JPH11151729A - Method and apparatus for producing highly accurate photosensitive resin panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably produce a thick and large panel high in thickness accuracy by providing a mold speed changing point at a position of a specific % of a molding distance, and subsequently reducing the mold speed continuously to mold a liquid photosensitive resin. SOLUTION: A mold initial speed A, a mold speed changing point B and a mold variable speed C are set at every panel thickness to perform molding. Especially, a mold speed is reduced continuously accompanied by the reduction of the residual amt. of the resin in the bucket of a mold latter half part. Concretely, The mold speed changing point is provided at a position of 30-80% of a molding distance and, thereafter, the mold speed is continuously reduced to mold a liquid photosensitive resin. By this constitution, by keeping the resin amt. before a doctor 6, the so-called 'bank amt.' almost constant, a method for stably producing a thick and large photosensitive resin panel having good thickness accuracy and an apparatus for executing this method can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for producing a photosensitive resin plate for letterpress printing such as cardboard printing, film printing, and label printing, and more particularly to a plate thickness of the photosensitive resin plate. The present invention relates to a method and an apparatus for improving accuracy.

[0002]

2. Description of the Related Art Generally, in order to manufacture a printing plate using this liquid photosensitive resin, first, as shown in FIG. 1, a negative film 2 and a cover film 3 are placed on a lower transparent base plate 1 by vacuum or the like. The photosensitive resin layer 4 'is placed on the photosensitive resin layer 4' by means of a bottom open bucket or the like as shown in FIG.
And then, as shown in FIG.
And the masking film 8. Thereafter, masking exposure is performed to form a base of the relief portion by irradiating active light through the upper transparent substrate 11 placed on the spacer 10 set to determine the thickness of the photosensitive resin plate, and then In order to form an image of the relief portion, the lower transparent substrate 1 is irradiated with active light through the negative film 2 through the negative film 2 to perform relief exposure. Then, the masking film 8 is removed, and the formed relief portion is replaced with the base film 7. Back exposure is performed from the upper transparent substrate 11 side to stably fix the substrate.

[0005] A plate making method without performing the last back exposure is sometimes used. Next, if the uncured part is washed out with a suitable detergent, developed, and subjected to post-exposure and drying treatments,
A printing plate is obtained. As another method, a negative film 2 and a cover film 3 are placed on a lower transparent substrate 1 in close contact with each other without using a masking film, and a photosensitive resin layer 4 is laminated thereon, and a base film is Stack 7. Thereafter, a back exposure for irradiating active light through an upper transparent substrate 11 placed on a spacer 10 set to determine the thickness of the photosensitive resin plate to form a base of the plate is performed, and then a lower exposure is performed. A method of irradiating active light from the transparent substrate 1 side through a negative film 2 to perform relief exposure, and developing, post-exposure, and drying to obtain a plate is also widely used.

[0004]

However, when the thick plate (usually 7 mm) having a large size (1 m or more in length) generally used in cardboard printing or the like is made by the above-described technique, the inside of the bucket is not made. When the amount of the resin decreases as the lamination progresses, the thickness distribution of the laminated resin is not uniform, and the thickness of the plate particularly at the rear end of the lamination is abnormally reduced, which often results in poor printing. This phenomenon is caused by laminating the resin at a constant speed despite the fluctuation of the resin amount in the bucket.

Conventionally, in order to overcome such disadvantages,
A method of reducing the resin laminating speed halfway has been used, but it is not suitable for plate making of a larger size plate,
It was not always satisfactory, for example, the effect of deceleration appeared on the plate thickness. Accordingly, an object of the present invention is to provide a method for overcoming the disadvantages of the conventional method and stably making a thick large plate with high plate thickness accuracy.
In order to achieve the same object as the present invention, a method of resin molding by combining a multi-manifold with a fixed-quantity resin feed pump has been devised as in US Pat. No. 4,383,759. In order to make a plate of various plate thicknesses, it is necessary to make adjustments or change settings in several places when changing the plate thickness, and the work is complicated and easy to make mistakes. (Thin plate / thick plate) There are drawbacks that two types of metering pumps are required, the system becomes complicated, and the apparatus becomes expensive.

[0006]

Means for Solving the Problems As a result of intensive studies on the above problems, the present inventors have found that the above problems can be solved by controlling three parameters of the initial molding speed, the molding speed shift point, and the molding variable speed. Was found. That is, the present application provides the following inventions. (1) In a method of manufacturing a photosensitive resin plate having a step of molding a liquid photosensitive resin with a bucket, a molding speed shift point is provided at a position of 30% to 80% of a molding distance, and thereafter the molding speed is continuously reduced. And producing a liquid photosensitive resin. (2) A photosensitive resin plate making apparatus having means for molding a liquid photosensitive resin with a bucket, the photosensitive resin plate having a mechanism for controlling three parameters of a molding initial speed, a molding speed shift point, and a molding speed variation. Plate making equipment.

As a specific embodiment of the present invention,
(A) When a negative film and a cover film are laminated on a lower transparent substrate and a liquid photosensitive resin is laminated on the negative film and a bucket, a molding initial speed (A), a molding speed shift point (B), and a molding speed change ( C) three-parameter control (hereinafter, referred to as C)
According to a three-parameter method), a liquid photosensitive resin is laminated, a base film, a masking film, and an upper transparent substrate are laminated in this order, first, masking exposure is performed through the upper transparent substrate, and then relief exposure is performed through the lower transparent substrate. After removing the masking film and performing back exposure through the upper transparent substrate, the uncured liquid photosensitive resin is removed to form a photosensitive resin plate. A negative film and a cover film are laminated on a substrate, and a liquid photosensitive resin is laminated thereon by controlling the three parameters,
Further, the base film upper transparent substrate is laminated, first, back exposure is performed through the upper transparent substrate, then relief exposure is performed through the lower transparent substrate, and then the uncured liquid photosensitive resin is removed to form a photosensitive resin plate. Method.

Hereinafter, the present invention will be described in more detail. In the plate making method of the present invention, for example, JP-B-52-7
No. 761, JP-A-60-191237, JP-A-63-191
88555, JP-A-1-245245, JP-A-7-
For example, a liquid photosensitive resin disclosed in JP-A-295218 and the like can be used, and a photosensitive resin plate making apparatus disclosed in JP-A-63-96661 can be used.

Usually, when manufacturing a so-called thick plate having a plate thickness of 4 mm or more, first, as shown in FIG.
The negative film 2 and the cover film 3 are placed on top of each other, and the negative film 2 and the cover film 3 are vacuum-adhered to the transparent substrate 1 by holes and grooves formed in the transparent substrate 1 and vacuum piping. When laminating the photosensitive resin 4 thereon,
The photosensitive resin layer is laminated by appropriately setting the initial molding speed (A), the molding speed shift point (B), and the molding speed change (C) according to the plate thickness. Next, the base film 7 and the masking film 8 are stacked. Thereafter, the transparent substrate 1 is placed on the spacer 10 set for determining the thickness of the photosensitive resin plate.
The substrate 1 is then exposed to actinic light through the transparent substrate 11 to perform back exposure (masking exposure) to form the base of the relief portion, and then to form a relief portion of an image from the side of the transparent substrate 1 to form a negative film. Relief exposure for irradiating actinic light through 2 is performed. Next, the masking film 8 is removed, and back exposure for fixing the formed relief portion and the base film is performed from the transparent substrate 11 side.

It is also possible to produce a photosensitive resin plate without performing back exposure. Next, the printing plate is obtained by washing and removing the uncured photosensitive resin with a suitable detergent and performing post-exposure and drying treatments. When a relatively thin plate is to be manufactured, first, a back exposure (back exposure) for forming a base of a relief portion on the entire surface of the plate through the transparent substrate 11 is performed without using the masking film 8 described above. In order to form a relief portion of an image, a method of performing relief exposure from the transparent substrate 1 side is performed.

Next, the three-parameter method of the present invention will be described in detail. Conventionally, in plate making of a small-sized liquid photosensitive resin plate, a constant-speed molding method as shown in FIG. 4A is mainly used, and for a large-sized plate, a two-step reduction molding method as shown in FIG. Has been used for However, in the case where a thick plate having a thickness of more than 1 m and a thick plate having a thickness of 7 mm as a center, which is required from the market in recent years, is required, the conventional two-stage reduction molding method is sufficient. In reality, it was difficult to obtain a high plate thickness accuracy.

Therefore, as shown in FIG. 5, the present invention sets a molding initial speed (A), a molding speed shift point (B), and a molding speed change (C) for each plate thickness to perform molding. The molding speed is continuously reduced in accordance with a decrease in the amount of resin remaining in the bucket in the latter half of the molding. Specifically, the molding speed shift point is provided at a position of 30% to 80% of the molding distance, and then continuously. By thickening the liquid photosensitive resin by gradually reducing the molding speed, the amount of resin before the doctor 6, the so-called "bank amount" is kept almost constant, so that a thick large photosensitive material having good plate thickness accuracy is obtained. An object of the present invention is to provide a method for stably producing a resin plate and an apparatus for performing the method. Here, the molding initial speed is a substantial initial moving speed of the molding means including the bucket when the photosensitive resin is molded to a predetermined thickness by the resin supply bucket. Here, “substantially” means a speed at a time when the speed becomes a constant speed, not including a speed in a region where the vehicle is accelerated from a stopped state to a predetermined moving speed.

The molding speed shift point represents the distance from the molding start position to the position of the molding means where the molding speed starts shifting from the molding initial speed to the molding speed. In other words, it indicates the position of the molding means at which the speed change of the molding speed is started. Although it is possible to represent the time point, that is, the time point, it is more convenient to represent the relative position in terms of control. Next, the molding speed is the difference between the molding speed at the final molding position and the initial molding speed, and indicates the degree of speed change of the molding speed. For example, when the initial molding speed is 20 mm / sec and the final molding speed is 12 mm / sec, the molding speed is 8 mm / sec.
Seconds. Next, the molding distance is a length for molding the photosensitive resin to a predetermined thickness, and specifically, a photosensitive resin molding length in a direction in which the molding means moves. Generally, a molding distance that is about 3% to 15% longer than the length of the resin plate is taken. The means for continuously reducing the speed may be a mechanical means, but for more precise control, an electric speed control means is used, and the speed is controlled by an inverter or an inverter and a sequencer (programmable controller). It is generally controlled.

The thick and large printing plate thus obtained has a very small difference in plate thickness between the first half of molding and the second half of molding as compared with the plate manufactured by the conventional method. It is a plate with no reduction in the plate thickness on the outer circumference, and has a small printing pressure fluctuation during printing.
A printed image having a high degree of reproducibility can be given to a document.

A, B, and C parameters are 7 mm
Although the printing plate varies depending on the bucket shape and the viscosity of the photosensitive resin, the initial molding speed A is usually from 20 mm / sec to 40 mm.
mm / sec, preferably 28 mm / sec to 35 mm / sec,
For a plate having a length of 1.3 m or more in the molding direction, the molding shift point B is 30% to 80%, preferably 50% of the molding length.
From 70 to 70%, and the molding deformation speed C for a plate of 1.3 m or more is also in the range of 3 mm / sec to 20 mm / sec, preferably 5 mm / sec to 15 mm / sec, so that a uniform resin molding thickness can be obtained. It is a condition with high effectiveness and practicality.
For the 6 mm version, A is 25 mm / sec to 30 m
m / sec, B is also 40% to 70% of the molding length, C is also 5 mm / sec to 12 mm / sec, and for the 5 mm version, A is 23 mm / sec to 28 mm / sec, and B is also the molding length. 40% to 70%, C is also 3 mm / sec to 1
For the 2 mm / sec and 4 mm plates, A is 20 mm / sec to 28 mm / sec, and B is also 40% to 70% of the molding length.
% And C are also in the range of 3 mm / sec to 10 mm / sec, which are the conditions with high effectiveness and practicality.

The transparent substrate used in the manufacturing method of the present invention includes glass and crystal (quartz glass),
Plastics such as acrylic resins, polycarbonate resins, and polyvinyl chloride resins and transparent ceramics are used. As the molding means used in the manufacturing method of the present invention, the bottom-open type bucket 5 shown in FIGS. 1 and 2 and the rotary type bucket 13 shown in FIG. 6 are used.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be specifically described based on embodiments.

[0018]

Example 1 A negative film and a cover film were vacuum-adhered on a Pyrex glass lower rigid transparent substrate polished to high plane accuracy, and a liquid photosensitive resin APR was used.
(Registered trademark) F-91 (manufactured by Asahi Kasei Kogyo Co., Ltd.) at an initial molding speed of 31 mm / sec, a shift point of 900 mm, and a speed of 8 m
The photosensitive resin layer having a thickness of 7 mm was formed by laminating under a condition of m / sec, and a pyrex glass upper hard substrate polished with high flatness through a polyester base film and a masking film was mounted thereon. The gap between the two hard substrates was maintained by a spacer. Next, vacuum suction was performed from the upper hard substrate, and after holding for 3 minutes while maintaining the adhesion between the masking film and the base film, masking exposure was performed by irradiating active light through the upper transparent substrate and the masking film for 150 seconds. Thereafter, relief exposure for irradiating active light through the lower transparent substrate and the negative film was performed for 130 seconds to remove the masking film. Next, back exposure for irradiating active light through the upper transparent substrate was performed for 20 seconds to complete image forming exposure.

Next, the photosensitive layer exposed in this manner was washed out with a cleaning solution according to a conventional method, developed, post-exposed, and dried to obtain a printing plate having a plate thickness of 7 mm, a width of 700 mm and a length of 1300 mm. . Table 1 shows the plate thickness accuracy of this plate.

[0020]

Comparative Example 1 In Example 1, the initial molding speed was 31 mm /
A printing plate of 7 mm was obtained in exactly the same manner as in Example 1, except that the photosensitive resin was laminated by the so-called "two-step speed change method" in which the speed, the shift point was 930 mm, and the secondary molding speed was 27 mm / sec. Table 1 shows the results.

[0021]

Comparative Example 2 A 7 mm printing plate was obtained in the same manner as in Example 1 except that the photosensitive resin was laminated at a constant molding speed of 31 mm / sec. Table 1 shows the results.
Shown in

[0022]

[Table 1]

[0023]

Example 2 As in Example 1, the liquid photosensitive resin APR
(Same as above) F-300 (Same as before) was set appropriately at initial molding speed A, shift point B, and variable speed C, with a width of 900 mm and a length of 1,
A 300 mm printing plate was obtained. Table 2 shows the results.

[0024]

[Table 2]

[0025]

According to the present invention, good ink inking property and transferability are exhibited regardless of the size of the plate image area, and the fidelity with respect to the original is clear over the whole, and the gain due to excessive printing pressure is small. The present invention provides a printing plate making method for cardboard printing, film printing, label printing, etc., because a thick large photosensitive resin plate giving a high print image can be obtained without increasing the burden on the operator and the time required for plate making. It is suitable as a plate making device.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a state before a photosensitive resin is molded (laminated) by a bottom-open type bucket.

FIG. 2 is a sectional view of a liquid photosensitive resin molding (lamination) step.

FIG. 3 is a cross-sectional view of an exposure step in a method for making a liquid photosensitive resin plate.

FIG. 4 is a photosensitive resin molding speed diagram of a conventional method.

FIG. 5 is a photosensitive resin molding speed diagram in the three-parameter method of the present invention.

FIG. 6 is an explanatory sectional view of a rotary bucket.

[Explanation of symbols]

 1. 1. Lower transparent substrate Negative film 3. Cover film 4. 4. Liquid photosensitive resin (layer) Bucket (bottom open type) 6. Doctor 7 Base film 8. Masking film 9. Sponge tape 10. Spacer 11. Upper transparent substrate 12. Lamination roll 13. Bucket (rotary type)

Claims (2)

[Claims] 1. A method of manufacturing a photosensitive resin plate having a step of molding a liquid photosensitive resin with a bucket, wherein a molding speed shift point is provided at a position of 30% to 80% of a molding distance.
Thereafter, the molding speed is continuously reduced to mold the liquid photosensitive resin. 2. A plate making apparatus for a photosensitive resin plate having means for molding a liquid photosensitive resin by means of a bucket, comprising a mechanism for controlling three parameters of a molding initial speed, a molding speed shift point, and a molding variable speed. Plate making machine for resin plate.