JPS6137359B2 - - Google Patents
Info
- Publication number
- JPS6137359B2 JPS6137359B2 JP11148678A JP11148678A JPS6137359B2 JP S6137359 B2 JPS6137359 B2 JP S6137359B2 JP 11148678 A JP11148678 A JP 11148678A JP 11148678 A JP11148678 A JP 11148678A JP S6137359 B2 JPS6137359 B2 JP S6137359B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- copper
- wire
- alloy
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 15
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 10
- 239000010407 anodic oxide Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910018084 Al-Fe Inorganic materials 0.000 description 1
- 229910021365 Al-Mg-Si alloy Inorganic materials 0.000 description 1
- 229910018192 Al—Fe Inorganic materials 0.000 description 1
- 229910018507 Al—Ni Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- PLZFHNWCKKPCMI-UHFFFAOYSA-N cadmium copper Chemical compound [Cu].[Cd] PLZFHNWCKKPCMI-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11148678A JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11148678A JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5540026A JPS5540026A (en) | 1980-03-21 |
| JPS6137359B2 true JPS6137359B2 (fr) | 1986-08-23 |
Family
ID=14562480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11148678A Granted JPS5540026A (en) | 1978-09-11 | 1978-09-11 | Solderable anodized film aluminum wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5540026A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6359973U (fr) * | 1986-10-08 | 1988-04-21 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167984U (fr) * | 1984-10-11 | 1986-05-09 | ||
| JPS6167985U (fr) * | 1984-10-11 | 1986-05-09 | ||
| BR9804917A (pt) * | 1997-05-19 | 2000-01-25 | Hitachi Maxell Ltda | Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação. |
| CN1075451C (zh) * | 1997-05-19 | 2001-11-28 | 日立马库塞鲁株式会社 | 柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法 |
| KR100375636B1 (ko) * | 2000-07-04 | 2003-03-15 | 주식회사 일 진 | 동복알루미늄선의 제조 방법 |
-
1978
- 1978-09-11 JP JP11148678A patent/JPS5540026A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6359973U (fr) * | 1986-10-08 | 1988-04-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5540026A (en) | 1980-03-21 |
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