JPS6138638B2 - - Google Patents
Info
- Publication number
- JPS6138638B2 JPS6138638B2 JP6583077A JP6583077A JPS6138638B2 JP S6138638 B2 JPS6138638 B2 JP S6138638B2 JP 6583077 A JP6583077 A JP 6583077A JP 6583077 A JP6583077 A JP 6583077A JP S6138638 B2 JPS6138638 B2 JP S6138638B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor
- metal layer
- board
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 20
- 239000010949 copper Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583077A JPS541880A (en) | 1977-06-06 | 1977-06-06 | Method of making print circuit board and carrier plate therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583077A JPS541880A (en) | 1977-06-06 | 1977-06-06 | Method of making print circuit board and carrier plate therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS541880A JPS541880A (en) | 1979-01-09 |
| JPS6138638B2 true JPS6138638B2 (de) | 1986-08-30 |
Family
ID=13298322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6583077A Granted JPS541880A (en) | 1977-06-06 | 1977-06-06 | Method of making print circuit board and carrier plate therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS541880A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265397A (ja) * | 1985-09-17 | 1987-03-24 | 旭化成株式会社 | フレキシブル配線板の製造方法 |
| JPS6356991A (ja) * | 1986-08-27 | 1988-03-11 | 三井金属鉱業株式会社 | プリント配線板の製造法 |
| JPH02122691A (ja) * | 1988-11-01 | 1990-05-10 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
| JPH02164094A (ja) * | 1988-12-19 | 1990-06-25 | Matsushita Electric Ind Co Ltd | 印刷配線板の製造方法 |
-
1977
- 1977-06-06 JP JP6583077A patent/JPS541880A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS541880A (en) | 1979-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006278774A (ja) | 両面配線基板の製造方法、両面配線基板、およびそのベース基板 | |
| US6562250B1 (en) | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | |
| JPS6138638B2 (de) | ||
| JP3500977B2 (ja) | 両面回路板の製造方法 | |
| JP4137279B2 (ja) | プリント配線板及びその製造方法 | |
| JPH05259639A (ja) | プリント配線板の製造方法 | |
| JPH10215072A (ja) | 多層印刷配線板の製造方法 | |
| JPH09307216A (ja) | 配線基板の製造方法及び配線基板 | |
| JP3935558B2 (ja) | パターン形成方法 | |
| JP2566424B2 (ja) | 導電性回路転写箔およびその製造法 | |
| JPS648478B2 (de) | ||
| JPS63280496A (ja) | 多層回路板の製造方法 | |
| JP3593351B2 (ja) | 多層配線基板の製造方法 | |
| JP3828205B2 (ja) | 転写用部材の製造方法及び転写用部材 | |
| JP2000294933A (ja) | 多層回路基板及びその製造方法 | |
| KR100342335B1 (ko) | 수지 적층된 배선 시트, 이를 사용하는 배선 구조체 및이들의 제조방법 | |
| JP3130707B2 (ja) | プリント基板およびその製造方法 | |
| JPS62156898A (ja) | スル−ホ−ルプリント配線板の製造方法 | |
| JPH0521954A (ja) | プリント配線板の製造方法 | |
| JPH03175695A (ja) | スルホールプリント配線板の製造方法 | |
| JPH06314724A (ja) | 半導体素子搭載用両面配線基板，及びそれを用いた半導 体装置 | |
| JPH10335788A (ja) | 配線パターン形成方法 | |
| JPH03108793A (ja) | プリント配線板の製造方法 | |
| JPH11266070A (ja) | 転写用部材及びプリント配線板の製造方法 | |
| JPH05259609A (ja) | プリント配線板の製造方法 |