JPS6160598B2 - - Google Patents
Info
- Publication number
- JPS6160598B2 JPS6160598B2 JP49083632A JP8363274A JPS6160598B2 JP S6160598 B2 JPS6160598 B2 JP S6160598B2 JP 49083632 A JP49083632 A JP 49083632A JP 8363274 A JP8363274 A JP 8363274A JP S6160598 B2 JPS6160598 B2 JP S6160598B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin layer
- resin
- cover plate
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000004840 adhesive resin Substances 0.000 claims description 7
- 229920006223 adhesive resin Polymers 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000005266 casting Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- ITNADJKYRCCJNX-UHFFFAOYSA-N 3-(2,3-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound NC1=CC=CC(S(=O)(=O)C=2C(=C(N)C=CC=2)N)=C1N ITNADJKYRCCJNX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- -1 for example Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical group NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8363274A JPS5111571A (en) | 1974-07-19 | 1974-07-19 | Denkikairososhino patsukeejihoho |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8363274A JPS5111571A (en) | 1974-07-19 | 1974-07-19 | Denkikairososhino patsukeejihoho |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5111571A JPS5111571A (en) | 1976-01-29 |
| JPS6160598B2 true JPS6160598B2 (zh) | 1986-12-22 |
Family
ID=13807830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8363274A Granted JPS5111571A (en) | 1974-07-19 | 1974-07-19 | Denkikairososhino patsukeejihoho |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5111571A (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102152U (zh) * | 1980-12-15 | 1982-06-23 | ||
| JPS57103319A (en) * | 1980-12-19 | 1982-06-26 | Fujitsu Ltd | Hermetically sealing method for electronic part |
-
1974
- 1974-07-19 JP JP8363274A patent/JPS5111571A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5111571A (en) | 1976-01-29 |
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