JPS6156500A - Device for attaching electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an electronic component mounting method in which small electronic components are mounted and assembled on a circuit pattern drawn on an insulating substrate such as a printed circuit board or a ceramic substrate. Regarding equipment, in particular,
In this electronic component mounting device, the state of application of adhesive, cream paste, etc. on insulating substrates and the pretreatment process are inspected using a television camera, and adhesive pattern inspection is performed to prevent defective assembly of electronic components. Regarding equipment.

[Technical background of the invention]

In general, an electronic component mounting device that assembles electronic components by placing them on a circuit pattern of an insulating substrate is such that an adhesive or cream solder is applied on the circuit pattern of the insulating substrate in advance, and then, for example, a resistor is used. Depends on elements, capacitor elements, transistors, diodes, mental capacitors, etc. (e.g. outer diameter dimensions, 2 x 1.5 x 1.6
The buttons are designed to use suction nozzles to attach and assemble extremely small electronic components (on the order of mm).

On the other hand, electronic components such as the above-mentioned resistive elements and capacitor elements are housed in a housing tape rK, as shown in FIG.

That is, this storage tape ■, as shown in FIG.
Each storage hole) 1) is formed at a constant pitch on a support tape a having an ear hole (perforation hole) al, and an electronic component C made of, for example, a resistor element is deposited in each storage hole) 1), and further This is stored with top tape d so that it cannot be removed.

Therefore, when each of the electronic components C is mounted on the insulating substrate, the ear hole al of the support tape a is intermittently fed by a ratchet mechanism having a sprocket, and the top tape d is slowly peeled off while being raised and lowered. A suction nozzle is used to suction the electronic component into the storage pocket (b) and the electronic component is taken out, and the electronic component is mounted on the circuit pattern of the insulating board at a predetermined position where the adhesive is applied.

As shown in FIG. 2, this type of electronic component mounting machine that has already been proposed has a built-in base 1, a servo motor drive mechanism 2, a power supply 3, and a control computer (controller) 4. On the top of the base 1, a main operation panel 5 and a loader device 7 for inserting an insulating substrate 6 as a workpiece, and an unloader device 8 for receiving and sending out the same are installed in series, and this loader device f! A pair of movable tables 9 that run on the unloader device B and F are conveyed by, for example, a pair of chain conveyors (not shown), and the insulating substrate 6 is placed on the movable table 9. Place it on the table and move it along with the movable table 9 back and forth, left and right, and up and down.
Further, a plurality of tape reels 11 for winding each cassette storage device #10 wrapped with the storage tape I and a support tape a are provided on the top of the board 1 so as to move downward. A plurality of winding reels 12 for winding are detachably attached, and furthermore, the lower base of each casette storage device "0" has a guide 7'-"13 on the upper side. 1. Loader device 7 and unloader - in parallel to the device 8; Furthermore, an application head 14 for applying adhesive to this guide frame 13 is provided.
A coating drive unit fL15 equipped with a vacuum plate N drive unit @'17 equipped with a suction nozzle 16 for vacuum suctioning and holding an electronic component C is provided so as to move in the left-right direction.

Therefore, the electronic component mounting machine described above automatically transfers the insulating substrate 6 on the movable table 9 directly below the coating head 14 using the loader device 7 using the main operation panel 5, and... Adhesive is applied to a predetermined position on the insulating substrate 6, and then the suction nozzle 16 of the vacuum suction drive device @17 adjacent to this is used to create a storage pocket for the support tape a.
1) Adsorbs and holds the electronic component C deposited on the substrate, and assembles it by attaching it to the circuit pattern of the absolute R board 60 coated with adhesive.Furthermore, the insulating substrate 6 on which the electronic component C is attached is placed on the movable table. Together with 9, the unloader device 8 sends it out to the next process.

In particular, the vacuum suction drive device 1 equipped with the suction nozzle 16
7 is constructed as 5 as shown in FIGS. 3 to 5.

That is, in FIG. 3, an insulating substrate 6 as a workpiece to be transferred by a movable table 9 is placed above the base l.
is placed horizontally, and the above-mentioned casette storage device 10 is installed on the top of the base l near the insulating substrate 6.
A tape reel 11 for winding the top tape d and a take-up reel 12 for winding the support tape a are detachably provided. Further, on the base 1 near the tape reel 11, a ratchet wheel 1B, a sprocket wheel 19. A ratchet device $22 consisting of a ratchet pawl 20 and a feed lever 21 is provided so as to rotate the ear hole a1 of the support tape a intermittently one pitch at a time. The top tape d stuck to the top tape d is wound around the tape reel 11 and the take-up reel 12 so that the electronic components C can be taken out one by one.

On the other hand, the suction nozzle 16 above the ratchet mechanism 22
A holding member 25 having a pair of bearings 24 is vertically provided on the frame 23 of the vacuum suction drive device 17, and the lifting sweat 26 is moved up and down by a cam mechanism (not shown) on both bearings 24. It is mounted on a shaft so that it can move downward. Further, a guide tube shaft 4 is fitted into a gripping member 27 attached to the middle of the lifting rod 26, and an operating rod 29 is attached to the guide tube shaft 28, and a cam machine v (not shown) is mounted on the guide tube shaft 28.
It is mounted on a shaft so that it can move up and down depending on the position. Further, a bracket 30 is provided on the guide tube shaft 28 on which the gripping member 27 is located, and this bracket 301C is attached to the nozzle tube shaft 30 provided with the suction nozzle L6.
1 is connected to a vacuum pump (not shown) through a flexible pipe 32. Further, at the lower part of this nozzle tube shaft 31 and the guide tube shaft 2, as shown in FIG. 3 and FIG.
The nozzle tube shaft 311C below the operating arm rod 33 is shown in FIG.
A centering mechanism (2) is provided at a distance of 5K to correct the position of the electronic component C to the correct posture.

That is, in FIGS. 3 and 4, the nozzle tube shaft 3
A flange member 35 is fitted into the lower cylindrical body 31a of the flange member 35, and a lever support member 36 in the shape of a rectangular tube is fitted onto the nozzle tube shaft 31 below the flange member 35 to prevent it from falling out. Moreover, it is mounted so as to be slidable in the axial direction by the elasticity of the coil spring 37. Further, on the two outer sides of the lever support member 36, a pair of centering levers 38 are pivoted to be openable and closable by respective pin shafts 40, with the elastic traps of the coil springs 39 urging the legs to close. A roller 41 is attached to the upper end of each centering lever 38 so as to come into contact with the lower surface of the flange member 35. Further, a horizontally formed claw portion 38a is provided at the free end of each of the centering lever blades so as to surround the lower part of the suction nozzle L6 from all sides, and each of the claw portions 38 & Nozzle 16
5 to correct the position of the electronic component C that has been sucked into the correct position. ,,[Therefore, as shown in FIG. 3, the above-mentioned centering mechanism (2) pulls up the nozzle tube shaft 31 upwardly by the cam mechanism and places the electronic component C in the storage tape (IK) into the suction nozzle. Adsorb with L6. At this time, the lever support member 36 slides upward against the elasticity of the coil spring 37, and as a result, each of the rollers 41
are pressed against the lower surface of the flange member 35, so that each claw portion 38a of each centering lever 38 is pressed against each coil spring 3.
The legs are opened against the elasticity of 9, and the nozzle tube shaft 31 is the crank machine! As shown in FIG. 5, each pair of suction nozzles 16 is moved from the electronic component suction position α to the electronic component placement position r, as shown in FIG. centering lever 3
8 grips the electronic component C of the suction nozzle 16 from all sides at the electronic component correction position β to correct the positional deviation, angle (orientation), and inclination during suction, and・It is designed to rotate so that the negative electrode direction can be reversed.

Therefore, the vacuum suction drive device 17 equipped with the suction nozzle 16 lifts the elevating rod 26 upward by the cam mechanism, and also moves the actuating arm FF33 to the actuating rod 2 by the crank mechanism 34.
9, and in conjunction with this, the nozzle tube shaft 31
At the same time, the suction nozzle 16 is pulled up to the position shown by the chain line in FIG.
adsorbs. On the other hand, each centering lever 38 of the centering machine sII is opened in all directions.

Next, the suction nozzle 16 is rotated as shown in FIG. 5 while being lowered by the cam machine and crank mechanism 34 as shown by the solid line in FIG.
The electronic components of the suction nozzle 16 are mounted and assembled at predetermined positions on the insulating substrate 6 to which adhesive has been applied in the previous step.

[Problems with background technology]

However, the above-mentioned electronic component mounting apparatus.

In the 60-circuit pattern on an insulated board, if the amount of cream solder printed or the amount of adhesive applied in the previous process becomes small due to inadequate conditions, adhesive strength will be insufficient, and the bonded electronic components will peel off due to this. Not only is there a risk, but there is also a risk of misalignment of the adhesive application position, so if you leave this as it is and then assemble the electronic components, do not place the center mark of the circuit pattern. As a result, checking and correction during inspection are troublesome, productivity is reduced, and it is difficult to improve quality.

[Purpose of the invention]

In order to solve the above-mentioned difficulties, the present invention uses a television camera to photograph the adhesive etc. applied in advance to the circuit pattern of the insulating substrate before mounting the electronic components, and the photographed image is used to pattern the circuit pattern on the insulating substrate. A recognition calculator (comparator) using a recognition device measures the amount of cream solder and adhesive applied by comparing it with the standard deposit, troubleshoots the problem, stops placing electronic parts, and at the same time,
The purpose of the present invention is to provide an electronic component mounting device whose purpose is to issue an alarm to improve the quality and productivity of assembly.

[Summary of the invention]

1. The present invention provides an electronic component mounting apparatus in which an adhesive or the like is applied to a circuit pattern of an insulating substrate, and an electronic component is placed thereon using a suction nozzle to assemble the circuit. The adhesive applied to the pattern is photographed, and an image processor is connected to this television camera.
An output device is connected via a recognition computing unit, and a mechanical control interface is provided on the human/output device so as to be linked to the controller of the electronic component mounting apparatus.

[Embodiments of the invention]

Hereinafter, the present invention will be described with reference to an illustrated embodiment. Note that the present invention will be described with the same reference numerals assigned to the same constituent members as in the above-described specific example.

6 to 9, reference numeral 6 denotes an insulating substrate as a workpiece transferred by a movable table 9 in the electronic component mounting apparatus, and this insulating substrate 6 includes, as shown in FIG. A pair of circuit patterns 6a are formed, and a center mark 6° C. is attached between both circuit patterns 6a, and an adhesive 6C:1 is applied concentrically to this center mark 6b. It is coated with
The electronic component C is provided so as to straddle both of the circuit patterns 61LK. The other insulating substrate 6 shown in FIG. 8 has adhesives 6C applied on a pair of circuit patterns 6a, and electronic components C coated on both adhesives 6C.
It is designed so that it straddles the K.

On the other hand, a casette storage device 10 close to the insulating substrate 6
A tape reel 11 for winding up the top tape d and a take-up reel 12 for winding up the support tape a are removably provided (see FIG. 3). In addition, the above tape reel 1
The base IK near the ratchet mechanism 2 includes a ratchet wheel 18, a sprocket wheel 19, a ratchet pawl 20, and a feed lever 21 (see FIG. 3).
2 is provided to rotate the ear canal al of the support tape a intermittently one pitch at a time, and the support tape a and the top tape d attached thereto are connected to the tape reel 11 and the winding. The take-up reel 121C is wound up so that the electronic components C can be taken out one by one.

On the other hand, the upper suction nozzle /I/ of the ratchet mechanism 22
A holding member 25 having a pair of bearings U is vertically provided on a frame 23 of a vacuum suction drive device 17 equipped with a vacuum suction drive device 16. It is mounted on a shaft so that it can move up and down. In addition, a guide tube +11128 is fitted into the gripping member n attached to the middle of the lifting rod 26, and an operating rod 29 is connected to the upper and lower shafts by a cam device (not shown) in the guide tube axis path. It is mounted on a shaft so that it can move downward.

Further, a bracket 30 is attached to the guide tube axis path where the gripping member n is located, and this bracket 3
0, a nozzle tube shaft 31 equipped with the suction nozzle L6 is connected to a vacuum pump (not shown) through a flexible tube 32. Further, an operating arm rod 33 is provided at the lower part of the nozzle tube shaft 31 and the guide tube shaft path so that it can be rotated reciprocally around the guide tube shaft 28 by a crank mechanism. As shown in FIG. 4, a centering mechanism (1) is provided on the nozzle tube shaft 31 below the operating arm rod 33 so as to correct the position of the electronic component C to a correct posture.

Therefore, as mentioned above, the centering mechanism ■
As shown in FIGS. 4 and 6, when the nozzle tube shaft 31 is pulled upward by the cam mechanism and the electronic component C (11) is sucked into the storage pocket by the storage tape IK with the suction nozzle 16, the lever is supported. The member 36 slides upward against the elasticity of the coil spring 37, and thereby presses each roller 41 against the lower surface of the flange member 35, so that each claw portion 3 of each centering lever 38
- The hawk opens its legs against the elasticity of each coil spring 39, and while the nozzle tube shaft 31 is rotated by the crank mechanism 34,
The electronic components C of the suction nozzle 16 are
It is designed to correct positional deviation and orientation during suction by gripping from one side.

In this way, the vacuum suction drive device fR17 equipped with the above-mentioned suction nozzle 6 uses the cam mechanism to lift the lifting rod 26 upward, and the crank mechanism 34 to move the actuating arm rod 33 around the actuating rod 29. The nozzle tube shaft 31 is rotated, and in conjunction with this, the nozzle tube shaft 31 is pulled up to the height shown by the solid line in FIG. At this time, each centering lever 38 of the centering mechanism (2) opens in all directions.

Next, the suction nozzle 16 is rotated as shown in FIG. 5 while being lowered by the cam mechanism and the crank mechanism 34 as shown by the chain line in FIG. The first lightning component C of the suction nozzle 16 is placed on a predetermined position of the insulating substrate 6 coated with adhesive and assembled.

On the other hand, in FIGS. 6 and 9, a part of the holding member 25 near the suction nozzle 16 has an illuminator 4.
A television camera 42 with a built-in camera 2a is provided facing the circuit pattern 6a of the insulating substrate 60 via an arm rod 41, and a display 46 is mounted on the television camera 42, as shown in FIG. An image processor 43 provided therein is connected. In addition, an input/output device 44 based on a microcomputer C (microcomputer) K is connected to this image processor 43 via a recognition computing unit 44 as a pattern recognition device. , a command keyboard 44L, and a floppy disk 44b.Furthermore, the above-mentioned input/output '
The m device 44 is provided with a mechanical control interface 47 that is linked to the controller 4 equipped with an alarm of the electronic component mounting apparatus.

Therefore, the television camera 42 photographs the application state of the adhesive 6b, etc. on the insulating substrate 6, and this photographed image is transmitted to the recognition computing unit (comparator) 45 using the pattern recognition device #, which determines the amount of cream and powder. Measure the amount of adhesive applied and compare it with the standard amount,
In the event of a malfunction, the alarm of the controller 4 is activated via the mechanical control interface 47 and the suction nozzle 16 is activated.
The trap is configured to stop placing the electronic components C on the insulating substrate 6.

In this way, the adhesive 6m applied in advance to the circuit pattern 6a of the insulating substrate 60 is compared and measured using the television camera 42, the recognition calculator 45, etc. before the electronic component C is attached and assembled. K is designed to improve quality and productivity.

〔Effect of the invention〕

As described above, according to the present invention, an electronic component mounting apparatus that applies an adhesive or the like to a circuit pattern on an insulating substrate and places an electronic component thereon using a suction nozzle to assemble the electronic component is provided with the suction nozzle 16. TV camera 42 in frame 23
is provided to photograph the adhesive 6C coated with the circuit pattern 6aK, a video processor 43 is connected to this television camera 42, and input/output equipment is connected to this image processor 43 by 8? & Connected via the arithmetic unit 45, the mechanical part is connected to this input/output controller 44! Since the control interface 47 is connected to the controller 4 of the electronic component mounting device, it not only eliminates problems caused by excessive or insufficient amount of application, but also eliminates adhesive misalignment and improves quality during assembly. It is possible to improve the

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a part of the storage tape used in the present invention, Fig. 2 is a perspective view of an electronic component mounting machine that has already been proposed, and Fig. 3 is a perspective view showing a part of the storage tape used in the present invention. 4 is a perspective view of the centering mechanism incorporated in the electronic component mounting machine, FIG. 5 is a plan view for explaining the action of the centering tl, and FIG. 6 is an enlarged sectional view of the circle A section. FIGS. 7 and 8 are side views showing the main parts of the electronic component mounting apparatus of the present invention, and FIG. 9 is a side view showing a part of the insulating substrate used in the present invention. FIG. FIG. 3 is a diagram of a mounting device. 6... Insulating substrate, 16... Adsorption nozzle, 42...
TV camera, 43...Video processor, 44...Input
Output device, 45... Recognition device, 47... Mechanical simple control interface. Applicant's agent Kiyoshi Inomata Figure 4 Figure 5

Claims (1)

[Claims] 1. In an electronic component mounting device that applies adhesive or the like to a circuit pattern on an insulating substrate and places electronic components thereon using a suction nozzle for assembly, a television camera is attached to a frame equipped with the suction nozzle. An image processor is connected to this television camera, input/output equipment is connected to this image processor via a recognition computing unit, and this An electronic component mounting device characterized in that an input/output device is provided with a mechanical control interface so as to be linked to a controller of the electronic component mounting device. 2. The electronic component mounting apparatus according to claim 1, wherein the input/output device is a microcomputer equipped with a command keyboard and a floppy disk.