JPS6138228Y2 - - Google Patents
Info
- Publication number
- JPS6138228Y2 JPS6138228Y2 JP4962183U JP4962183U JPS6138228Y2 JP S6138228 Y2 JPS6138228 Y2 JP S6138228Y2 JP 4962183 U JP4962183 U JP 4962183U JP 4962183 U JP4962183 U JP 4962183U JP S6138228 Y2 JPS6138228 Y2 JP S6138228Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- prepreg
- conductor
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 239000002344 surface layer Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4962183U JPS58173274U (ja) | 1983-04-05 | 1983-04-05 | 多層印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4962183U JPS58173274U (ja) | 1983-04-05 | 1983-04-05 | 多層印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58173274U JPS58173274U (ja) | 1983-11-19 |
| JPS6138228Y2 true JPS6138228Y2 (https=) | 1986-11-05 |
Family
ID=30060466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4962183U Granted JPS58173274U (ja) | 1983-04-05 | 1983-04-05 | 多層印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173274U (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020005922A (ko) * | 2000-07-11 | 2002-01-18 | 이형도 | 다층 회로 기판 |
-
1983
- 1983-04-05 JP JP4962183U patent/JPS58173274U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58173274U (ja) | 1983-11-19 |
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