JPS6132821B2 - - Google Patents

Info

Publication number
JPS6132821B2
JPS6132821B2 JP55173003A JP17300380A JPS6132821B2 JP S6132821 B2 JPS6132821 B2 JP S6132821B2 JP 55173003 A JP55173003 A JP 55173003A JP 17300380 A JP17300380 A JP 17300380A JP S6132821 B2 JPS6132821 B2 JP S6132821B2
Authority
JP
Japan
Prior art keywords
lead
stress relaxation
connection
leads
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55173003A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5796561A (en
Inventor
Hiroshi Yamanochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55173003A priority Critical patent/JPS5796561A/ja
Publication of JPS5796561A publication Critical patent/JPS5796561A/ja
Publication of JPS6132821B2 publication Critical patent/JPS6132821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP55173003A 1980-12-08 1980-12-08 Lead for connection of semiconductor device Granted JPS5796561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173003A JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173003A JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796561A JPS5796561A (en) 1982-06-15
JPS6132821B2 true JPS6132821B2 (US20100012521A1-20100121-C00001.png) 1986-07-29

Family

ID=15952380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173003A Granted JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796561A (US20100012521A1-20100121-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129745U (US20100012521A1-20100121-C00001.png) * 1987-02-17 1988-08-24

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
DE10303455B4 (de) * 2003-01-29 2007-11-29 Osram Opto Semiconductors Gmbh Leiterrahmenband und Verfahren zum Herstellen einer Mehrzahl von Leiterrahmen-basierten Leuchtdiodenbauelementen
JP5185956B2 (ja) * 2010-01-06 2013-04-17 三菱電機株式会社 電力用半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417666A (en) * 1977-07-08 1979-02-09 Nec Corp Lead frame

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518365Y2 (US20100012521A1-20100121-C00001.png) * 1972-03-22 1976-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417666A (en) * 1977-07-08 1979-02-09 Nec Corp Lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129745U (US20100012521A1-20100121-C00001.png) * 1987-02-17 1988-08-24

Also Published As

Publication number Publication date
JPS5796561A (en) 1982-06-15

Similar Documents

Publication Publication Date Title
US5561323A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5773884A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP2819285B2 (ja) 積層型ボトムリード半導体パッケージ
JPH08186151A (ja) 半導体装置及びその製造方法
US6037662A (en) Chip scale package
US4067041A (en) Semiconductor device package and method of making same
KR100461718B1 (ko) 칩 패키지 및 그 제조방법
JPS6132821B2 (US20100012521A1-20100121-C00001.png)
JPH03142847A (ja) 半導体集積回路装置
JPH11176885A (ja) 半導体装置及びその製造方法、フィルムキャリアテープ、回路基板並びに電子機器
JP2798108B2 (ja) 混成集積回路装置
JP2001257304A (ja) 半導体装置およびその実装方法
KR960002496B1 (ko) 반도체 패키지
JPH05326648A (ja) フィルムキャリアとこれを用いた半導体装置の製造方法
JP3211116B2 (ja) 電子部品及びそのモジュール構造
JP3153185B2 (ja) 半導体装置
JP2699557B2 (ja) Ｔａｂ形式半導体装置の製造方法
JP3061728B2 (ja) 半導体パッケージ
JPS6343897B2 (US20100012521A1-20100121-C00001.png)
JPH0214558A (ja) 半導体集積回路装置
JPH065701B2 (ja) リードフレームおよびそれを用いた半導体装置の製造方法
JPS62281341A (ja) フイルムキヤリヤ−テ−プ
JP2925376B2 (ja) 回路基板
JPH0380599A (ja) 電子回路モジュール