JPS6141243Y2 - - Google Patents
Info
- Publication number
- JPS6141243Y2 JPS6141243Y2 JP18031081U JP18031081U JPS6141243Y2 JP S6141243 Y2 JPS6141243 Y2 JP S6141243Y2 JP 18031081 U JP18031081 U JP 18031081U JP 18031081 U JP18031081 U JP 18031081U JP S6141243 Y2 JPS6141243 Y2 JP S6141243Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- case
- working fluid
- hollow chamber
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012530 fluid Substances 0.000 claims description 30
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18031081U JPS5885353U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18031081U JPS5885353U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5885353U JPS5885353U (ja) | 1983-06-09 |
JPS6141243Y2 true JPS6141243Y2 (enrdf_load_stackoverflow) | 1986-11-25 |
Family
ID=29976786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18031081U Granted JPS5885353U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5885353U (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6191561B2 (ja) * | 2014-08-28 | 2017-09-06 | 東芝ホームテクノ株式会社 | シート型ヒートパイプ |
-
1981
- 1981-12-03 JP JP18031081U patent/JPS5885353U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5885353U (ja) | 1983-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5936827B2 (ja) | 集積回路素子の冷却装置 | |
JP2004523920A5 (enrdf_load_stackoverflow) | ||
CA2440522A1 (en) | Electronic module including a cooling substrate and related methods | |
JP2010109036A (ja) | プリント基板及び回路装置 | |
JP2012114393A (ja) | 放熱基板及びその製造方法 | |
JPS6141243Y2 (enrdf_load_stackoverflow) | ||
JPS6141242Y2 (enrdf_load_stackoverflow) | ||
JPS6219075B2 (enrdf_load_stackoverflow) | ||
JPS6239358B2 (enrdf_load_stackoverflow) | ||
KR200263467Y1 (ko) | 써멀 베이스를 이용한 통신장비용 방열장치 | |
JP2599464B2 (ja) | ヒートパイプ内蔵型実装基板 | |
KR101281043B1 (ko) | 히트 싱크 | |
JPS6235593B2 (enrdf_load_stackoverflow) | ||
JPS60133290A (ja) | ヒ−トパイプ | |
JP3358844B2 (ja) | チップ型抵抗器 | |
JP3217757B2 (ja) | ヒートシンクとそれを用いた冷却構造 | |
CN216930674U (zh) | 一种导热通畅的电路板 | |
JPH08125364A (ja) | 半導体部品の放熱構造 | |
JP2001156229A (ja) | ヒートシンク及びその製造方法 | |
CN218162997U (zh) | 一种防翘曲的高性能陶瓷基板 | |
CN213818360U (zh) | 一种高效散热的蓝牙电路板 | |
JPH0225242Y2 (enrdf_load_stackoverflow) | ||
CN214852110U (zh) | 一种应用于高精度盲孔电路的散热结构装置 | |
JPS5854506B2 (ja) | ホウネツソウチ | |
WO2023204919A1 (en) | Surface mount wicking structure |