JPS6163044A - 銀めつき導体 - Google Patents

銀めつき導体

Info

Publication number
JPS6163044A
JPS6163044A JP59184252A JP18425284A JPS6163044A JP S6163044 A JPS6163044 A JP S6163044A JP 59184252 A JP59184252 A JP 59184252A JP 18425284 A JP18425284 A JP 18425284A JP S6163044 A JPS6163044 A JP S6163044A
Authority
JP
Japan
Prior art keywords
copper
plated layer
silver
conductor
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59184252A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123947B2 (ref
Inventor
Norio Okabe
則夫 岡部
Osamu Yoshioka
修 吉岡
Ryozo Yamagishi
山岸　良三
Sadao Nagayama
長山　定夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP59184252A priority Critical patent/JPS6163044A/ja
Publication of JPS6163044A publication Critical patent/JPS6163044A/ja
Publication of JPH0123947B2 publication Critical patent/JPH0123947B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H10W72/523—Multilayered bond wires, e.g. having a coating concentric around a core characterised by the structures of the outermost layers, e.g. multilayered coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP59184252A 1984-09-03 1984-09-03 銀めつき導体 Granted JPS6163044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59184252A JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59184252A JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Publications (2)

Publication Number Publication Date
JPS6163044A true JPS6163044A (ja) 1986-04-01
JPH0123947B2 JPH0123947B2 (ref) 1989-05-09

Family

ID=16150053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59184252A Granted JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Country Status (1)

Country Link
JP (1) JPS6163044A (ref)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03274756A (ja) * 1990-03-23 1991-12-05 Sharp Corp 固体撮像素子およびその製造方法
US6034422A (en) * 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
EP3285295A1 (en) * 2016-08-19 2018-02-21 STMicroelectronics Srl A method for manufacturing semiconductor devices, and corresponding device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5755324B2 (ja) 2010-08-31 2015-07-29 スリーエム イノベイティブ プロパティズ カンパニー 遮蔽電気ケーブルの電気的特性
EP2522021B1 (en) 2010-08-31 2016-07-27 3M Innovative Properties Company High density shielded electrical cable and other shielded cables, systems, and methods
JP6305393B2 (ja) 2012-04-27 2018-04-04 スリーエム イノベイティブ プロパティズ カンパニー 歯科矯正装具のための容器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03274756A (ja) * 1990-03-23 1991-12-05 Sharp Corp 固体撮像素子およびその製造方法
US6034422A (en) * 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
EP3285295A1 (en) * 2016-08-19 2018-02-21 STMicroelectronics Srl A method for manufacturing semiconductor devices, and corresponding device

Also Published As

Publication number Publication date
JPH0123947B2 (ref) 1989-05-09

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