JPH0260229U - - Google Patents
Info
- Publication number
- JPH0260229U JPH0260229U JP13818188U JP13818188U JPH0260229U JP H0260229 U JPH0260229 U JP H0260229U JP 13818188 U JP13818188 U JP 13818188U JP 13818188 U JP13818188 U JP 13818188U JP H0260229 U JPH0260229 U JP H0260229U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- shielding means
- lens system
- exposure apparatus
- source section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013307 optical fiber Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 2
Description
第１図は、本考案のウエハ露光装置の要部の概
略説明図、第２図ａ，ｂは遮光手段の説明図、第
３図ａ，ｂは従来のウエハ周辺露光方法の説明図
である。
図において、１はアパーチヤ、２は角筒、３は
底板、７０はウエハ、７６はウエハの周辺部、８
１はオプチカルフアイバ、８２はレンズ系、８３
は遮光手段を示す。
FIG. 1 is a schematic illustration of the main parts of the wafer exposure apparatus of the present invention, FIGS. 2 a and b are illustrations of a light shielding means, and FIGS. 3 a and b are illustrations of a conventional wafer peripheral exposure method. . In the figure, 1 is an aperture, 2 is a rectangular cylinder, 3 is a bottom plate, 70 is a wafer, 76 is a peripheral part of the wafer, and 8
1 is an optical fiber, 82 is a lens system, 83
indicates a light shielding means.
Claims (1)
れる位置にあり他端がウエハ表面近傍に位置した
オプチカルフアイバと、該他端に配置されたレン
ズ系と、該レンズ系とウエハ表面との間に配置さ
れた遮光手段とよりなり、該遮光手段は、筒部と
アパーチヤを設けた底板とよりなることを特徴と
するウエハ露光装置。 a light source section, an optical fiber whose one end is positioned to receive emitted light from the light source section and whose other end is located near the wafer surface, a lens system disposed at the other end, and between the lens system and the wafer surface. 1. A wafer exposure apparatus comprising: a light shielding means disposed in the wafer exposure apparatus, the light shielding means comprising a cylindrical portion and a bottom plate provided with an aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988138181U JPH069487Y2 (en) | 1988-10-25 | 1988-10-25 | Wafer edge exposure equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988138181U JPH069487Y2 (en) | 1988-10-25 | 1988-10-25 | Wafer edge exposure equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260229U true JPH0260229U (en) | 1990-05-02 |
| JPH069487Y2 JPH069487Y2 (en) | 1994-03-09 |
Family
ID=31400283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988138181U Expired - Lifetime JPH069487Y2 (en) | 1988-10-25 | 1988-10-25 | Wafer edge exposure equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069487Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060724A (en) * | 1983-09-14 | 1985-04-08 | Toshiba Corp | Semiconductor exposing device |
| JPS6173330A (en) * | 1984-09-18 | 1986-04-15 | Nec Corp | Equipment for manufacturing semiconductor device |
-
1988
- 1988-10-25 JP JP1988138181U patent/JPH069487Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060724A (en) * | 1983-09-14 | 1985-04-08 | Toshiba Corp | Semiconductor exposing device |
| JPS6173330A (en) * | 1984-09-18 | 1986-04-15 | Nec Corp | Equipment for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069487Y2 (en) | 1994-03-09 |