JPS614265A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS614265A
JPS614265A JP59125763A JP12576384A JPS614265A JP S614265 A JPS614265 A JP S614265A JP 59125763 A JP59125763 A JP 59125763A JP 12576384 A JP12576384 A JP 12576384A JP S614265 A JPS614265 A JP S614265A
Authority
JP
Japan
Prior art keywords
oxide film
semiconductor substrate
semiconductor
wiring conductor
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59125763A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345898B2 (enExample
Inventor
Kiyoshi Nishimura
清 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59125763A priority Critical patent/JPS614265A/ja
Publication of JPS614265A publication Critical patent/JPS614265A/ja
Publication of JPH0345898B2 publication Critical patent/JPH0345898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W20/495—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/59—
    • H10W72/983—

Landscapes

  • Wire Bonding (AREA)
JP59125763A 1984-06-19 1984-06-19 半導体集積回路装置 Granted JPS614265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59125763A JPS614265A (ja) 1984-06-19 1984-06-19 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59125763A JPS614265A (ja) 1984-06-19 1984-06-19 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS614265A true JPS614265A (ja) 1986-01-10
JPH0345898B2 JPH0345898B2 (enExample) 1991-07-12

Family

ID=14918216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59125763A Granted JPS614265A (ja) 1984-06-19 1984-06-19 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS614265A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161923A (en) * 1980-05-06 1981-12-12 Ushio Electric Inc Sterilizer for film
JP2008168518A (ja) * 2007-01-12 2008-07-24 Advanced Telecommunication Research Institute International リマインダ装置
JP2024106763A (ja) * 2023-01-27 2024-08-08 三菱電機株式会社 ボンディングパッド、集積回路素子、及び集積回路装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039470A (enExample) * 1973-08-09 1975-04-11
JPS5239378A (en) * 1975-09-23 1977-03-26 Seiko Epson Corp Silicon-gated mos type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039470A (enExample) * 1973-08-09 1975-04-11
JPS5239378A (en) * 1975-09-23 1977-03-26 Seiko Epson Corp Silicon-gated mos type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161923A (en) * 1980-05-06 1981-12-12 Ushio Electric Inc Sterilizer for film
JP2008168518A (ja) * 2007-01-12 2008-07-24 Advanced Telecommunication Research Institute International リマインダ装置
JP2024106763A (ja) * 2023-01-27 2024-08-08 三菱電機株式会社 ボンディングパッド、集積回路素子、及び集積回路装置

Also Published As

Publication number Publication date
JPH0345898B2 (enExample) 1991-07-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term