JPS61168618A - Epoxy resin composition for semiconductor sealing - Google Patents

Abstract

PURPOSE:A low-stress epoxy resin composition for semiconductor sealing excellent in moldability, moisture resistance and resistance to crack by heat shock, etc., comprising a specified epoxy resin, a curing agent, a cure accelerator, a filler, etc. CONSTITUTION:The desired epoxy resin composition for semiconductor sealing is obtained by adding a curing agent, a cure accelerator, a filler, a mold release, a surface treating agent, etc., to an epoxy resin entirely or partially consisting of an epoxy resin of the formula (wherein R is H, an alkyl or a halogen such as Cl or Br and n is 0-15).

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a low stress Nyxy resin composition for semiconductor encapsulation which has excellent reliability.

[Prior art]

In recent years, advances in semiconductor-related technology have been remarkable, and the degree of integration of LSIs has been steadily improving, with interconnections becoming finer and chip sizes becoming larger.

This trend has aggravated failures such as deformation of the M wiring in resin-sealed LSIs, cracks in the space 1, and resin cracks. In order to solve these problems, there is currently a strong demand for lower stress in semiconductor encapsulating resins.

Nixi resin compositions are widely used for semiconductor encapsulation because they have better moisture resistance than phenolic resin compositions and ester resin compositions. Conventionally, ortho-cresol novolak eixy resin has been used as nixy resin for semiconductor encapsulation, but as long as this resin is used, there is a limit to the reduction in stress of the resin. In addition, in order to obtain a low-resistance carboxy resin composition, the use of synthetic rubber (Japanese Unexamined Patent Publication No. 58-1
76958, JP-A-57-180626, JP-A-58
-174416'') and the use of silicones (JP-A-58-210920, JP-A-57-3821) have been studied, but all of them have problems with moldability (particularly hardenability, Paris).

There were problems such as poor mold releasability and deterioration of the moisture resistance of Eixy resin.

[Purpose of the invention]

The present invention was developed as a result of research aimed at obtaining a low-stress epoxy resin for semiconductor encapsulation with excellent reliability, which could not be obtained by using conventional ortho-cresol novolac emexy resins. Represents atoms, alkyl groups, halogens such as chlorine, bromine, etc. (n represents an integer from 0 to 15). , excellent moisture resistance,
It has been discovered that a low stress epoxy resin composition having excellent crack resistance when subjected to thermal shock can be obtained.

[Structure of the invention]

In the present invention, an epixy resin represented by the general formula (wherein R represents a hydrogen atom, an alkyl group, a halogen such as chlorine or bromine, etc., and n represents an integer from O to 15) Alternatively, it is an Eixy resin composition for semiconductor encapsulation, which is characterized in that it is used as a part of Nyxy resin, a curing agent, a curing accelerator, a filler, a mold release agent, a surface treatment agent, and the like.

The Nyxy resin represented by the general formula above is a multifunctional Axy resin that has a flexible structure in its molecules, and by using this resin, it has a high crosslinking density, small dimensional change when cold, and flexibility. It is possible to obtain an eixi resin composition that gives a rich eixi resin molded article.

By adjusting the amount of such Eixy resin used, the characteristics of the low-resistance Crab I xy resin can be maximized. In order to obtain the effect of low stress, it is preferable to use Eixy resin in an amount of 50 weight or more, more preferably 70 weight or more.

Further, n is preferably θ to 5, more preferably 3 to 4.

The curing agent mentioned here is preferably phenol novolacs, but may also include acid anhydrides and amines. These may be used alone or in combination. Phenol novolacs refer to all compounds containing a phenolic hydroxyl group or a derivative thereof in the novolak skeleton. It includes not only single-component novolacs of phenols (7-enol, 'alkylphenol, resorcinol, etc.), but also co-condensed novolacs of any combination of phenols, and co-condensed novolacs of phenols and other resins.

Moreover, the epoxy resin referred to herein refers to all resins having an edoxy group. For example, it refers to bisphenol type epoxy resin, novolac type epoxy resin, triazine core-containing neixy resin, etc.

〔Effect of the invention〕

According to the method of the present invention, it is possible to obtain a low-resistance resin composition having excellent moldability, moisture resistance, and crack resistance when subjected to thermal shock. especially,
In the future, it is expected that plastic packaging will be used more and more in semiconductor encapsulation applications, and as a result, there is a demand for lower stress in plastics, so the present invention plays a very important role in industry.

〔Example〕

The following is an explanation using a study example of a molding material for semiconductor encapsulation. The departments used in the example are all departments with major responsibilities. The examples according to the present invention are superior in moldability, moisture resistance, and crack resistance compared to comparative examples according to the prior art, and have high added value that can be used industrially.

The epixy resins used in the examples are as follows.

Epoxy resin A: DCE-400 (manufactured by 1 Yokokusaku) Group) Epixy equivalent: 310 f/ef Softening point: 65°C Examples 1 to 4 70 parts of fused silica (prefix M) and surface treatment agent (Nippon Unicar A-186) 0.4 part was added and mixed using a mixer. Furthermore, X part of Niexy resin A, ortho-cresol novolac epixy resin (Asahi Ciba: ECN-1273-) 2
0-X part, 10 parts of phenol novolac (made by custom Bakelite), curing accelerator (K.I.
Shikoku Kasei 2MZ = 9/1) 0.2 parts, pigment (Mitsubishi Kasei) 05 parts, mold release agent (Hoechst Janone Hoechst O
F/hex)S=1/1) 0.4 part was added and mixed, and then kneaded in a co-kneader to obtain four types of niboxy resin compositions. As a result of measuring the moldability and shoe resistance of these molding materials, it was found that they were superior to the comparative examples as shown in the table. It was also found that the greater the amount of epixy resin A used, the better the crack resistance.

Comparative Example 1 70 parts of fused silica, 20 parts of orthocresol novolak emexy resin, 10 parts of phenol novolac, 4 parts of surface treatment agent α, 0.2 parts of curing accelerator, 0.5 parts of pigment, 0.4 parts of mold release agent ( The same raw materials as in the examples) were made into materials in the same manner as in the examples. The moldability, crack resistance, and
The moisture resistance results are shown in the table, and the crack resistance is significantly inferior to that of the Examples.

Comparative Example 2 70 parts of fused silica, 064 parts of surface treatment agent, 2 parts of carboxyl group-containing acrylonitrile-butadiene copolymer (Hiker CTBN 1300 X 8), 20 parts of ortho-cresol novolak epixy resin, 10 parts of phenol novolac, 0.0 parts of pigment. 5 parts of curing accelerator, 0.2 part of curing accelerator, and 0.4 part of mold release agent were prepared in the same manner as in the example. The results of the moldability, crack resistance, and moisture resistance of this material are shown in the table, and the results show that the material is significantly inferior to the Examples in terms of moldability and moisture resistance.

*1.16 When molding pin DIP, judge the degree of occurrence of paris on the lead bin.A when the distance to a part of the tie bar is 3 or less, 200 cycles of thermal shock: D Judging by the number of cracks generated/total number *3TST, 16 pln DIP sealed with a simulated element of size 4s + x 65w + -165℃ (2 minutes)
200 cycles of thermal shock:
Store DTP at 135℃ and 100% condition for 1000 hours and judge by defect rate/total number due to aluminum corrosion

Claims (1)

[Claims] General formula ▲ Numerical formula, chemical formula, table, etc. ▼ (In the formula, R represents a hydrogen atom, an alkyl group, halogen such as chlorine, bromine, etc. Also, n represents an integer from 0 to 15. An epoxy for semiconductor encapsulation consisting of an epoxy resin, a curing agent, a curing accelerator, a filler, a mold release agent, a surface treatment agent, etc., characterized by using the epoxy resin shown in (.) as all or a part of the epoxy resin. Resin composition.