JPS6144442Y2 - - Google Patents
Info
- Publication number
- JPS6144442Y2 JPS6144442Y2 JP7550381U JP7550381U JPS6144442Y2 JP S6144442 Y2 JPS6144442 Y2 JP S6144442Y2 JP 7550381 U JP7550381 U JP 7550381U JP 7550381 U JP7550381 U JP 7550381U JP S6144442 Y2 JPS6144442 Y2 JP S6144442Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling body
- semiconductor element
- attached
- heat transfer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7550381U JPS6144442Y2 (enrdf_load_stackoverflow) | 1981-05-25 | 1981-05-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7550381U JPS6144442Y2 (enrdf_load_stackoverflow) | 1981-05-25 | 1981-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57188355U JPS57188355U (enrdf_load_stackoverflow) | 1982-11-30 |
JPS6144442Y2 true JPS6144442Y2 (enrdf_load_stackoverflow) | 1986-12-15 |
Family
ID=29871233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7550381U Expired JPS6144442Y2 (enrdf_load_stackoverflow) | 1981-05-25 | 1981-05-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6144442Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129593A (ja) * | 2008-11-25 | 2010-06-10 | Daikin Ind Ltd | ヒートシンク |
JP5997956B2 (ja) * | 2012-07-17 | 2016-09-28 | 東芝三菱電機産業システム株式会社 | 半導体装置 |
-
1981
- 1981-05-25 JP JP7550381U patent/JPS6144442Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57188355U (enrdf_load_stackoverflow) | 1982-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6144442Y2 (enrdf_load_stackoverflow) | ||
JPS60202956A (ja) | 回路モジユ−ル | |
US3257621A (en) | Transistor amplifiers and thermal enclosure therefor | |
JPS5627988A (en) | Semiconductor laser device | |
JPH0331092Y2 (enrdf_load_stackoverflow) | ||
JP2553083Y2 (ja) | 混成集積回路装置 | |
JPS584227Y2 (ja) | プリント基板 | |
JPH033262A (ja) | 半導体装置 | |
JPH0611579Y2 (ja) | 本質安全防爆用電気回路の放熱構造 | |
JPS5930546Y2 (ja) | プリント基板 | |
JPS6211012Y2 (enrdf_load_stackoverflow) | ||
JPH054577U (ja) | 集積回路放熱実装構造 | |
JPH0521488U (ja) | 集積回路放熱実装構造 | |
JPH0539531Y2 (enrdf_load_stackoverflow) | ||
JPS59146981U (ja) | 小形回路モジユ−ル | |
JPH04124893U (ja) | Acアダプタ電源装置 | |
JPH029445U (enrdf_load_stackoverflow) | ||
JPS5860943U (ja) | 電子部品の冷却装置 | |
JPH0536890U (ja) | 集積回路用放熱構造 | |
JPS60160594U (ja) | 印刷配線板冷却装置 | |
JPH0279051U (enrdf_load_stackoverflow) | ||
JPS6170994U (enrdf_load_stackoverflow) | ||
JPS5811287U (ja) | プリント板の取付装置 | |
JPS58206199A (ja) | プリント配線板の電子部品放熱装置 | |
JPS6287451U (enrdf_load_stackoverflow) |