JPS59117052U - Wafer holding device - Google Patents
Wafer holding deviceInfo
- Publication number
- JPS59117052U JPS59117052U JP980283U JP980283U JPS59117052U JP S59117052 U JPS59117052 U JP S59117052U JP 980283 U JP980283 U JP 980283U JP 980283 U JP980283 U JP 980283U JP S59117052 U JPS59117052 U JP S59117052U
- Authority
- JP
- Japan
- Prior art keywords
- disk
- wafer
- ion beam
- holding device
- wafer holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はイオン打込装置の原理図、第２図は従来方式の
説明図、第３図は本考案の一実施例の断面図、第４図は
第３図のＰ失権平面図である。
フ・・・イオンビーム、６・・・回転円板、１２・・・
回転円盤軸、２３・・・ウェハ押付板。Fig. 1 is a diagram of the principle of the ion implantation device, Fig. 2 is an explanatory diagram of the conventional system, Fig. 3 is a sectional view of an embodiment of the present invention, and Fig. 4 is a plan view of the P loss of Fig. 3. . F...Ion beam, 6...Rotating disk, 12...
Rotating disk shaft, 23... wafer pressing plate.
Claims (1)
ハにほぼ直角にイオンビームを照射し円盤を回転すると
同時に、イオンビームの中心と円盤の中心を結ぶ直径方
向に、円盤を往復運動させるか、照射イオンビームを掃
引して、ウェハの表面に均一にイオンを注入させる、回
転円盤方式イオン打込装置に於て、ウェハと接触する円
盤の表面に内径φ４、外径φ２で厚さ方向にＲ１の曲率
を持つたリング状の凸面を形成し、その面をウェハとの
接触基準面としたことを特徴とするウェハ保持装置。Multiple wafers are mounted along the circumference of the disk, and the wafers are irradiated with an ion beam almost perpendicularly to rotate the disk. At the same time, the disk is reciprocated in the diametrical direction connecting the center of the ion beam and the center of the disk. In a rotating disk type ion implantation device, which sweeps the irradiation ion beam and uniformly implants ions onto the surface of the wafer, the surface of the disk in contact with the wafer has an inner diameter of 4 mm and an outer diameter of 2 mm, and has a thickness of 2 mm. A wafer holding device characterized by forming a ring-shaped convex surface having a curvature of R1 in the direction, and using that surface as a reference surface for contact with a wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP980283U JPS59117052U (en) | 1983-01-28 | 1983-01-28 | Wafer holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP980283U JPS59117052U (en) | 1983-01-28 | 1983-01-28 | Wafer holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117052U true JPS59117052U (en) | 1984-08-07 |
Family
ID=30141249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP980283U Pending JPS59117052U (en) | 1983-01-28 | 1983-01-28 | Wafer holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117052U (en) |
-
1983
- 1983-01-28 JP JP980283U patent/JPS59117052U/en active Pending
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