JPS6160910B2 - - Google Patents
Info
- Publication number
- JPS6160910B2 JPS6160910B2 JP57182497A JP18249782A JPS6160910B2 JP S6160910 B2 JPS6160910 B2 JP S6160910B2 JP 57182497 A JP57182497 A JP 57182497A JP 18249782 A JP18249782 A JP 18249782A JP S6160910 B2 JPS6160910 B2 JP S6160910B2
- Authority
- JP
- Japan
- Prior art keywords
- mesh
- holder
- chamber
- substrate
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18249782A JPS5970777A (ja) | 1982-10-18 | 1982-10-18 | スパツタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18249782A JPS5970777A (ja) | 1982-10-18 | 1982-10-18 | スパツタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5970777A JPS5970777A (ja) | 1984-04-21 |
| JPS6160910B2 true JPS6160910B2 (enExample) | 1986-12-23 |
Family
ID=16119321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18249782A Granted JPS5970777A (ja) | 1982-10-18 | 1982-10-18 | スパツタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5970777A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102409312A (zh) * | 2011-11-23 | 2012-04-11 | 林嘉宏 | 少落尘的真空磁控溅射镀膜设备 |
| CN104651779A (zh) * | 2015-02-11 | 2015-05-27 | 烟台首钢磁性材料股份有限公司 | 一种用于钕铁硼磁体的镀膜设备及镀膜工艺 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5835591B2 (ja) * | 1979-01-23 | 1983-08-03 | 株式会社富士通ゼネラル | スパツタリング装置 |
-
1982
- 1982-10-18 JP JP18249782A patent/JPS5970777A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5970777A (ja) | 1984-04-21 |
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