JPS6184047A - 樹脂封止形モジユ−ル - Google Patents

樹脂封止形モジユ−ル

Info

Publication number
JPS6184047A
JPS6184047A JP59205022A JP20502284A JPS6184047A JP S6184047 A JPS6184047 A JP S6184047A JP 59205022 A JP59205022 A JP 59205022A JP 20502284 A JP20502284 A JP 20502284A JP S6184047 A JPS6184047 A JP S6184047A
Authority
JP
Japan
Prior art keywords
signal terminal
cathode
gate
control electrode
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59205022A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0247109B2 (cs
Inventor
Masanori Nakatsuka
中司　正憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59205022A priority Critical patent/JPS6184047A/ja
Publication of JPS6184047A publication Critical patent/JPS6184047A/ja
Publication of JPH0247109B2 publication Critical patent/JPH0247109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
JP59205022A 1984-09-29 1984-09-29 樹脂封止形モジユ−ル Granted JPS6184047A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59205022A JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59205022A JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Publications (2)

Publication Number Publication Date
JPS6184047A true JPS6184047A (ja) 1986-04-28
JPH0247109B2 JPH0247109B2 (cs) 1990-10-18

Family

ID=16500144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59205022A Granted JPS6184047A (ja) 1984-09-29 1984-09-29 樹脂封止形モジユ−ル

Country Status (1)

Country Link
JP (1) JPS6184047A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235658A (ja) * 1985-08-09 1987-02-16 Fuji Electric Co Ltd 半導体装置
EP0609528A1 (en) * 1993-02-01 1994-08-10 Motorola, Inc. Low inductance semiconductor package
US5967858A (en) * 1996-12-10 1999-10-19 Fuji Electric Co., Ltd. Power module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235658A (ja) * 1985-08-09 1987-02-16 Fuji Electric Co Ltd 半導体装置
EP0609528A1 (en) * 1993-02-01 1994-08-10 Motorola, Inc. Low inductance semiconductor package
US5967858A (en) * 1996-12-10 1999-10-19 Fuji Electric Co., Ltd. Power module
DE19752408B4 (de) * 1996-12-10 2010-06-24 Fuji Electric Systems Co., Ltd. Leistungsmodul mit einem oder mehreren Halbleiter-Leistungsbauelementen

Also Published As

Publication number Publication date
JPH0247109B2 (cs) 1990-10-18

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