JPS6177350A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6177350A
JPS6177350A JP59198897A JP19889784A JPS6177350A JP S6177350 A JPS6177350 A JP S6177350A JP 59198897 A JP59198897 A JP 59198897A JP 19889784 A JP19889784 A JP 19889784A JP S6177350 A JPS6177350 A JP S6177350A
Authority
JP
Japan
Prior art keywords
bonded
heat sink
semiconductor element
adhesive
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59198897A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439780B2 (enExample
Inventor
Kenji Uesugi
上杉　賢次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59198897A priority Critical patent/JPS6177350A/ja
Publication of JPS6177350A publication Critical patent/JPS6177350A/ja
Publication of JPH0439780B2 publication Critical patent/JPH0439780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/778—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59198897A 1984-09-22 1984-09-22 半導体装置 Granted JPS6177350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59198897A JPS6177350A (ja) 1984-09-22 1984-09-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59198897A JPS6177350A (ja) 1984-09-22 1984-09-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS6177350A true JPS6177350A (ja) 1986-04-19
JPH0439780B2 JPH0439780B2 (enExample) 1992-06-30

Family

ID=16398755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59198897A Granted JPS6177350A (ja) 1984-09-22 1984-09-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS6177350A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02173056A (ja) * 1988-11-04 1990-07-04 Internatl Business Mach Corp <Ibm> 硬化性組成物とそれを用いた集積回路モジユール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162246A (en) * 1979-06-04 1980-12-17 Hitachi Ltd Resin-sealed semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162246A (en) * 1979-06-04 1980-12-17 Hitachi Ltd Resin-sealed semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02173056A (ja) * 1988-11-04 1990-07-04 Internatl Business Mach Corp <Ibm> 硬化性組成物とそれを用いた集積回路モジユール

Also Published As

Publication number Publication date
JPH0439780B2 (enExample) 1992-06-30

Similar Documents

Publication Publication Date Title
US7781265B2 (en) DFN semiconductor package having reduced electrical resistance
US6482674B1 (en) Semiconductor package having metal foil die mounting plate
US6713321B2 (en) Super low profile package with high efficiency of heat dissipation
US6242800B1 (en) Heat dissipating device package
US20090189261A1 (en) Ultra-Thin Semiconductor Package
CN100423251C (zh) 一种半导体器件以及一种半导体器件封装件
JPS60167454A (ja) 半導体装置
JPS61236130A (ja) 半導体装置
JPH0418694B2 (enExample)
US20060145312A1 (en) Dual flat non-leaded semiconductor package
JPH0645504A (ja) 半導体装置
JPS6177350A (ja) 半導体装置
JPH08236665A (ja) 樹脂封止型半導体装置及びその製造方法
JPS62154769A (ja) 半導体装置
US7951651B2 (en) Dual flat non-leaded semiconductor package
JP2001015667A (ja) リードフレームとそれを用いた樹脂封止型半導体装置およびその製造方法
CN112151513A (zh) 功率管芯封装
JP2871575B2 (ja) リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法
JP2737332B2 (ja) 集積回路装置
JPH11354673A (ja) 半導体装置
JP2646988B2 (ja) 樹脂封止型半導体装置
JP2990120B2 (ja) 半導体装置
JPH0357259A (ja) 半導体装置
KR100252862B1 (ko) 반도체 패키지 및 그의 제조방법
KR0142756B1 (ko) 칩홀딩 리드 온 칩타입 반도체 패키지