JPH0325015B2 - - Google Patents
Info
- Publication number
- JPH0325015B2 JPH0325015B2 JP59207371A JP20737184A JPH0325015B2 JP H0325015 B2 JPH0325015 B2 JP H0325015B2 JP 59207371 A JP59207371 A JP 59207371A JP 20737184 A JP20737184 A JP 20737184A JP H0325015 B2 JPH0325015 B2 JP H0325015B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- molding
- mold
- plate
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20737184A JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20737184A JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6184840A JPS6184840A (ja) | 1986-04-30 |
JPH0325015B2 true JPH0325015B2 (enrdf_load_stackoverflow) | 1991-04-04 |
Family
ID=16538614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20737184A Granted JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6184840A (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5440584A (en) * | 1977-09-07 | 1979-03-30 | Hitachi Ltd | Temperature compensator circuit of hall element |
-
1984
- 1984-10-03 JP JP20737184A patent/JPS6184840A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6184840A (ja) | 1986-04-30 |
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