JPS6140137B2 - - Google Patents

Info

Publication number
JPS6140137B2
JPS6140137B2 JP1847779A JP1847779A JPS6140137B2 JP S6140137 B2 JPS6140137 B2 JP S6140137B2 JP 1847779 A JP1847779 A JP 1847779A JP 1847779 A JP1847779 A JP 1847779A JP S6140137 B2 JPS6140137 B2 JP S6140137B2
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor substrate
metal film
group
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1847779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55111148A (en
Inventor
Fusaji Shoji
Kazunari Takemoto
Ryoichi Sudo
Takeshi Watanabe
Ataru Yokono
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1847779A priority Critical patent/JPS55111148A/ja
Publication of JPS55111148A publication Critical patent/JPS55111148A/ja
Publication of JPS6140137B2 publication Critical patent/JPS6140137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1847779A 1979-02-21 1979-02-21 Semiconductor device Granted JPS55111148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1847779A JPS55111148A (en) 1979-02-21 1979-02-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1847779A JPS55111148A (en) 1979-02-21 1979-02-21 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55111148A JPS55111148A (en) 1980-08-27
JPS6140137B2 true JPS6140137B2 (enrdf_load_html_response) 1986-09-08

Family

ID=11972714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1847779A Granted JPS55111148A (en) 1979-02-21 1979-02-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55111148A (enrdf_load_html_response)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613128B2 (ja) * 1990-10-01 1997-05-21 三菱電機株式会社 半導体装置
US6143855A (en) * 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6218497B1 (en) 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6218020B1 (en) 1999-01-07 2001-04-17 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with high organic content
US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
US10066123B2 (en) 2013-12-09 2018-09-04 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US10392538B2 (en) 2014-06-20 2019-08-27 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
WO2015195391A1 (en) 2014-06-20 2015-12-23 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
CN106661228A (zh) 2014-06-20 2017-05-10 3M创新有限公司 包括倍半硅氧烷聚合物芯和倍半硅氧烷聚合物外层的可固化聚合物及方法
KR20170063735A (ko) 2014-09-22 2017-06-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 실세스퀴옥산 중합체 코어와 실세스퀴옥산 중합체 외층, 및 반응성 기를 포함하는 경화성 중합체
US9957416B2 (en) 2014-09-22 2018-05-01 3M Innovative Properties Company Curable end-capped silsesquioxane polymer comprising reactive groups

Also Published As

Publication number Publication date
JPS55111148A (en) 1980-08-27

Similar Documents

Publication Publication Date Title
US4472730A (en) Semiconductor device having an improved moisture resistance
US4908685A (en) Magnetoelectric transducer
JPS6140137B2 (enrdf_load_html_response)
JPS628035B2 (enrdf_load_html_response)
JP3170141B2 (ja) 半導体装置
US2829320A (en) Encapsulation for electrical components and method of manufacture
JPS6077446A (ja) 封止半導体装置
JPS63213347A (ja) 半導体装置
JPH0680695B2 (ja) 半導体装置
JPH0864759A (ja) 樹脂封止型パワーモジュール装置及びその製法
JPH09237869A (ja) 樹脂封止型パワーモジュール装置及びその製造方法
JPH0235467B2 (enrdf_load_html_response)
JPH0382059A (ja) 樹脂封止型半導体装置
JPH0210858A (ja) 樹脂封止型半導体装置
JPS5923550A (ja) 樹脂封止半導体装置
JPH03116960A (ja) 半導体装置
JPH0760848B2 (ja) 電子チップ部品のテーピング包装方法
JPS6025902B2 (ja) 樹脂封止型半導体装置
JPH0230171A (ja) 半導体装置
JPH02198159A (ja) 半導体装置
JPS6148266B2 (enrdf_load_html_response)
JPS62241357A (ja) 半導体装置
JPS5922377B2 (ja) 半導体装置
JPS59210645A (ja) 樹脂封止型半導体装置の製法
JPH04251967A (ja) 樹脂封止型半導体装置