JPH069487Y2 - Wafer edge exposure equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a semiconductor substrate typified by a silicon wafer in the step of forming a fine pattern in the processing of components in ICs, LSIs, and other electronic elements,
Alternatively, the present invention relates to a wafer peripheral exposure apparatus for removing an unnecessary resist in the peripheral portion of a substrate such as a dielectric, a metal or an insulator coated on the substrate in a developing process.

[Conventional technology]

In the manufacturing process of ICs, LSIs, etc., when forming a fine pattern, a resist is applied to the surface of a silicon wafer or the like, and then exposure and development are performed to form a resist pattern. Next, using this resist pattern as a mask, processing such as ion implantation, etching and lift-off is performed.

Usually, the resist is applied by a spin coating method. The spin coating method is a method of rotating a wafer while pouring the resist on the center position of the wafer surface and applying a resist to the entire surface of the wafer by centrifugal force. However, in most cases, the circuit pattern cannot be accurately drawn on the peripheral portion of the wafer, and the yield is poor even if it can be drawn. The resist around the wafer is a resist that is almost unnecessary for forming a circuit pattern. The resist-coated wafer is transported by various processing steps and various methods. At this time, the peripheral portion of the wafer is mechanically grasped and held, or the peripheral portion of the wafer is rubbed against a container such as a wafer cassette. At this time, if unnecessary resist around the wafer is removed and adheres to the pattern forming portion of the wafer,
Correct pattern formation cannot be performed and the yield is reduced.

It is a serious problem that the unnecessary resist remaining on the peripheral portion of the wafer becomes "dust" and the yield is lowered, especially in the present situation where the integrated circuit is highly functionalized and miniaturized.

Therefore, recently, in addition to the exposure step for pattern formation, separate exposure is performed to remove unnecessary resist in the peripheral portion of the wafer in the development step.

FIGS. 3A and 3B are schematic explanatory views of a conventional wafer peripheral exposure apparatus for removing such unnecessary resist.

The wafer 70 is placed on the rotary stage 71 by a transfer system (not shown), the rotary stage 71 is rotated, and the sensor 7
2, the orientation flat 7 of the wafer 70
3 is detected, the rotation is stopped when the orientation flat 73 reaches a substantially predetermined position, and then the orientation flat contact plate 74a and the pins 74b, 74c, 7
4d performs centering and positioning of the orientation flat 73.

After the above-mentioned positioning, while rotating the wafer 70, one end 75a thereof is arranged at a position for receiving the radiated light from the light source portion including the mirror 78, the lamp 79, the shutter 80, etc., and the other end 75b thereof is arranged in the vicinity of the periphery of the wafer 70. With the optical fiber 81, the wafer peripheral portion 7 is passed through the lens system.
6 is exposed. In this case, a ring-shaped weak "striped pattern" 77 occurs due to multiple repeated reflections and leakage of light in the lens system centering on the circular irradiation area E. Therefore, if the irradiation intensity of the irradiation area is increased in order to shorten the processing time, this pattern portion is also exposed, and even if an attempt is made to make a sharp exposure boundary P, a good result cannot necessarily be obtained.

[Purpose of device]

An object of the present invention is to provide a wafer peripheral exposure apparatus that does not cause the ring-shaped stripe pattern.

[Means for achieving the purpose]

In order to achieve the above object, in the present invention, a wafer peripheral exposure apparatus includes a light source section and an optical fiber whose one end is in a position to receive light emitted from the light source section and whose other end is located near the surface of the wafer peripheral section. , A lens system arranged at the other end, and a light-shielding means arranged between the lens system and the surface of the peripheral portion of the wafer. The light-shielding means is composed of a cylindrical portion and a bottom plate provided with an aperture. To do.

[Action]

Since the light leakage is blocked by the tube portion and the multiple reflections are prevented by the bottom plate, the ring-shaped stripe pattern can be erased.

〔Example〕

FIG. 1 is an explanatory view of an embodiment of the present invention, and FIG. 2 (a).
(B) is an explanatory view of the light shielding means, and FIG. 2 (a) is partially cut out. In the figure, reference numeral 82 denotes a lens system provided so as to cover the other end 75b of the optical fiber 81 so that the light emitted from the light source unit is condensed on the peripheral portion 76 of the wafer 70. Then, bundle the other end of the optical fiber into a square, and make the irradiation area square,
Therefore, the aperture 1 of the light blocking means is also made square.
The light-shielding means is composed of a hollow rectangular tube 2 and a bottom plate 3, and is coated with a black paint which has less reflection. The cylinder 2 does not necessarily have to have four surfaces, and even if there is not one surface, if the part without the surface is attached so as to face the wafer 70 toward the reflection side, the effect of preventing the stripe pattern on the wafer 70 is the same. The gap d between the wafer 70 and the bottom plate 3 is 1 mm or less, which is about 0.
It is about 5 mm to 0.2 mm, and if a black paint is applied to the bottom plate, the effect of preventing a stripe pattern is great.

[Effect of device]

As described above, when exposing the peripheral portion of the wafer from the other end of the optical fiber through the lens system, the light shielding means having the bottom plate extremely close to the wafer surface is provided between the lens system and the wafer and provided on the bottom plate. Since the aperture is formed similar to the bundled shape of the fibers and is coated with black paint, light leakage, stray light, multiple reflections, etc. coming through the lens system are suppressed, and therefore the ring centered around the irradiation area. The striped pattern can be reliably suppressed. In particular, if the irradiation area is rectangular, it is convenient to make the exposure amount uniform in the area.

This wafer edge exposure apparatus can also be used for exposure of polar regions other than the peripheral portion by using the light shielding means of FIG. 2 (a).

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a main part of a wafer exposure apparatus of the present invention, FIGS. 2 (a) and 2 (b) are explanatory views of a light shielding means, and FIGS. 3 (a) and 3 (b) are conventional wafers. It is explanatory drawing of a peripheral exposure apparatus. In the figure, 1 is an aperture, 2 is a square tube, 3 is a bottom plate, and 7
Reference numeral 0 is a wafer, 76 is a peripheral portion of the wafer, 81 is an optical fiber, 82 is a lens system, and 83 is a light shielding means.

Claims (1)

[Scope of utility model registration request] 1. A light source section, an optical fiber having one end at a position for receiving light emitted from the light source section and the other end located near a surface of a peripheral portion of a wafer, a lens system arranged at the other end, 1. A wafer peripheral exposure apparatus comprising: a light shielding means arranged between a lens system and a surface of a peripheral portion of the wafer, wherein the light shielding means comprises a cylindrical portion and a bottom plate provided with an aperture.