is to provide a resin-encapsulated semiconductor device excellent in package crack resistance and moisture resistance reliability by using an epoxy resin composition improved to have excellent heat resistance.

[0006]

According to the present invention, in a resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin, the encapsulating resin is represented by the following general formula (I). Epoxy resin,

[0007]

[Chemical 2] (However, R ¹ , R ² , R ³ and R ⁴ represent hydrogen or an alkyl group, and n ≧ 0.) (B) Curing agent, (c) Filler, (d) Release agent,

The present invention relates to a resin-encapsulated semiconductor device, which is an epoxy resin composition containing as essential components, wherein the release agent comprises three components of an ester wax, an oxidized paraffin wax and an olefin wax. ..
Hereinafter, the present invention will be described in more detail.

The epoxy resin, which is the component (a) of the encapsulating resin used in the present invention, is represented by the general formula (I), and is prepared by, for example, epoxidizing a condensate of an alkylphenol and hydroxybenzaldehyde. Manufactured. That is, first, a known reaction for synthesizing novolac is applied, and an alkylphenol and a hydroxy group are reacted with an inorganic acid such as hydrochloric acid or sulfuric acid, an acetic acid, an organic acid such as p-toluenesulfonic acid or thioglycolic acid, or an acidic catalyst such as a Lewis acid. Benzaldehyde is condensed at 30-180 ° C. Next, the obtained condensate may be reacted with epichlorohydrin in the presence of an alkali metal hydroxide such as caustic soda to epoxidize the condensate. Further, such an epoxy resin according to the present invention may contain an epoxy resin represented by the following general formula (II) which is produced by the reaction of some epoxy resins with each other. In the invention, the epoxy resin may contain such an epoxy resin represented by the general formula (II). However, when the content of the epoxy resin represented by the general formula (II) is large, the properties of the obtained epoxy resin composition may deteriorate. Therefore, the epoxy resin represented by the general formula (I) according to the present invention has such a general formula (I)
It is desirable to use a resin having a low content of the epoxy resin represented by I).

[0010]

[Chemical 3] (However, R ¹ , R ² , R ³ , and R ⁴ represent hydrogen or an alkyl group, and n ≧ 0.

The following are specific examples of the epoxy resin represented by the general formula (I). ESX-221
(Sumitomo Chemical Co., Ltd., softening temperature: 85 ° C., epoxy resin equivalent: 213) YL-6080 (Oilized Shell Epoxy Co., Ltd., softening temperature: 90 ° C., epoxy resin equivalent 200) YL-6217 (Oilized Shell Epoxy Co., Ltd., softening temperature: 90 ° C, epoxy resin equivalent 210), etc.

Further, in the present invention, an epoxy resin other than the epoxy resin represented by the general formula (I) can be used in combination. Such an epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule, and can be appropriately used in combination as long as the effect of the present invention is not impaired. Specific examples include phenol novolac type epoxy resin, cresol novolac type epoxy resin, naphthol novolac type epoxy resin, bisphenol A novolac type epoxy resin, and tetrakis (hydroxyphenyl) alkane epoxidized product. In the present invention, it is possible to use one or more of these.

Further, in the present invention, a phenol resin is a preferable component as the curing agent which is the component (b) of the encapsulating resin, and a phenol resin represented by the following general formula (III) is particularly preferable.

[0014]

[Chemical 4]

However, R ¹ and R ² are hydrogen or have 1 to 20 carbon atoms.
Represents an alkyl group and may be the same or different. R
³ represents a single bond or an alkylene group such as methylene or ethylene.

In the present invention, the phenolic resin represented by the general formula (III) is, for example, a condensate obtained from the condensation reaction of phenols and hydroxybenzaldehyde. Specific examples of the phenol resin include the following. YL-6065 (Yukaka Shell Epoxy Co., Ltd., softening temperature 112 ° C., hydroxyl equivalent 98)

OTM-486 (Showa Highpolymer Co., Ltd., softening temperature 120
C, hydroxyl equivalent 98) OTM-488 (Showa Highpolymer Co., Ltd., softening temperature 125
C, hydroxyl equivalent 98) OTM-489 (Showa Highpolymer Co., Ltd., softening temperature 123
C, hydroxyl equivalent 98) PC-7004 (Sumitomo Chemical Co., Ltd., softening temperature 140
C., hydroxyl group equivalent 129) YL-6100 (produced by Yuka Shell Epoxy Co., Ltd., softening temperature 101.degree. C., hydroxyl group equivalent 107) and the like.

Further, the compound represented by the general formula (II
The phenol resin other than the above-mentioned phenol resin represented by I) is not particularly limited as long as it has two or more phenolic hydroxyl groups in one molecule. Such a phenol resin can be appropriately used within a range that does not impair the effects of the present invention, but is preferably used in combination with the phenol resin represented by the general formula (III). Specifically, phenol novolac resin, cresol novolac resin,
Examples thereof include naphthol novolac resin, bisphenol A novolac resin, phenol aralkyl resin, and terpene phenol resin. In the present invention, one of these
It is possible to use one species or two or more species.

The blending amount of the phenol resin as the curing agent is set so that the ratio of the phenolic hydroxyl group in the phenol resin to the epoxy group in the epoxy resin is in the range of 0.5 to 1.5. Preferably. This is because if the ratio as described above is less than 0.5, the strength of the resulting sealing resin may decrease, and if it exceeds 1.5, the moisture resistance of the sealing resin may decrease. .. Further, it is more preferable to blend the phenol resin so that the numbers of the phenolic hydroxyl group and the epoxy group as described above are stoichiometrically equal.

Further, in the present invention, the curing agent as the component (b) is not limited to the above-mentioned phenol resin, and acid anhydride, diamine and the like can be used.

As the filler which is the component (c) of the encapsulating resin according to the present invention, for example, an inorganic filler can be used. Specifically, crushed or spherical powders and fibers of quartz, fused silica, titanium oxide, silicon nitride, aluminum nitride, talc, alumina, hydrated alumina, glass, antimony oxide, boron nitride, calcium silicate, ceramics, etc. , Whiskers, microballoons and the like. The compounding amount of such an inorganic filler is not particularly limited, but is usually preferably in the range of about 40 to 75 vol% in the encapsulating resin. This is because if it is less than 40 vol%, the thermal expansion coefficient of the encapsulating resin becomes large, so that the thermal shock resistance is lowered, while if it exceeds 75 vol%, the fluidity is lowered and as a result, the moldability is lowered.

Further, in the present invention, three components of an ester wax, an oxidized paraffin wax and an olefin wax are blended as a release agent which is the component (d) of the sealing resin. The above three components will be described in detail below. The ester wax is an ester obtained by reacting a monovalent higher fatty acid with a monovalent higher alcohol.
As a specific example, carnauba wax (Soekawa Rikagaku Co., Ltd., ester of cerotic acid and myricyl alcohol, melting point 87 ° C., acid value 2 to
6, saponification value 83) and the like. Oxidized paraffin wax is a higher alcohol, a higher fatty acid, obtained by oxidizing a hydrocarbon,
It is a mixture of esters. As a specific example, LUVAX-0321 (Nippon Seiro Co., Ltd., melting point 75)
C., a molecular weight of about 800, an acid value of 12, a saponification value of 30, a hydroxy value of 80) and the like.

The olefin wax has a molecular weight of 500-500.
The low molecular weight polyethylene and the low molecular weight polypropylene of 5000 are preferable, and those which are oxidized or acid-modified with an acid anhydride are particularly preferable. The following are specific examples, but the release agent is not limited to these. (1) Oxidized polyethylene wax HW-4252E (Mitsui Petrochemical Co., Ltd., melting point 93 ° C.,
Molecular weight about 3000, acid value 17) HW-4202E (Mitsui Petrochemical Co., Ltd., melting point 101)
C, molecular weight about 2500, acid value 17) HW-4052E (Mitsui Petrochemical Co., Ltd., melting point 110)
C, molecular weight about 3200, acid value 20) E-300 (Sanyo Kasei Co., Ltd., melting point 104 ° C., molecular weight about 3000, acid value 22) E-250P (Sanyo Kasei Co., melting point 104 ° C., molecular weight about 2000, Acid value 20) PAD-521 (Hoechst Japan KK, melting point 10
4 ° C, molecular weight about 2000 acid value 16) PAD-522 (Hoechst Japan KK, melting point 10
4 ° C, molecular weight about 2000 acid value 25) etc. (2) Oxidized polypropylene wax TS-200 (Sanyo Kasei Co., Ltd., melting point 145 ° C., molecular weight about 3500, acid value 3.5) and the like. (3) Acid-modified polyethylene wax HW-1105A (Mitsui Petrochemical Co., Ltd., melting point 104)
° C, molecular weight about 1500, acid value 60) and the like.

The compounding amount of the releasing agent is 0.3 to 0.8% by weight in the epoxy resin composition, and 1.5 to 4.5% by weight based on the total amount of the epoxy resin and the curing agent. It is preferable to set so that This is because if the compounding amount of the mold release agent is less than the above range, sufficient mold releasability cannot be obtained, and if it exceeds the above range, the mold may be contaminated during molding, or the sealing resin and the semiconductor. This is because the adhesiveness between the element and the lead frame is deteriorated and the moisture resistance reliability of the resin-sealed semiconductor device obtained may be deteriorated. Further, FIG. 1 shows a preferable blending ratio of the three components used as the release agent. As shown, an ester wax in the total release agent,
When the compounding ratios of the oxidized paraffin wax and the olefin wax are x (wt%), y (wt%), and z (wt%), respectively: a: x = 30, y = 67, z = 3 b: x = 92, y = 5, z = 3 c: x = 75, y = 5, z = 20 d: x = 30, y = 50, z = 20

The preferred range is on and inside the line connecting the points represented by. This is because when the mixing ratio of the three components is outside the line segments ab and bc in the ternary diagram shown in FIG. 1, the effect of improving the releasability of the cured product from the mold is small, and the line segment cd
This is because the package crack resistance may be insufficient if it is outside of and da.

Further, in the epoxy resin composition used as the encapsulating resin in the present invention, an appropriate curing accelerator may be added and blended in order to accelerate the curing reaction between the epoxy resin and the curing agent. Specific examples of such a curing accelerator include imidazoles, amine compounds, diazabicycloalkenes or salts thereof, and organic phosphines as shown below. <Imidazoles>

Imidazole, 2-methylimidazole,
2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-ethyl-4
-Methylimidazole, 2-phenylimidazole, 2
-Phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole, 2-phenyl-4
-Methylimidazole, 1-vinyl-2-methylimidazole and the like. <Amine compound>

Triethylamine, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, N-aminoethylpyrazine, bis (4-amino-3-methylcyclohexane) methane, metaxylyleneamine, methanediamine, 3,9-bis (3- Aminopropyl) -2,4,8,10-tetraoxospiro [5,5] undecane and the like. <Diazabicycloalkenes or salts thereof> 1,8-diazabicyclo [5,4,0] undec-7-ene and salts thereof and the like. <Organic phosphines> Triphenylphosphine, tricyclohexylphosphine, tri (3,5-dimethylphenyl) phosphine and the like.

In the present invention, imidazoles are effective among the above compounds from the viewpoints of heat resistance, curability and moisture resistance. When the imidazoles are blended, the blending amount thereof is preferably 0.5 to 5% by weight based on the total amount of the epoxy resin and the curing agent. This is because if it is less than 0.5% by weight, the curing rate is slow and if it exceeds 5% by weight, the properties of the cured product deteriorate.

Further, in the present invention, a halogenated epoxy resin may be contained in the above epoxy resin composition as a flame retardant imparting agent. Such a halogenated epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule and contains halogen atoms such as bromine and chlorine, and examples thereof include bisphenol type epoxy resin and novolac. A bromide of a type epoxy resin can be used, preferably a brominated bisphenol type epoxy resin or a brominated novolac type epoxy resin having a bromine content of 20% by weight or more, and more preferably 40% by weight or more of a brominated bisphenol type epoxy. Resin is used. Specific examples of the halogenated epoxy resin are as follows. AER-735 (bromine content 48% by weight, epoxy equivalent 350, softening point semi-solid, bisphenol type, manufactured by Asahi Chemical Industry Co., Ltd.) AER-745 (bromine content 48% by weight, epoxy equivalent 400, softening point 71 ° C., Bisphenol type, Asahi Kasei Kogyo Co., Ltd. AER-755 (bromine content 48% by weight, epoxy equivalent 460, softening point 81 ° C., bisphenol type, Asahi Kasei Co., Ltd.) AER-765 (bromine content 50% by weight) , Epoxy equivalent 602, softening point 101 ° C., bisphenol type, manufactured by Asahi Kasei Co., Ltd. BREN (bromine content 36% by weight, epoxy equivalent 285, softening point 85 ° C., phenol novolac type, manufactured by Nippon Kayaku Co., Ltd.) BREN-S (bromine content 36% by weight, epoxy equivalent 289, softening point 88 ° C., phenol novolac type, Nippon Kayaku Co., Ltd. ) Br-modified EPPN500 (bromine content 44% by weight, epoxy equivalent 285, softening point 94 ° C., novolac type, manufactured by Nippon Kayaku Co., Ltd.) AER-711 (bromine content 20% by weight, epoxy equivalent 480, softening point 74) ℃, bisphenol type, Asahi Kasei Co., Ltd. Epicron 152 (bromine content 46% by weight, epoxy equivalent 360, softening point 55 ℃, phenol novolac type, Dainippon Ink and Chemicals, Inc.) Epicron 1120 (bromine content 20% by weight, epoxy equivalent 480, softening point 75 ° C, Dainippon Ink and Chemicals, Inc.
Made)

Further, in the epoxy resin composition used as the encapsulating resin in the present invention, in addition to the above components, flame retardants such as antimony and phosphorus, carbon black, titanium dioxide, coloring agents such as dyes, silane and the like. A surface treatment agent for a filler such as a titanium coupling agent, silicone oil, silicone rubber, various plastic powders, various engineering plastic powders, a stress reducing agent such as ABS resin or MBS resin powder, and the like may be appropriately added and blended. Good.

Such an epoxy resin composition is melt-kneaded by a heating roll, solvent kneaded by a kneader, melt-kneaded by an extruder, mixed by a special mixer after crushing,
And it can be easily prepared by a suitable combination of these respective methods.

The resin-encapsulated semiconductor device of the present invention is obtained by encapsulating a semiconductor element assembled by using the above-mentioned epoxy resin composition, for example, using a lead frame. The most common method of resin sealing is low-pressure transfer molding, but resin sealing by injection molding, compression molding, casting or the like is also possible. The epoxy resin composition is heated and cured during resin encapsulation, and finally a resin-encapsulated semiconductor device encapsulated by the cured product can be obtained. Also, when curing the composition, 160
It is preferable to heat to ℃ or more. The semiconductor element sealed with the epoxy resin composition of the present invention is not particularly limited. Further, the type of package is not particularly limited, and not only the surface mount type package but also DIP, QI
It may be a package such as P.

[0034]

According to the present invention, the release agent composed of the above-mentioned three components is blended, so that the mold is not stained by the bleed of the release agent and the releasability from the mold is greatly improved. Furthermore, since the adhesiveness between the semiconductor element and the lead frame does not deteriorate, the resin-sealed semiconductor device of the present invention has no package cracks in the mounting process and has excellent moisture resistance reliability. Moreover, since the release property of the cured product of the resin composition from the mold is good, the resin-sealed semiconductor device can be easily manufactured.

[0035]

EXAMPLES The present invention will be described in detail below with reference to examples. <Examples 1 to 14 and Comparative Examples 1 to 5>

The components shown in Tables 1 to 4 were mixed in the proportions shown in the same table to obtain an epoxy resin composition (the compounding amount in the table shows parts by weight). That is, after the filler was treated with the surface treatment agent in a Henschel mixer, the respective components were mixed and kneaded with a heating roll at 60 to 130 ° C. After cooling, it was pulverized to prepare each epoxy resin composition.

[0037]

[Table 1]

[0038]

[Table 2]

[0039]

[Table 3]

[0040]

[Table 4] Each component shown in Tables 1 to 4 will be described below. Epoxy resin A: ESX-221 (epoxy resin equivalent 213, softening temperature 85 ° C. polyfunctional epoxy resin, Sumitomo Chemical Co., Ltd.) Epoxy resin B: ESCN-195XL (epoxy resin equivalent 197, softening temperature 75 ° C., cresol novolac type) Epoxy resin, manufactured by Sumitomo Chemical Co., Ltd.

Epoxy resin C: AER-755 (epoxy resin equivalent 460, softening temperature 81 ° C bisphenol type, bromine content 48% by weight, manufactured by Asahi Kasei Corporation) Phenolic resin A: YL-6065 (hydroxyl equivalent 9
8, softening temperature 120 ℃, tris (hydroxyphenyl)
Methane, Yuka Shell Epoxy Co., Ltd.)

Phenolic resin B: YL-6100 (hydroxyl group equivalent 10
7, softening temperature 101 ° C., bis (hydroxymethylphenyl) hydroxyphenylmethane petrochemical shell epoxy Co., Ltd. Phenolic resin C: BRG-556 (hydroxyl equivalent 10
4, softening temperature 85 ° C., phenol novolac resin, Showa Highpolymer Co., Ltd. Curing accelerator: C ₁₇ Z (heptadecyl imidazole, Shikoku Kasei Co., Ltd.) Filler: fused silica powder (average particle size 20 μm, Crushed,
Toshiba Ceramics Co., Ltd. Low Stress Agent A: BTA-731 (Methylmethacrylate / Butadiene / Styrene / Copolymer, Kureha Chemical Industry Co., Ltd.) Low Stress Agent B: TSJ-3051 (additional heat curing) Type silicone gel, viscosity 1000 cP at 25 ° C., manufactured by Toshiba Silicone Co., Ltd. Release agent A: Carnauba No. 1 (ester wax, melting point 87 ° C., acid value 2-6, ken number 83, Soekawa Rikagaku Co., Ltd.)
Made)

Release Agent B: Rubacs No. 0321 (Oxidized paraffin wax, melting point 75 ° C., molecular weight about 800, acid value 12, saponity value 30, hydroxy value 80, manufactured by Nippon Seiro Co., Ltd.) Release Agent C: HW -4252E (oxidation-modified polyethylene wax, melting point 93 ° C., molecular weight about 3000, acid value 17,
Mitsui Petrochemical Co., Ltd. release agent D: E-250P (oxidation-modified polyethylene wax, melting point 104 ° C., molecular weight about 2000, acid value 20, Sanyo Chemical Co., Ltd. release agent E: HW-2203A ( Oxidation-modified polyethylene wax, melting point 107 ° C, molecular weight about 2700, acid value 30,
Mitsui Petrochemical Co., Ltd. release agent F: TS-200 (oxidation-modified polypropylene wax, melting point 145 ° C., molecular weight about 3500, acid value 3.
5, Sanyo Kasei Co., Ltd.) Flame retardant: Antimony trioxide (Mikuni Seiren Co., Ltd.) Surface treatment agent: A-187 (γ-glycidoxypropyltrimethoxysilane, Nippon Unicar Co., Ltd.) Colorant: CB # 30 (carbon black, manufactured by Mitsubishi Kasei Co., Ltd.)

Next, with respect to these epoxy resin compositions, the adhesiveness with the lead frame made of 42 alloy when the semiconductor element was sealed by the methods shown in 1) to 3) below, and the residual rate of the die of the lead frame were obtained. , And the crack occurrence rate after VPS treatment was examined. 1) Adhesion with 42 alloy lead frame

42 alloy lead frame surface 4 mm
After forming the molded body of each composition on ² , the molded body is 175
A test piece was prepared by after-curing at 8 ° C. for 8 hours. Next, for each test piece, 16 at a temperature of 85 ° C and a humidity of 85%
After moisture absorption treatment for 8 hours, the adhesive strength between the molded body and the 42 alloy lead frame was measured. The results are shown in Tables 1 to 4. 2) Mold remaining rate of lead frame

As an evaluation of releasability, each composition was used to seal a lead frame at a molding temperature of 175 ° C. for a molding time of 2 minutes by a low-pressure transfer molding machine. For each composition, 50 shots were formed, and the ratio of the lead frame remaining in the mold after the usual demolding operation was examined. The results are shown in Tables 1 to 4. 3) Crack occurrence rate after VPS treatment

Using each composition, a low pressure transfer molding machine was used to seal a semiconductor element having a chip size of 15 mm at a molding temperature of 175 ° C. for a molding time of 2 minutes, and then at 175 ° C. for 8 minutes.
184-pin flat package after time cure
A resin-encapsulated semiconductor device of D. was manufactured. This is temperature 85
After absorbing moisture for 168 hours at ℃ and humidity of 60%, 215 ℃
Vapor phase flow (VPS) treatment at
The occurrence rate of defective products was investigated by observing the occurrence of cracks reaching the outside immediately after the VPS treatment. Further, a humidity resistance reliability test was conducted in a pressure cooker at a temperature of 121 ° C. and a pressure of 2 atm to examine the incidence of defective products. The results are also shown in Tables 1 to 4.

As is clear from Tables 1 to 4, Examples 1 to 1
The epoxy resin composition of 14 has a good adhesive strength between the molded body and the lead frame made of 42 alloy, and has good releasability without leaving a lead frame in the mold. Furthermore, the resin-encapsulated semiconductor devices of Examples 1 to 14 encapsulated with the epoxy resin composition have no cracks in the package even by the VPS treatment, and have excellent performance in the subsequent moisture resistance reliability test. It can be confirmed that As a result, it can be seen that the resin-encapsulated semiconductor devices of Examples 1 to 14 have excellent moisture resistance reliability.

[0049]

As described above, according to the present invention, the epoxy resin composition, which has a good releasing property from the mold of the cured product and is excellent in the adhesiveness to the lead frame, is used as the sealing resin. Therefore, it is possible to provide a resin-encapsulated semiconductor device that is easy to manufacture, has excellent moisture resistance reliability, and as a result can be sufficiently used as a large surface-mount package.

[Brief description of drawings]

FIG. 1 is a ternary diagram showing a preferable blending ratio of three components used as a release agent in a sealing resin according to the present invention.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location C08L 63/00 NJM 8830-4J

Claims (1)

[Claims] 1. A resin-encapsulated semiconductor device in which a semiconductor element is encapsulated with an encapsulating resin, wherein the encapsulating resin is (a) an epoxy resin represented by the following general formula (I): 1] (However, R ¹ , R ² , R ³ and R ⁴ represent hydrogen or an alkyl group, and n ≧ 0.) (B) curing agent, (c) filler, (d) release agent An epoxy resin composition as an essential component, wherein the release agent is an ester wax, oxidized paraffin wax,
And a resin-encapsulated semiconductor device comprising three components of an olefin wax.