JPS6163044A - 銀めつき導体 - Google Patents

銀めつき導体

Info

Publication number
JPS6163044A
JPS6163044A JP59184252A JP18425284A JPS6163044A JP S6163044 A JPS6163044 A JP S6163044A JP 59184252 A JP59184252 A JP 59184252A JP 18425284 A JP18425284 A JP 18425284A JP S6163044 A JPS6163044 A JP S6163044A
Authority
JP
Japan
Prior art keywords
copper
plated layer
silver
conductor
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59184252A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123947B2 (enExample
Inventor
Norio Okabe
則夫 岡部
Osamu Yoshioka
修 吉岡
Ryozo Yamagishi
山岸　良三
Sadao Nagayama
長山　定夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP59184252A priority Critical patent/JPS6163044A/ja
Publication of JPS6163044A publication Critical patent/JPS6163044A/ja
Publication of JPH0123947B2 publication Critical patent/JPH0123947B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/4557—Plural coating layers
    • H01L2224/45572—Two-layer stack coating
    • H10W72/07551—
    • H10W72/50—
    • H10W72/534—
    • H10W72/552—
    • H10W72/555—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP59184252A 1984-09-03 1984-09-03 銀めつき導体 Granted JPS6163044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59184252A JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59184252A JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Publications (2)

Publication Number Publication Date
JPS6163044A true JPS6163044A (ja) 1986-04-01
JPH0123947B2 JPH0123947B2 (enExample) 1989-05-09

Family

ID=16150053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59184252A Granted JPS6163044A (ja) 1984-09-03 1984-09-03 銀めつき導体

Country Status (1)

Country Link
JP (1) JPS6163044A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03274756A (ja) * 1990-03-23 1991-12-05 Sharp Corp 固体撮像素子およびその製造方法
US6034422A (en) * 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
EP3285295A1 (en) * 2016-08-19 2018-02-21 STMicroelectronics Srl A method for manufacturing semiconductor devices, and corresponding device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012030365A1 (en) 2010-08-31 2012-03-08 3M Innovative Properties Company High density shielded electrical cable and other shielded cables, systems, and methods
EP3200197A1 (en) 2010-08-31 2017-08-02 3M Innovative Properties Company Shielded electrical cable in twinaxial configuration
US9504544B2 (en) 2012-04-27 2016-11-29 3M Innovative Properties Company Container for orthodontic appliances

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03274756A (ja) * 1990-03-23 1991-12-05 Sharp Corp 固体撮像素子およびその製造方法
US6034422A (en) * 1995-09-29 2000-03-07 Dai Nippon Printing Co., Ltd. Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame
EP3285295A1 (en) * 2016-08-19 2018-02-21 STMicroelectronics Srl A method for manufacturing semiconductor devices, and corresponding device

Also Published As

Publication number Publication date
JPH0123947B2 (enExample) 1989-05-09

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