JPS6146549B2 - - Google Patents
Info
- Publication number
- JPS6146549B2 JPS6146549B2 JP58158230A JP15823083A JPS6146549B2 JP S6146549 B2 JPS6146549 B2 JP S6146549B2 JP 58158230 A JP58158230 A JP 58158230A JP 15823083 A JP15823083 A JP 15823083A JP S6146549 B2 JPS6146549 B2 JP S6146549B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- alloy member
- electrical conductivity
- wear resistance
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C12/00—Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15823083A JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15823083A JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6050161A JPS6050161A (ja) | 1985-03-19 |
JPS6146549B2 true JPS6146549B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-10-15 |
Family
ID=15667115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15823083A Granted JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6050161A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02126147U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-03-25 | 1990-10-17 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2316685B (en) | 1996-08-29 | 2000-11-15 | Outokumpu Copper Oy | Copper alloy and method for its manufacture |
JP6030186B1 (ja) | 2015-05-13 | 2016-11-24 | 株式会社ダイヘン | 銅合金粉末、積層造形物の製造方法および積層造形物 |
JP6693078B2 (ja) * | 2015-10-15 | 2020-05-13 | 三菱マテリアル株式会社 | 鋳造用モールド材 |
WO2018079304A1 (ja) | 2016-10-25 | 2018-05-03 | 株式会社ダイヘン | 銅合金粉末、積層造形物の製造方法および積層造形物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58126946A (ja) * | 1982-01-25 | 1983-07-28 | Toyota Central Res & Dev Lab Inc | 硼化物分散銅合金の製造方法 |
-
1983
- 1983-08-30 JP JP15823083A patent/JPS6050161A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02126147U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-03-25 | 1990-10-17 |
Also Published As
Publication number | Publication date |
---|---|
JPS6050161A (ja) | 1985-03-19 |