JPS6131330Y2 - - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to the structure of a reticle.

When forming a desired pattern on the surface of a semiconductor substrate, a recently developed direct wafer printing apparatus (DSW) may be used to print a predetermined pattern directly onto the semiconductor substrate from a reticle.

As shown in Fig. 1, the method is as shown in Fig.
The semiconductor substrate 5 on which a photoresist film has been formed is placed on the stage 4, and the pattern of the reticle 3 is reduced to 1/10 by the lens system 6 and printed on the photoresist film on the surface of the semiconductor substrate 5. is moved by one element and baked again, and this process is sequentially repeated to form a predetermined pattern on the entire surface of the semiconductor substrate 5.

However, when forming a pattern directly on a semiconductor substrate from a reticle and when exposing using a photomask made from the reticle, the left and right sides of the pattern on the semiconductor substrate are reversed. Therefore, in order to use a photomask and a reticle together in a series of semiconductor device manufacturing processes, it is necessary to create a reticle with the pattern reversed left and right, which is very complicated.

Therefore, instead of creating a reticle with an inverted pattern, if the reticle is used upside down, the pattern on the semiconductor substrate can be the same as when it is formed using a photomask.

However, on the other hand, as shown in Figure 2, the support stand 2
When the reticle 3 is placed on top in the normal orientation (Figure 2a) and when the reticle 3 is placed upside down (Figure 2b), the vertical position of the pattern 7 is equal to the thickness of the glass substrate. Since it moves, the focus must be adjusted by adjusting the height of the stage each time, but this operation requires extreme precision and is not easy.

An object of the present invention is to provide a reticle structure that does not require focus adjustment even when used upside down.

The reticle of the present invention is characterized in that it has a predetermined pattern on one main surface of a glass substrate, and that glass plates of the same quality and thickness as the glass substrate are laminated on the one main surface.

An embodiment of the reticle of the present invention will be described below with reference to FIG.

As shown in FIG. 5A, an adhesive 9 is applied to a portion outside the pattern area such as the peripheral edge or four corners of one main surface of a reticle 3 having a predetermined pattern 7 formed on one main surface of a glass substrate 8. A transparent glass substrate 8' of the same quality and thickness as the glass substrate is stacked and pressed.

In this way, a reticle 3' having a sandwich structure in which a predetermined pattern 7 is sandwiched between glass substrates 8 and 8' is obtained, as shown in FIG.

When this reticle 3' is turned over as shown in FIG. 3c, the left and right sides of the pattern 7 are reversed, and when placed on the support stand, the positions of the patterns are the same. Therefore, there is no need to adjust the focus of the DSW when used in either orientation.

The above embodiment can be modified as shown in FIG.

That is, the glass substrates 8 and 8' may be sandwiched between the support frame 10 and fixed.

For stacking and fixing the glass substrates 8, 8', methods other than the above embodiments may be used and there is no need to limit the method in particular.

As explained above, by using the reticle of the present invention, it is possible to directly print a predetermined pattern on the surface of a semiconductor substrate without horizontally reversing it, and there is no need to adjust the focus of the DSW again.

[Brief explanation of the drawing]

1 and 2 are a front view and a cross-sectional view of a main part to explain a conventional reticle, and FIG. 3 is a cross-sectional view of a main part showing an embodiment of the present invention. 3,3'...Reticle, 7...Pattern, 8,
8'...Glass substrate, 9...Adhesive, 10...Support frame.

Claims (1)

[Scope of utility model registration request] 1. A reticle having a predetermined pattern on one principal surface of a glass substrate, the reticle comprising a glass substrate having the same quality and thickness as the glass substrate laminated on the one principal surface.