JPS6177377A - 発光ダイオ−ドの取付方法 - Google Patents

発光ダイオ−ドの取付方法

Info

Publication number
JPS6177377A
JPS6177377A JP59199050A JP19905084A JPS6177377A JP S6177377 A JPS6177377 A JP S6177377A JP 59199050 A JP59199050 A JP 59199050A JP 19905084 A JP19905084 A JP 19905084A JP S6177377 A JPS6177377 A JP S6177377A
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
circuit board
printed circuit
front panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59199050A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428151B2 (enrdf_load_stackoverflow
Inventor
Yoshihiro Wakino
脇野　喜裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DX Antenna Co Ltd
Original Assignee
DX Antenna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DX Antenna Co Ltd filed Critical DX Antenna Co Ltd
Priority to JP59199050A priority Critical patent/JPS6177377A/ja
Publication of JPS6177377A publication Critical patent/JPS6177377A/ja
Publication of JPH0428151B2 publication Critical patent/JPH0428151B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
JP59199050A 1984-09-21 1984-09-21 発光ダイオ−ドの取付方法 Granted JPS6177377A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59199050A JPS6177377A (ja) 1984-09-21 1984-09-21 発光ダイオ−ドの取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59199050A JPS6177377A (ja) 1984-09-21 1984-09-21 発光ダイオ−ドの取付方法

Publications (2)

Publication Number Publication Date
JPS6177377A true JPS6177377A (ja) 1986-04-19
JPH0428151B2 JPH0428151B2 (enrdf_load_stackoverflow) 1992-05-13

Family

ID=16401276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59199050A Granted JPS6177377A (ja) 1984-09-21 1984-09-21 発光ダイオ−ドの取付方法

Country Status (1)

Country Link
JP (1) JPS6177377A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108332A (ja) * 2004-10-04 2006-04-20 Tamura Seisakusho Co Ltd 圧電トランス
JP2014138049A (ja) * 2013-01-16 2014-07-28 Ricoh Co Ltd 電子回路、光源装置、電子回路の製造方法
JP2021033874A (ja) * 2019-08-28 2021-03-01 能美防災株式会社 熱感知器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108332A (ja) * 2004-10-04 2006-04-20 Tamura Seisakusho Co Ltd 圧電トランス
JP2014138049A (ja) * 2013-01-16 2014-07-28 Ricoh Co Ltd 電子回路、光源装置、電子回路の製造方法
JP2021033874A (ja) * 2019-08-28 2021-03-01 能美防災株式会社 熱感知器

Also Published As

Publication number Publication date
JPH0428151B2 (enrdf_load_stackoverflow) 1992-05-13

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