JPS6144433Y2 - - Google Patents
Info
- Publication number
- JPS6144433Y2 JPS6144433Y2 JP18059178U JP18059178U JPS6144433Y2 JP S6144433 Y2 JPS6144433 Y2 JP S6144433Y2 JP 18059178 U JP18059178 U JP 18059178U JP 18059178 U JP18059178 U JP 18059178U JP S6144433 Y2 JPS6144433 Y2 JP S6144433Y2
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- transistor
- lid
- metallized
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- KWLSQQRRSAWBOQ-UHFFFAOYSA-N dipotassioarsanylpotassium Chemical compound [K][As]([K])[K] KWLSQQRRSAWBOQ-UHFFFAOYSA-N 0.000 description 5
- 230000005669 field effect Effects 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18059178U JPS6144433Y2 (cs) | 1978-12-26 | 1978-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18059178U JPS6144433Y2 (cs) | 1978-12-26 | 1978-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5596656U JPS5596656U (cs) | 1980-07-04 |
| JPS6144433Y2 true JPS6144433Y2 (cs) | 1986-12-15 |
Family
ID=29192272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18059178U Expired JPS6144433Y2 (cs) | 1978-12-26 | 1978-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144433Y2 (cs) |
-
1978
- 1978-12-26 JP JP18059178U patent/JPS6144433Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5596656U (cs) | 1980-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5656857A (en) | Semiconductor device with insulating resin layer and substrate having low sheet resistance | |
| CN217214708U (zh) | 芯片封装结构 | |
| US4266239A (en) | Semiconductor device having improved high frequency characteristics | |
| JPH0223035Y2 (cs) | ||
| JPS6144433Y2 (cs) | ||
| JP5269864B2 (ja) | 半導体装置 | |
| CA1238720A (en) | Transistor devices for microwave oscillator elements | |
| CN218959379U (zh) | 可抗干扰的贴片式电子元件 | |
| JPS6112680Y2 (cs) | ||
| JP2005057136A (ja) | 半導体装置 | |
| US4947138A (en) | Microwave oscillator devices | |
| JPS55166941A (en) | Semiconductor device | |
| JPH0563495A (ja) | 弾性表面波装置 | |
| JPS5930513Y2 (ja) | マイクロ波通信用接地型バイパスコンデンサ | |
| JPS6311735Y2 (cs) | ||
| JPS574147A (en) | Semiconductor device and its manufacturing process | |
| JPH0415245U (cs) | ||
| JPS63110756A (ja) | トランジスタの容器 | |
| JPS5942456B2 (ja) | 混成集積回路装置 | |
| JPH0445247Y2 (cs) | ||
| JPH0752760B2 (ja) | 半導体装置用パッケ−ジ | |
| JPS57112056A (en) | Semiconductor device | |
| CN115940872A (zh) | 一种用于晶体振荡器的基座及晶体振荡器 | |
| JPH01296702A (ja) | 半導体パッケージ | |
| JPH03124050A (ja) | 高周波素子用パッケージ |