JPS6161869U - - Google Patents
Info
- Publication number
- JPS6161869U JPS6161869U JP14540084U JP14540084U JPS6161869U JP S6161869 U JPS6161869 U JP S6161869U JP 14540084 U JP14540084 U JP 14540084U JP 14540084 U JP14540084 U JP 14540084U JP S6161869 U JPS6161869 U JP S6161869U
- Authority
- JP
- Japan
- Prior art keywords
- base
- wiring board
- printed wiring
- flexible printed
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14540084U JPS6161869U (enrdf_load_stackoverflow) | 1984-09-26 | 1984-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14540084U JPS6161869U (enrdf_load_stackoverflow) | 1984-09-26 | 1984-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6161869U true JPS6161869U (enrdf_load_stackoverflow) | 1986-04-25 |
Family
ID=30703654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14540084U Pending JPS6161869U (enrdf_load_stackoverflow) | 1984-09-26 | 1984-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6161869U (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750872B2 (enrdf_load_stackoverflow) * | 1975-03-12 | 1982-10-29 | ||
| JPS5933270B2 (ja) * | 1977-07-08 | 1984-08-14 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
1984
- 1984-09-26 JP JP14540084U patent/JPS6161869U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750872B2 (enrdf_load_stackoverflow) * | 1975-03-12 | 1982-10-29 | ||
| JPS5933270B2 (ja) * | 1977-07-08 | 1984-08-14 | 三菱電機株式会社 | 半導体装置の製造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6161869U (enrdf_load_stackoverflow) | ||
| JPS6142872U (ja) | フレキシブル回路基板 | |
| JPS602841U (ja) | 半導体取付基板 | |
| JPS61138268U (enrdf_load_stackoverflow) | ||
| JPS5920661U (ja) | プリント基板 | |
| JPS6413078U (enrdf_load_stackoverflow) | ||
| JPS59127270U (ja) | プリント基板装置 | |
| JPS58182343U (ja) | プリント基板装置 | |
| JPS5920671U (ja) | プリント配線板 | |
| JPS60124069U (ja) | プリント基板 | |
| JPH0179872U (enrdf_load_stackoverflow) | ||
| JPS60174297U (ja) | プリント板 | |
| JPS60190061U (ja) | 電子部品取付構造 | |
| JPS61196572U (enrdf_load_stackoverflow) | ||
| JPS6055001U (ja) | 照明装置 | |
| JPS59128797U (ja) | シ−ルド装置 | |
| JPS63108112U (enrdf_load_stackoverflow) | ||
| JPS59138259U (ja) | 放熱器付プリント回路基板の製造方法 | |
| JPS58103161U (ja) | プリント基板 | |
| JPS5918495U (ja) | 回路基板装置 | |
| JPS5920675U (ja) | 印刷配線板の積層構造 | |
| JPS6071195U (ja) | プリント基板における放熱装置 | |
| JPS596896U (ja) | シ−ルドテ−プ | |
| JPS5823464U (ja) | モジユレ−タ用のプリント基板 | |
| JPS599552U (ja) | 混成厚膜集積回路 |