JPS6146233B2 - - Google Patents
Info
- Publication number
- JPS6146233B2 JPS6146233B2 JP20581285A JP20581285A JPS6146233B2 JP S6146233 B2 JPS6146233 B2 JP S6146233B2 JP 20581285 A JP20581285 A JP 20581285A JP 20581285 A JP20581285 A JP 20581285A JP S6146233 B2 JPS6146233 B2 JP S6146233B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- ceramic
- tip
- ceramics
- thermal stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 64
- 238000005476 soldering Methods 0.000 claims description 51
- 239000000919 ceramic Substances 0.000 claims description 40
- 229910052742 iron Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 230000008646 thermal stress Effects 0.000 claims description 27
- 230000003139 buffering effect Effects 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 229910004353 Ti-Cu Inorganic materials 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20581285A JPS61111768A (ja) | 1985-09-18 | 1985-09-18 | 電気半田こて先 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20581285A JPS61111768A (ja) | 1985-09-18 | 1985-09-18 | 電気半田こて先 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2681683A Division JPS59153571A (ja) | 1983-02-18 | 1983-02-18 | 電気半田こて先 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111768A JPS61111768A (ja) | 1986-05-29 |
| JPS6146233B2 true JPS6146233B2 (enrdf_load_stackoverflow) | 1986-10-13 |
Family
ID=16513103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20581285A Granted JPS61111768A (ja) | 1985-09-18 | 1985-09-18 | 電気半田こて先 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111768A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179589B (zh) * | 2011-06-22 | 2012-12-12 | 沈阳建筑大学 | 折叠式自动恒温燃气烙铁 |
-
1985
- 1985-09-18 JP JP20581285A patent/JPS61111768A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61111768A (ja) | 1986-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102202323B1 (ko) | 금속-세라믹 땜납 연결을 생성하는 방법 | |
| JP2001526465A (ja) | ソリッドステートアクチュエータに外部電極を取り付ける方法 | |
| JPS594008A (ja) | 密封したガラスカプセルに入れたセラミツクコンデンサ | |
| JPS6146233B2 (enrdf_load_stackoverflow) | ||
| US4189084A (en) | Low cost assembly processes for non-linear resistors and ceramic capacitors | |
| JPS59153571A (ja) | 電気半田こて先 | |
| JP3119906B2 (ja) | 炭素系材料と金属の接合体 | |
| JP2899197B2 (ja) | セラミックヒータのリード端子接続装置 | |
| JPS59163073A (ja) | 電気半田こて先 | |
| JP2528941B2 (ja) | ファイバ導入型パッケ―ジとその気密封止方法 | |
| JPH0275189A (ja) | セラミックヒータ | |
| JP3624740B2 (ja) | セラミック電子部品 | |
| JPH0119345Y2 (enrdf_load_stackoverflow) | ||
| JP2577315B2 (ja) | 口金付管球 | |
| JPS59150664A (ja) | 電気半田こて先 | |
| JPS63178548A (ja) | 電子部品用パツケ−ジとその製造方法 | |
| JP3620061B2 (ja) | セラミックヒータ素子、セラミックヒータ及びセラミックグロープラグ | |
| JPH0313993Y2 (enrdf_load_stackoverflow) | ||
| JPH08236816A (ja) | 熱電素子 | |
| JPH0241876B2 (enrdf_load_stackoverflow) | ||
| JPS6030613Y2 (ja) | 二線式セラミツクグロ−プラグ | |
| JP4091687B2 (ja) | セラミック基板の電極接続構造 | |
| JPH0129011B2 (enrdf_load_stackoverflow) | ||
| JP2002158082A (ja) | セラミックヒーター装置 | |
| JPH03842Y2 (enrdf_load_stackoverflow) |