JPS6132807B2 - - Google Patents
Info
- Publication number
- JPS6132807B2 JPS6132807B2 JP15923081A JP15923081A JPS6132807B2 JP S6132807 B2 JPS6132807 B2 JP S6132807B2 JP 15923081 A JP15923081 A JP 15923081A JP 15923081 A JP15923081 A JP 15923081A JP S6132807 B2 JPS6132807 B2 JP S6132807B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead
- layer
- metal
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000003990 capacitor Substances 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 229910052709 silver Inorganic materials 0.000 description 17
- 239000004332 silver Substances 0.000 description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000011133 lead Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Primary Cells (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15923081A JPS5860524A (ja) | 1981-10-05 | 1981-10-05 | チップ状固体電解コンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15923081A JPS5860524A (ja) | 1981-10-05 | 1981-10-05 | チップ状固体電解コンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5860524A JPS5860524A (ja) | 1983-04-11 |
| JPS6132807B2 true JPS6132807B2 (ko) | 1986-07-29 |
Family
ID=15689177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15923081A Granted JPS5860524A (ja) | 1981-10-05 | 1981-10-05 | チップ状固体電解コンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5860524A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6031220A (ja) * | 1983-07-29 | 1985-02-18 | ニチコンスプラ−グ株式会社 | チップ状固体電解コンデンサの製造方法 |
| JPS6031219A (ja) * | 1983-07-29 | 1985-02-18 | ニチコンスプラ−グ株式会社 | チップ状固体電解コンデンサ |
| JP2748548B2 (ja) * | 1989-05-15 | 1998-05-06 | 日本電気株式会社 | チップ形固体電解コンデンサ |
| JPH0373511A (ja) * | 1989-08-14 | 1991-03-28 | Nec Corp | チップ形固体電解コンデンサ |
-
1981
- 1981-10-05 JP JP15923081A patent/JPS5860524A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5860524A (ja) | 1983-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4090288A (en) | Solid electrolyte capacitor with metal loaded resin end caps | |
| US8974654B1 (en) | Multilayer ceramic capacitor with terminal formed by electroless plating | |
| JPH10284343A (ja) | チップ型電子部品 | |
| JPS6132808B2 (ko) | ||
| JPS6132807B2 (ko) | ||
| JPH0126528B2 (ko) | ||
| JPS6032348B2 (ja) | 電子部品の製造方法 | |
| JPH0126527B2 (ko) | ||
| JP4710204B2 (ja) | 電子部品の端面電極形成方法 | |
| JP3168584B2 (ja) | 固体電解コンデンサ | |
| JPH04329616A (ja) | 積層形電子部品 | |
| JPH1092695A (ja) | チップ状固体電解コンデンサおよびその製造方法 | |
| KR100620514B1 (ko) | 전자 부품용 탭 단자 | |
| JP2641010B2 (ja) | チップ状電子部品 | |
| JPS6131609B2 (ko) | ||
| JPS6038862B2 (ja) | 固体電解コンデンサ | |
| JPH0878278A (ja) | 電子部品の製造方法 | |
| JPS5961116A (ja) | チツプ型固体電解コンデンサの製造方法 | |
| JPS6118854B2 (ko) | ||
| JPS5885518A (ja) | チツプ型コンデンサおよびその製造方法 | |
| JPS6017902Y2 (ja) | 固体電解コンデンサ | |
| JPS6028131Y2 (ja) | 電子部品 | |
| JPH0151003B2 (ko) | ||
| JPH09246101A (ja) | チップ状固体電解コンデンサ | |
| JPH0126526B2 (ko) |