JPS6154211B2 - - Google Patents
Info
- Publication number
- JPS6154211B2 JPS6154211B2 JP10385179A JP10385179A JPS6154211B2 JP S6154211 B2 JPS6154211 B2 JP S6154211B2 JP 10385179 A JP10385179 A JP 10385179A JP 10385179 A JP10385179 A JP 10385179A JP S6154211 B2 JPS6154211 B2 JP S6154211B2
- Authority
- JP
- Japan
- Prior art keywords
- photomask
- mask
- adhesive
- glass
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000005357 flat glass Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 27
- 238000012546 transfer Methods 0.000 description 19
- 239000000428 dust Substances 0.000 description 13
- 238000001723 curing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10385179A JPS5629238A (en) | 1979-08-15 | 1979-08-15 | Photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10385179A JPS5629238A (en) | 1979-08-15 | 1979-08-15 | Photomask |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5629238A JPS5629238A (en) | 1981-03-24 |
JPS6154211B2 true JPS6154211B2 (US20110232667A1-20110929-C00004.png) | 1986-11-21 |
Family
ID=14364936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10385179A Granted JPS5629238A (en) | 1979-08-15 | 1979-08-15 | Photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5629238A (US20110232667A1-20110929-C00004.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6257260U (US20110232667A1-20110929-C00004.png) * | 1985-09-26 | 1987-04-09 | ||
JPS62288842A (ja) * | 1986-06-09 | 1987-12-15 | Tosoh Corp | フオトマスク,レチクルの保護防塵体 |
JP3711063B2 (ja) | 2001-11-08 | 2005-10-26 | 大日本印刷株式会社 | 防塵装置付きフォトマスク及びこれを用いた露光方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4063812A (en) * | 1976-08-12 | 1977-12-20 | International Business Machines Corporation | Projection printing system with an improved mask configuration |
US4131363A (en) * | 1977-12-05 | 1978-12-26 | International Business Machines Corporation | Pellicle cover for projection printing system |
JPS55121443A (en) * | 1979-03-14 | 1980-09-18 | Mitsubishi Electric Corp | Photomask base plate |
JPS55121442A (en) * | 1979-03-14 | 1980-09-18 | Mitsubishi Electric Corp | Photomask base plate |
-
1979
- 1979-08-15 JP JP10385179A patent/JPS5629238A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4063812A (en) * | 1976-08-12 | 1977-12-20 | International Business Machines Corporation | Projection printing system with an improved mask configuration |
US4131363A (en) * | 1977-12-05 | 1978-12-26 | International Business Machines Corporation | Pellicle cover for projection printing system |
JPS55121443A (en) * | 1979-03-14 | 1980-09-18 | Mitsubishi Electric Corp | Photomask base plate |
JPS55121442A (en) * | 1979-03-14 | 1980-09-18 | Mitsubishi Electric Corp | Photomask base plate |
Also Published As
Publication number | Publication date |
---|---|
JPS5629238A (en) | 1981-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3120474B2 (ja) | 半導体集積回路装置の製造方法 | |
US7829248B2 (en) | Pellicle stress relief | |
TW511149B (en) | Photomask and method for manufacturing the same | |
US4063812A (en) | Projection printing system with an improved mask configuration | |
JP3248526B2 (ja) | 回折光学素子及びそれを有した光学系 | |
JPH075675A (ja) | マスク及びその製造方法 | |
JP2000206671A (ja) | フォトマスク、フォトマスクの製造方法、および半導体集積回路装置の製造方法 | |
US7271950B1 (en) | Apparatus and method for optimizing a pellicle for off-axis transmission of light | |
JPS6154211B2 (US20110232667A1-20110929-C00004.png) | ||
US3507592A (en) | Method of fabricating photomasks | |
JP3180133B2 (ja) | 投影露光装置 | |
JPS59160144A (ja) | ホトマスク | |
JPS6344824Y2 (US20110232667A1-20110929-C00004.png) | ||
JP2005524877A (ja) | 吸収素子および/または移相器を有した光リソグラフィーマスク | |
TWI771111B (zh) | 用於半導體微影製程的光罩、製造光罩的方法、以及半導體微影方法 | |
JPH09211842A (ja) | 光学的手段を用いた電子回路形成における光反射防止方法及びその装置とその製品 | |
JPH0664337B2 (ja) | 半導体集積回路用ホトマスク | |
JPS6053871B2 (ja) | 露光方法 | |
JPS6083019A (ja) | パタ−ン反射型投影露光方法 | |
JP4369248B2 (ja) | マスク作成方法、パターン露光装置、及び、マスク | |
US7629090B2 (en) | Reticle and method of manufacturing method the same | |
KR970004421B1 (ko) | 반도체 노광장치 | |
JPS6127548A (ja) | 非接触式露光装置 | |
KR100720520B1 (ko) | 노광마스크 | |
JPS60121449A (ja) | 露光用マスク |