JPS6141242Y2 - - Google Patents
Info
- Publication number
- JPS6141242Y2 JPS6141242Y2 JP18030981U JP18030981U JPS6141242Y2 JP S6141242 Y2 JPS6141242 Y2 JP S6141242Y2 JP 18030981 U JP18030981 U JP 18030981U JP 18030981 U JP18030981 U JP 18030981U JP S6141242 Y2 JPS6141242 Y2 JP S6141242Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wick
- case
- ceramic
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030981U JPS5885352U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030981U JPS5885352U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5885352U JPS5885352U (ja) | 1983-06-09 |
| JPS6141242Y2 true JPS6141242Y2 (enrdf_load_stackoverflow) | 1986-11-25 |
Family
ID=29976784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18030981U Granted JPS5885352U (ja) | 1981-12-03 | 1981-12-03 | セラミツクヒ−トシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885352U (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08186209A (ja) * | 1994-12-28 | 1996-07-16 | Nippondenso Co Ltd | 沸騰冷却装置 |
-
1981
- 1981-12-03 JP JP18030981U patent/JPS5885352U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5885352U (ja) | 1983-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100808356B1 (ko) | 부품 실장 기판 구조와 그 제조 방법 | |
| JP5955343B2 (ja) | 半導体装置とその製造方法 | |
| JP6044473B2 (ja) | 電子装置およびその電子装置の製造方法 | |
| CN211831672U (zh) | 一种电机控制器及电动两轮车 | |
| JP2001326306A (ja) | 配線ブロックの収納構造 | |
| CN201115232Y (zh) | 散热模块 | |
| JPS6141242Y2 (enrdf_load_stackoverflow) | ||
| JPS6219075B2 (enrdf_load_stackoverflow) | ||
| JPS6141243Y2 (enrdf_load_stackoverflow) | ||
| US6161280A (en) | Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device | |
| CN115003121A (zh) | 一种可实现电子元器件集中散热及密封的结构及制备方法 | |
| JPH0263146A (ja) | プリント板に装着する発熱部品の放熱構造 | |
| JPS6235593B2 (enrdf_load_stackoverflow) | ||
| WO2019216238A1 (ja) | 回路構成体、及び電気接続箱 | |
| JP2798656B2 (ja) | 回路基板 | |
| JPH08125364A (ja) | 半導体部品の放熱構造 | |
| JP2599464B2 (ja) | ヒートパイプ内蔵型実装基板 | |
| CN222939917U (zh) | 气冷式散热器 | |
| JP2019160881A (ja) | 半導体装置 | |
| JPS5854506B2 (ja) | ホウネツソウチ | |
| JPH0530392Y2 (enrdf_load_stackoverflow) | ||
| KR910004738Y1 (ko) | 방열판을 구비한 인쇄회로기판 | |
| JPH0325991A (ja) | プリント配線用基板 | |
| JPH01220889A (ja) | 電子装置 | |
| CN117098373A (zh) | 一种控制器中功率器件的散热结构 |