JPS6141093Y2 - - Google Patents

Info

Publication number
JPS6141093Y2
JPS6141093Y2 JP1980013165U JP1316580U JPS6141093Y2 JP S6141093 Y2 JPS6141093 Y2 JP S6141093Y2 JP 1980013165 U JP1980013165 U JP 1980013165U JP 1316580 U JP1316580 U JP 1316580U JP S6141093 Y2 JPS6141093 Y2 JP S6141093Y2
Authority
JP
Japan
Prior art keywords
dry plate
mask dry
mask
holding frame
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980013165U
Other languages
Japanese (ja)
Other versions
JPS56115155U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980013165U priority Critical patent/JPS6141093Y2/ja
Publication of JPS56115155U publication Critical patent/JPS56115155U/ja
Application granted granted Critical
Publication of JPS6141093Y2 publication Critical patent/JPS6141093Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は電子ビーム露光に先だつて被露光マス
ク乾板上にレジストを塗布するにあたり、被露光
マスク乾板を保持するためのマスク乾板用保持装
置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mask dry plate holding device for holding a mask dry plate to be exposed when a resist is applied onto the exposed mask dry plate prior to electron beam exposure.

マスク乾板は、通常ガラス板の上にクロムある
いはクロム塩等の被膜が形成されており、このマ
スク乾板上に極めて微細なパターンを形成する場
合には、マスク乾板上をレジスト膜で覆い電子ビ
ーム露光を行なう方法が採られている。ところ
で、電子ビーム露光時にはマスク乾板を完全に接
地することによつて帯電を防止する必要がある
が、上記のレジスト膜の塗布を通常の回転塗布法
の下で行なうとマスク乾板の表面全域がレジスト
膜により覆われてしまい接地面の確保ができな
い。
A mask dry plate is usually a glass plate with a film of chromium or chromium salt formed on it, and when forming extremely fine patterns on this mask dry plate, the mask dry plate is covered with a resist film and exposed to electron beams. A method has been adopted to do this. Incidentally, during electron beam exposure, it is necessary to completely ground the mask dry plate to prevent charging. However, if the above-mentioned resist film is applied using the normal spin coating method, the entire surface of the mask dry plate will be coated with resist. It is covered with a membrane, making it impossible to secure a ground surface.

このため、従来は、通常の回転塗布法を駆使し
てマスク乾板の表面全域に一様な厚みのレジスト
膜を形成したのち、レジスト膜の特定域を物理的
あるいは化学的に除去して接地面を確保すること
が行なわれていた。この方法によれば、接地面の
確保は確実になされるものの、レジスト膜の除去
工程で有効レジスト塗布面が汚染されるおそれが
あり、このため描画精度の低下する不都合が生じ
るとともに、また、塵埃の発生源ともなる。
For this reason, in the past, a resist film with a uniform thickness was formed on the entire surface of a mask dry plate using the usual spin coating method, and then specific areas of the resist film were physically or chemically removed to form a contact surface. It was done to ensure that. According to this method, although a grounding surface is reliably secured, there is a risk that the effective resist coated surface may be contaminated during the resist film removal process, resulting in the inconvenience of lowering the writing accuracy and also causing the problem of dust. It is also a source of

本考案は、以上説明したきた不都合に鑑みてな
されたもので、通常の回転塗布装置の使用の下で
マスク乾板の特定域にレジスト膜の未塗布部分を
残すこのできる保持装置を提供するものである。
以下に図面を参照して本考案のマスク乾板用保持
装置について詳しく説明する。
The present invention was devised in view of the above-mentioned disadvantages, and provides a holding device that can leave uncoated portions of the resist film in specific areas of the mask dry plate when using a normal spin coating device. be.
The mask dry plate holding device of the present invention will be described in detail below with reference to the drawings.

第1図は、本考案のマスク乾板用保持装置によ
りマスク乾板を保持した状態を示す上面図、第2
図は第1図のX−X線に沿つた断面図、そして第
3図は下面図である。図において、1は金属また
は合成樹脂によつて形成された保持枠であり、上
側開口端2の面積が点線で示すマスク乾板3の面
積よりも小さく、一方、下側開口部4の面積がマ
スク乾板3の面積より僅かに大きく選定されてお
り、マスク乾板3は下側開口部をガイドとして保
持枠1の凹所に下方から嵌入されている。さらに
保持枠の上面側の4辺には回転塗布時に不要なレ
ジストを飛散させるための切欠部51,52,5
3,54が形成され、4隔61,62,63,6
4が肉厚部とされている。また、保持枠1の下面
側には第3図で示すように嵌入されたマスク乾板
3の離脱を防止するための板状ストツパ71,7
2,73,74がとりつけられているが、これら
は、角柱状のストツパ支持体81,82,83,
84ならびに円柱状のストツパ支持体91,9
9,93,94のそれぞれに形成した切欠部と保
持枠の下面との間に形成される隙間へその一部分
が嵌め込まれている。
FIG. 1 is a top view showing a mask dry plate held by the mask dry plate holding device of the present invention;
The figure is a sectional view taken along the line X--X of FIG. 1, and FIG. 3 is a bottom view. In the figure, reference numeral 1 denotes a holding frame made of metal or synthetic resin, and the area of the upper open end 2 is smaller than the area of the mask dry plate 3 shown by the dotted line, while the area of the lower opening 4 is smaller than the area of the mask dry plate 3. The area of the mask dry plate 3 is selected to be slightly larger than the area of the dry plate 3, and the mask dry plate 3 is fitted into the recess of the holding frame 1 from below using the lower opening as a guide. Furthermore, the four sides of the upper surface of the holding frame have notches 51, 52, 5 for scattering unnecessary resist during spin coating.
3, 54 are formed, 4 intervals 61, 62, 63, 6
4 is the thick part. Further, on the lower surface side of the holding frame 1, as shown in FIG.
2, 73, 74 are attached, but these are prismatic stopper supports 81, 82, 83,
84 and cylindrical stopper supports 91,9
A portion thereof is fitted into the gap formed between the notch formed in each of 9, 93, and 94 and the lower surface of the holding frame.

なお、板状ストツパ71〜74のそれぞれは反
りのないものであつてもよいが、たとえば、弾性
金属板で、しかも反りを持たせたもので板状スト
ツパを形成するならば、その弾性力でマスク乾板
3を下方から上方へ向つて押圧することができ、
したがつて、保持枠1に対してマスク乾板をより
確実に密着固定させることができる。
Note that each of the plate-shaped stoppers 71 to 74 may be unwarped, but if the plate-shaped stopper is formed of an elastic metal plate with a warp, for example, the elastic force The mask dry plate 3 can be pressed from below to above,
Therefore, the mask dry plate can be tightly fixed to the holding frame 1 more reliably.

以上説明した構成のマスク乾板用保持装置によ
つて図示する状態でマスク乾板を保持したのち、
これを周知の回転塗布装置へ装着し、保持枠1の
上側開口部2の内に露呈するマスク乾板面にレジ
ストを塗布する。レジストの不要なものは、上述
したように保持枠の切欠部51〜54から確実に
飛散し、マスク乾板の露呈面には均一な厚さのレ
ジスト膜が形成されるとともに、保持枠1によつ
て覆われている部分にはレジストの未塗布部分が
形成される。
After holding the mask plate in the state shown in the figure with the mask plate holding device configured as described above,
This is mounted on a well-known rotary coating device, and a resist is applied to the surface of the mask dry plate exposed inside the upper opening 2 of the holding frame 1. As described above, unnecessary resist is surely scattered from the notches 51 to 54 of the holding frame, and a resist film of uniform thickness is formed on the exposed surface of the mask dry plate, and the resist is removed by the holding frame 1. A resist-unapplied portion is formed in the covered portion.

第4図は、本考案のマスク乾板用保持装置を用
いてレジスト膜が形成されたマスク乾板を示す斜
視図であり、図示するように第1図で示した上側
開口部2の形状と同一の形状をもつレジスト膜1
0と、レジスト膜10が存在せず電子ビーム露光
時に接地面となる未塗布部分11を有するマスク
乾板3が得られる。
FIG. 4 is a perspective view showing a mask dry plate on which a resist film is formed using the mask dry plate holding device of the present invention, and as shown in the figure, the shape of the upper opening 2 is the same as that shown in FIG. Resist film 1 with shape
0, a mask dry plate 3 having no resist film 10 and an uncoated portion 11 which becomes a ground plane during electron beam exposure is obtained.

以上説明したところから明らかなように、本考
案のマスク乾板用保持装置によれば、レジストの
塗布工程でマスク乾板上にレジスト塗布部と未塗
布部を同時に形成することができるため、従来の
ように、レジスト膜の形成後にレジスト膜の一部
を除去して接地面を得る必要がなく、したがつ
て、有効レジスト膜の汚染することなく接地面を
うることができ高い描画精度を得ることができ
る。また、塵埃の発生源がなくなるため、作業環
境の清浄化がはかられ高密度半導体装置の製造等
に大きく寄与するものである。
As is clear from the above explanation, according to the mask dry plate holding device of the present invention, resist coated areas and uncoated areas can be simultaneously formed on the mask dry plate during the resist coating process, unlike conventional methods. In addition, it is not necessary to remove a part of the resist film after forming the resist film to obtain a ground plane, and therefore, the ground plane can be obtained without contaminating the effective resist film, and high drawing accuracy can be obtained. can. Furthermore, since there is no source of dust, the working environment can be cleaned, which greatly contributes to the production of high-density semiconductor devices.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図、第3図は本考案のマスク乾板
保持装置の構成と同装置でマスク乾板を保持した
状態を示す上面図、X−X線断面図、下面図、第
4図はレジスト膜の形成されたマスク乾板を示す
斜視図である。 1……保持枠、2……上側開口部、3……マス
ク乾板、4……下側開口部、51〜54……切欠
部、71〜74……板上ストツパ、81〜84…
…角柱状のストツパ支持体、91〜94……円柱
状のストツパ支持体、10……レジスト膜、11
……未塗布部分(接地面)。
Figures 1, 2, and 3 are a top view, an X-X cross-sectional view, and a bottom view showing the structure of the mask plate holding device of the present invention and the state in which the device holds a mask plate; FIG. 2 is a perspective view showing a mask dry plate on which a resist film is formed. DESCRIPTION OF SYMBOLS 1...Holding frame, 2...Upper opening, 3...Mask dry plate, 4...Lower opening, 51-54...Notch, 71-74...Plate stopper, 81-84...
...Prismatic stopper support, 91-94...Cylindrical stopper support, 10...Resist film, 11
...Uncoated area (ground surface).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マスク乾板の形状より小さく選定された上側開
口端と、マスク乾板の形状より僅かに大きな下側
開口端を持つマスク乾板収納部を形成する保持
枠、同保持枠の上面側に形成されたレジスト飛散
用切欠部、前記保持枠の下面側に付設されたスト
ツパ支持体、このストツパ支持体で支持され前記
マスク乾板収納部へ嵌入されるマスク乾板の離脱
防止ストツパを備えたことを特徴とするマスク乾
板用保持装置。
A holding frame that forms a mask dry plate storage section with an upper open end that is selected to be smaller than the shape of the mask dry plate and a lower open end that is slightly larger than the shape of the mask dry plate, and a resist scattering formed on the upper surface side of the holding frame. a stopper support attached to the lower surface side of the holding frame, and a stopper for preventing detachment of the mask dry plate that is supported by the stopper support and inserted into the mask dry plate storage section. holding device.
JP1980013165U 1980-02-04 1980-02-04 Expired JPS6141093Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980013165U JPS6141093Y2 (en) 1980-02-04 1980-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980013165U JPS6141093Y2 (en) 1980-02-04 1980-02-04

Publications (2)

Publication Number Publication Date
JPS56115155U JPS56115155U (en) 1981-09-04
JPS6141093Y2 true JPS6141093Y2 (en) 1986-11-22

Family

ID=29609709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980013165U Expired JPS6141093Y2 (en) 1980-02-04 1980-02-04

Country Status (1)

Country Link
JP (1) JPS6141093Y2 (en)

Also Published As

Publication number Publication date
JPS56115155U (en) 1981-09-04

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