JPS6187892A - めつきした部品およびその製造方法 - Google Patents

めつきした部品およびその製造方法

Info

Publication number
JPS6187892A
JPS6187892A JP60209020A JP20902085A JPS6187892A JP S6187892 A JPS6187892 A JP S6187892A JP 60209020 A JP60209020 A JP 60209020A JP 20902085 A JP20902085 A JP 20902085A JP S6187892 A JPS6187892 A JP S6187892A
Authority
JP
Japan
Prior art keywords
layer
nickel
gold
based alloy
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60209020A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0240749B2 (enExample
Inventor
サミユエル　ダブリユ．レビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Allied Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Corp filed Critical Allied Corp
Publication of JPS6187892A publication Critical patent/JPS6187892A/ja
Publication of JPH0240749B2 publication Critical patent/JPH0240749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
JP60209020A 1984-09-26 1985-09-24 めつきした部品およびその製造方法 Granted JPS6187892A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US655002 1984-09-26
US06/655,002 US4601958A (en) 1984-09-26 1984-09-26 Plated parts and their production

Publications (2)

Publication Number Publication Date
JPS6187892A true JPS6187892A (ja) 1986-05-06
JPH0240749B2 JPH0240749B2 (enExample) 1990-09-13

Family

ID=24627095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60209020A Granted JPS6187892A (ja) 1984-09-26 1985-09-24 めつきした部品およびその製造方法

Country Status (5)

Country Link
US (1) US4601958A (enExample)
EP (1) EP0175901B1 (enExample)
JP (1) JPS6187892A (enExample)
CA (1) CA1279843C (enExample)
DE (1) DE3572136D1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011080796A (ja) * 2009-10-05 2011-04-21 Mitsubishi Electric Corp 半導体素子のパッケージおよびそのテストソケット
JPWO2013094766A1 (ja) * 2011-12-22 2015-04-27 オーエム産業株式会社 めっき品及びその製造方法
WO2015129418A1 (ja) * 2014-02-25 2015-09-03 日立オートモティブシステムズ株式会社 防水型電子機器及びその製造方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737418A (en) * 1986-12-22 1988-04-12 Advanced Materials Technology Corp. Nickel clad corrosion resistant lid for semiconductor package
US4835067A (en) * 1988-01-21 1989-05-30 Electro Alloys Corp. Corrosion resistant electroplating process, and plated article
US4842961A (en) * 1988-03-04 1989-06-27 Advanced Materials Technology Corp. Alternate electrolytic/electroless-layered lid for electronics package
DE68923024T2 (de) * 1988-03-28 1995-11-02 Texas Instruments Inc Leiterrahmen mit verminderter Korrosion.
US5051317A (en) * 1990-01-03 1991-09-24 Krementz & Co. Inc. Multilayered electroplating process utilizing fine gold
WO1994024702A1 (en) * 1993-04-13 1994-10-27 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5532513A (en) * 1994-07-08 1996-07-02 Johnson Matthey Electronics, Inc. Metal-ceramic composite lid
WO1996002941A1 (en) * 1994-07-19 1996-02-01 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5744752A (en) * 1995-06-05 1998-04-28 International Business Machines Corporation Hermetic thin film metallized sealband for SCM and MCM-D modules
US5639014A (en) * 1995-07-05 1997-06-17 Johnson Matthey Electronics, Inc. Integral solder and plated sealing cover and method of making same
TW340139B (en) * 1995-09-16 1998-09-11 Moon Sung-Soo Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
FR2748754B1 (fr) * 1996-05-15 1998-07-10 Dassault Electronique Procede de metallisation d'un composite a matrice metallique et composite ainsi obtenu
US6390353B1 (en) 1998-01-06 2002-05-21 Williams Advanced Materials, Inc. Integral solder and plated sealing cover and method of making the same
WO2001063007A1 (en) * 2000-02-24 2001-08-30 Ibiden Co., Ltd. Nickel-gold plating exhibiting high resistance to corrosion
CA2313438C (en) 2000-07-06 2003-03-11 B-Con Engineering Inc. High quality optical surface and method of producing same
US7097897B1 (en) * 2000-08-07 2006-08-29 Illinois Tool Works Inc. Powder coated strap and method for making same
CN102544884B (zh) * 2011-12-23 2015-04-01 富士康(昆山)电脑接插件有限公司 电连接器、电连接器壳体及其表面处理的方法
DE102012004356B4 (de) 2012-03-07 2013-10-31 Umicore Galvanotechnik Gmbh Haftfeste, korrosionsbeständige technische Verchromung und Verfahren zur Herstellung derselben
DE102012012566B3 (de) 2012-06-23 2013-12-05 Audi Ag Verbundscheibe für einen Kraftwagen und Kraftwagen mit einer solchen Verbundscheibe.
CN108779566A (zh) 2016-02-16 2018-11-09 鲁米士德科技公司 含水介质中元素的电化学沉积
CA3065510A1 (en) 2017-06-01 2018-12-06 Lumishield Technologies Incorporated Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions
CN110977362B (zh) * 2019-12-26 2024-05-07 中国电子科技集团公司第五十八研究所 一种抗盐雾腐蚀的平行缝焊合金盖板及其制备方法
JP7395389B2 (ja) * 2020-03-09 2023-12-11 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2428033A (en) * 1941-11-24 1947-09-30 John S Nachtman Manufacture of rustproof electrolytic coatings for metal stock
US3199003A (en) * 1961-10-26 1965-08-03 Rca Corp Enclosure for semiconductor devices
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
NL281894A (enExample) * 1962-08-08
GB1031837A (en) * 1963-08-01 1966-06-02 Standard Telephones Cables Ltd Improvements in or relating to metal plating
US3823468A (en) * 1972-05-26 1974-07-16 N Hascoe Method of fabricating an hermetically sealed container
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
US3946190A (en) * 1972-05-26 1976-03-23 Semi-Alloys Incorporated Method of fabricating a sealing cover for an hermetically sealed container
US4284481A (en) * 1978-07-31 1981-08-18 Norman Hascoe Method of fabricating a metallic hermetic sealing cover for a container
US4243729A (en) * 1978-07-31 1981-01-06 Semi-Alloys, Inc. Metallic hermetic sealing cover for a container
DE2919404C2 (de) * 1979-05-14 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Gehäuse für Halbleiterbauelement
DD143673A1 (de) * 1979-05-16 1980-09-03 Lessig Hans Joerg Verfahren zur herstellung von zwischentraegern mit kontakthuegeln
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
EP0127857B1 (en) * 1983-05-28 1987-07-29 Masami Kobayashi Solderable stainless steel article and method for making same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011080796A (ja) * 2009-10-05 2011-04-21 Mitsubishi Electric Corp 半導体素子のパッケージおよびそのテストソケット
JPWO2013094766A1 (ja) * 2011-12-22 2015-04-27 オーエム産業株式会社 めっき品及びその製造方法
WO2015129418A1 (ja) * 2014-02-25 2015-09-03 日立オートモティブシステムズ株式会社 防水型電子機器及びその製造方法
JPWO2015129418A1 (ja) * 2014-02-25 2017-03-30 日立オートモティブシステムズ株式会社 防水型電子機器及びその製造方法
US9852962B2 (en) 2014-02-25 2017-12-26 Hitachi Automotive Systems, Ltd. Waterproof electronic device and manufacturing method thereof

Also Published As

Publication number Publication date
EP0175901A1 (en) 1986-04-02
US4601958A (en) 1986-07-22
JPH0240749B2 (enExample) 1990-09-13
CA1279843C (en) 1991-02-05
DE3572136D1 (en) 1989-09-14
EP0175901B1 (en) 1989-08-09

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