JPS6134254B2 - - Google Patents

Info

Publication number
JPS6134254B2
JPS6134254B2 JP55173521A JP17352180A JPS6134254B2 JP S6134254 B2 JPS6134254 B2 JP S6134254B2 JP 55173521 A JP55173521 A JP 55173521A JP 17352180 A JP17352180 A JP 17352180A JP S6134254 B2 JPS6134254 B2 JP S6134254B2
Authority
JP
Japan
Prior art keywords
semiconductor
support frame
lead
pellet
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55173521A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5796562A (en
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55173521A priority Critical patent/JPS5796562A/ja
Publication of JPS5796562A publication Critical patent/JPS5796562A/ja
Publication of JPS6134254B2 publication Critical patent/JPS6134254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/688—
    • H10W72/701—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
JP55173521A 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof Granted JPS5796562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173521A JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173521A JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5796562A JPS5796562A (en) 1982-06-15
JPS6134254B2 true JPS6134254B2 (enExample) 1986-08-06

Family

ID=15962062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173521A Granted JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5796562A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740161B2 (ja) * 1986-02-13 1998-04-15 日本電気株式会社 集積回路の実装構造
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPH02163949A (ja) * 1988-12-17 1990-06-25 Ibiden Co Ltd 半導体搭載用基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5232267A (en) * 1975-09-05 1977-03-11 Citizen Watch Co Ltd Ic packaging construction

Also Published As

Publication number Publication date
JPS5796562A (en) 1982-06-15

Similar Documents

Publication Publication Date Title
US4775917A (en) Thermal compensated circuit board interconnect apparatus and method of forming the same
JP2786862B2 (ja) 接続要素
US5168432A (en) Adapter for connection of an integrated circuit package to a circuit board
US5438481A (en) Molded-in lead frames
JPH0479141B2 (enExample)
US4736520A (en) Process for assembling integrated circuit packages
JPS6376314A (ja) 複合型回路部品及びその製造方法
JP2007294993A (ja) 組立て型半導体チップキャリア
US4780098A (en) Conductive lead arrangement
JPH04507032A (ja) プラスチックのピンのグリッドアレイ用プロセスプレート
JPS6134254B2 (enExample)
JP2646331B2 (ja) リードピンキャリア
JPH0415593B2 (enExample)
JPH04280696A (ja) 高集積半導体装置
US3825877A (en) Printed circuit assembly and method for fabrication thereof
JPH0496392A (ja) 電気部品の実装方法並びに該実装方法に用いるアイレット
JPS60254785A (ja) 電子素子用のスペーサ
JP4043658B2 (ja) リレー実装方法、リレーユニット及びそれに用いるサブプレート
JP3052810B2 (ja) ワーク位置決め装置
JPH04111346A (ja) 半導体装置
JPS61120489A (ja) フラツトパツケ−ジ型ｉｃ実装用基板
JPH01152700A (ja) 電子部品の挿入ガイド機構
JPS6031164Y2 (ja) 電子機器素子封入構造
JPS635248Y2 (enExample)
JP2687899B2 (ja) 表面実装型端子