JPS6153937B2 - - Google Patents
Info
- Publication number
- JPS6153937B2 JPS6153937B2 JP3128982A JP3128982A JPS6153937B2 JP S6153937 B2 JPS6153937 B2 JP S6153937B2 JP 3128982 A JP3128982 A JP 3128982A JP 3128982 A JP3128982 A JP 3128982A JP S6153937 B2 JPS6153937 B2 JP S6153937B2
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- synthetic resin
- resin material
- gate pin
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3128982A JPS58147331A (ja) | 1982-02-26 | 1982-02-26 | インサ−ト成形法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3128982A JPS58147331A (ja) | 1982-02-26 | 1982-02-26 | インサ−ト成形法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58147331A JPS58147331A (ja) | 1983-09-02 |
JPS6153937B2 true JPS6153937B2 (enrdf_load_stackoverflow) | 1986-11-20 |
Family
ID=12327145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3128982A Granted JPS58147331A (ja) | 1982-02-26 | 1982-02-26 | インサ−ト成形法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58147331A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290213A (ja) * | 1985-10-17 | 1987-04-24 | Mitsubishi Metal Corp | 集積回路素子ケ−シングの射出成形による成形方法 |
CA2197136A1 (en) * | 1997-02-10 | 1998-08-10 | Dave Cockle | Plastic molding process and products produced thereby |
-
1982
- 1982-02-26 JP JP3128982A patent/JPS58147331A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58147331A (ja) | 1983-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4507675A (en) | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor | |
EP0817261B1 (en) | Method for manufacturing plastic package for electronic device having a fully insulated dissipator | |
US4750030A (en) | Resin-molded semiconductor device having heat radiating plate embedded in the resin | |
JP2006261298A (ja) | 蓋体フレーム、半導体装置、及びその製造方法 | |
EP0307977B1 (en) | Molded resin casing of electronic part with flat cable | |
KR950033756A (ko) | 전기부품용 패널버튼과 그 제조방법 및 장치 | |
JPS6153937B2 (enrdf_load_stackoverflow) | ||
JP3906510B2 (ja) | 電子部品搭載用放熱基板 | |
US5995374A (en) | Resin-coated mount substrate and method of producing the same | |
JPS6153936B2 (enrdf_load_stackoverflow) | ||
GB2151845A (en) | A semiconductor memory | |
JPH0786704A (ja) | パワー回路用配線基板及びその製造方法 | |
JPS6138717B2 (enrdf_load_stackoverflow) | ||
JPS58175947A (ja) | 回転電機用刷子ホルダー装置とその製造方法 | |
JPH118007A (ja) | 電気コネクタ組立体及びその製造方法 | |
JP3456738B2 (ja) | モールドモータ | |
JPH02184040A (ja) | 半導体装置の製造方法 | |
JP3802467B2 (ja) | パック電池とその製造方法 | |
JP2004213931A (ja) | パック電池 | |
JPS6018156B2 (ja) | 電気機器ケ−スとその製造方法 | |
JP2502577Y2 (ja) | 電力用半導体モジュ―ル | |
JP2864995B2 (ja) | 回路装置 | |
JP3802458B2 (ja) | パック電池とその製造方法 | |
JP3818899B2 (ja) | 複合半導体装置の製造方法 | |
JPS6362239A (ja) | プラスチックカプセル封じ半導体デバイスの製造方法 |