JPS6153210B2 - - Google Patents

Info

Publication number
JPS6153210B2
JPS6153210B2 JP57222986A JP22298682A JPS6153210B2 JP S6153210 B2 JPS6153210 B2 JP S6153210B2 JP 57222986 A JP57222986 A JP 57222986A JP 22298682 A JP22298682 A JP 22298682A JP S6153210 B2 JPS6153210 B2 JP S6153210B2
Authority
JP
Japan
Prior art keywords
molding material
molding
mold
pot
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57222986A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59114038A (ja
Inventor
Kanetomo Nagai
Minoru Hashimoto
Takayuki Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP22298682A priority Critical patent/JPS59114038A/ja
Publication of JPS59114038A publication Critical patent/JPS59114038A/ja
Publication of JPS6153210B2 publication Critical patent/JPS6153210B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP22298682A 1982-12-21 1982-12-21 トランスフア成形装置 Granted JPS59114038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22298682A JPS59114038A (ja) 1982-12-21 1982-12-21 トランスフア成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22298682A JPS59114038A (ja) 1982-12-21 1982-12-21 トランスフア成形装置

Publications (2)

Publication Number Publication Date
JPS59114038A JPS59114038A (ja) 1984-06-30
JPS6153210B2 true JPS6153210B2 (enExample) 1986-11-17

Family

ID=16791005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22298682A Granted JPS59114038A (ja) 1982-12-21 1982-12-21 トランスフア成形装置

Country Status (1)

Country Link
JP (1) JPS59114038A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255315A (ja) * 1991-02-07 1992-09-10 Nec Kyushu Ltd 樹脂封止金型

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109255A (enExample) * 1974-02-06 1975-08-28
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS57123222U (enExample) * 1981-01-26 1982-07-31

Also Published As

Publication number Publication date
JPS59114038A (ja) 1984-06-30

Similar Documents

Publication Publication Date Title
US3898314A (en) Method of molding rubber articles
US1919534A (en) Molding apparatus
JPS6153210B2 (enExample)
US2654949A (en) Artificial tooth and method of forming the same
EP0004844A2 (en) Apparatus for manufacturing plastic products
US2332537A (en) Method of compression molding
JPH0257006B2 (enExample)
JPH0740393A (ja) 射出成形方法および成形金型
EP0458577A1 (en) Method of manufacturing resin-sealed type semiconductor device
JPS6146051B2 (enExample)
JPH01171233A (ja) 半導体素子用樹脂封止装置
JPS642493B2 (enExample)
JPH0440276Y2 (enExample)
JPH0242651B2 (enExample)
JP2502387B2 (ja) 半導体素子の樹脂封止方法及び樹脂封止金型
JPH04201220A (ja) モールド金型
JPS56164814A (en) Mold
JPS63228631A (ja) 半導体素子を樹脂封止する金型装置
JPS62169335A (ja) 樹脂封止型半導体装置の製造装置
JPS5821345A (ja) 電子部品の樹脂封止方法
JPH0511531B2 (enExample)
JPS6297813A (ja) モ−ルド金型
JPS58225642A (ja) 半導体装置の樹脂モ−ルド方法
JPH0314332Y2 (enExample)
JPH1140592A (ja) 封止成形方法およびその装置