JPS6184840A - 電子部品封止成形装置 - Google Patents

電子部品封止成形装置

Info

Publication number
JPS6184840A
JPS6184840A JP20737184A JP20737184A JPS6184840A JP S6184840 A JPS6184840 A JP S6184840A JP 20737184 A JP20737184 A JP 20737184A JP 20737184 A JP20737184 A JP 20737184A JP S6184840 A JPS6184840 A JP S6184840A
Authority
JP
Japan
Prior art keywords
molding
lead frame
molded
plate
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20737184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325015B2 (enrdf_load_stackoverflow
Inventor
Teruyoshi Shibata
柴田　輝義
Hirokuni Mamiya
間宮　洋邦
Chuichi Nishikawa
西河　忠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP20737184A priority Critical patent/JPS6184840A/ja
Publication of JPS6184840A publication Critical patent/JPS6184840A/ja
Publication of JPH0325015B2 publication Critical patent/JPH0325015B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP20737184A 1984-10-03 1984-10-03 電子部品封止成形装置 Granted JPS6184840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20737184A JPS6184840A (ja) 1984-10-03 1984-10-03 電子部品封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20737184A JPS6184840A (ja) 1984-10-03 1984-10-03 電子部品封止成形装置

Publications (2)

Publication Number Publication Date
JPS6184840A true JPS6184840A (ja) 1986-04-30
JPH0325015B2 JPH0325015B2 (enrdf_load_stackoverflow) 1991-04-04

Family

ID=16538614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20737184A Granted JPS6184840A (ja) 1984-10-03 1984-10-03 電子部品封止成形装置

Country Status (1)

Country Link
JP (1) JPS6184840A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5440584A (en) * 1977-09-07 1979-03-30 Hitachi Ltd Temperature compensator circuit of hall element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5440584A (en) * 1977-09-07 1979-03-30 Hitachi Ltd Temperature compensator circuit of hall element

Also Published As

Publication number Publication date
JPH0325015B2 (enrdf_load_stackoverflow) 1991-04-04

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