JP4698044B2 - Manufacturing method and apparatus for photosensitive resin relief printing plate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a photosensitive resin relief plate from a liquid type photosensitive resin having a coatable form, and a production apparatus for carrying out the production method.
[0002]
[Prior art]
Conventionally, a photosensitive resin relief plate has been used as a relief printing plate material represented by flexographic printing such as cardboard printing and film printing.
The photosensitive resin letterpress is broadly classified into two types: a so-called liquid type having a form that can be applied, or a so-called sheet type that has been formed into a certain shape in advance. Examples of the liquid type photosensitive resin include APR (trademark). Name, manufactured by Asahi Kasei) is the most representative product, and ALF / AJF / AWF / ASF (all are trade names, all manufactured by Asahi Kasei) and the like are provided to the market as plate making apparatuses. As a plate making process using this liquid type photosensitive resin, a negative film on which an image has already been formed by a film production system such as an image setter is set on a lower glass plate of an exposure apparatus, and a transparent cover film is formed thereon. After covering the cover film with a photosensitive resin with a certain thickness and laminating the base film on the cover film, press the base film with the upper glass plate and irradiate it with ultraviolet light from below the lower glass plate. Thus, the image of the negative film is transferred to the photosensitive resin layer to form a relief image. Next, the uncured resin is removed with a rubber spatula or blown off with an air knife or the like, and the uncured resin remaining at the end is completely washed away with a cleaning solution, and after performing necessary post-treatments such as drying and post-exposure, it is used for printing. The photosensitive resin letterpress is made.
[0003]
By the way, along with the rapid spread of computers in recent years and the progress in networking as represented by the performance improvement and the Internet, even in the relief printing field, in the case of making a plate from a sheet-type photosensitive resin, an image recording signal Based on the above, an apparatus and a method for performing image formation by selectively irradiating a photosensitive material with a laser beam have been developed. For example, in Japanese Patent Application Laid-Open No. 8-300600, an infrared photosensitive layer that shields ultraviolet rays is provided on a photosensitive resin sheet, and the infrared photosensitive layer is burned off with an infrared laser in an external drum type laser drawing apparatus to form an image. Flexo CTP, which is formed and then exposed to ultraviolet light through an infrared photosensitive layer in a conventional exposure apparatus, is rapidly spreading. Therefore, even when using a liquid type photosensitive resin that cannot be directly provided with an infrared photosensitive layer, there is a long-awaited system that can make a photosensitive resin relief plate directly from digital image data without using a negative film. Has been.
[0004]
On the other hand, in the field of offset printing, a CTP (Computer To Plate) system that makes a plate for offset printing directly from digital image data edited by a computer is used instead of the conventional plate making system using positive / negative film. It has been introduced rapidly. As a digital light modulation / exposure apparatus employed in such a CTP system, for example, in Japanese Patent Laid-Open No. 05-341630, active light emitted from an arc lamp is condensed onto a two-dimensional mirror array by a lens. In the mirror array, the photosensitive material is selectively exposed when each element mirror turns on / off the actinic ray by a drive circuit controlled in accordance with a digital image recording signal.
[0005]
However, in the case of a liquid type photosensitive resin relief printing method using such a method, the relief cross-sectional shape of the relief is not sufficiently accurate due to the gentle hem spreading unique to relief printing, and the relief shoulder becomes rectangular. There are problems that the obtained printing plate is inferior in printing stress resistance, or that the printed image becomes thick due to extremely thinning or extremely narrowing.
[0006]
[Problems to be solved by the invention]
The present invention has been made paying attention to such problems of the prior art, and in the production of a liquid type photosensitive resin relief printing plate, it is possible to make a plate directly from digital image data. It is an object of the present invention to eliminate the need for a negative film production process that is output from the above, streamline and save resources, and eliminate the need for waiting for a negative film to make a plate, thereby contributing to shortening the delivery time of the product.
At the same time, the shoulder shape of the relief image formed on the photosensitive resin layer is made into a specific shape with high accuracy, thereby significantly improving the printing resistance required for printing plates such as chipping resistance and printing stress. Another object of the present invention is to enable high-definition and high-quality printing with less printed image thickness.
It is another object of the present invention to provide a plate making system that can be used with an anaerobic photosensitive resin (a resin having a property that inhibits a photosensitive reaction under an oxygen atmosphere).
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides:
1. (A) a fixing process for fixing the cover film on the lower surface plate;
(B) A coating process in which a photosensitive resin is coated on the cover film with a certain thickness,
(C) a support lamination step of laminating a support on the coated photosensitive resin;
(D) a sandwich process in which a photosensitive resin plate structure formed by laminating at least a cover film, a photosensitive resin, and a support is held between the lower surface plate and the upper surface plate;
(E) a calculation step of dividing the image forming area of the photosensitive resin plate structure into rectangular basic sections (hereinafter referred to as blocks) and calculating plane coordinates of each block;
(F)
(F-1) a plane scanning step in which the digital exposure means is moved in a plane to the calculated predetermined block position;
(F-2) The block is further divided into rectangular minute sections (hereinafter referred to as pixels), and actinic rays are emitted from the upper surface plate via the surface plate by the digital exposure device based on the digital image recording signal. Then, each pixel is selectively exposed, and the exposure area of the exposure by the device is sequentially decreased over time based on the digital image recording signal, so that the photosensitive resin plate structure is moved from the support side to the cover film side. A photosensitive resin including a digital image forming process for forming an image on the entire surface of the photosensitive resin plate structure by repeating a block image forming process in which a stepped relief shoulder having a relief cross-section in a step shape is formed for each block. A method for producing a letterpress is provided.
2. After the sandwich step (d) and before the calculation step (e), the photosensitive resin plate structure is exposed all over the entire surface with an actinic ray having a light quantity that does not allow the photosensitive resin to be photocured from above the upper platen. And a partial curing exposure step in which a part of the photosensitive resin is photocured entirely from the support side of the photosensitive resin plate constituting body. The manufacturing method of the photosensitive resin relief printing plate as described in 1 is provided.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described.
First, an embodiment of a photosensitive resin relief printing plate manufacturing apparatus according to the present invention will be described with reference to the drawings.
This plate making apparatus is composed of at least the following blocks (A) to (J).
(A) FIG. 1, the cover film 200 is a thin and flexible film such as polypropylene having oxygen barrier properties. The mechanism 1 for storing and supplying the roll film of the cover film 200 and the cover film 200 are installed horizontally. A lower surface plate 10 made of a highly rigid metal having a smooth surface (a reference surface that regulates the coating thickness of the photosensitive resin 300 so that high-precision surface polishing is applied), and a lower surface plate. A panel support mechanism 11 is provided.
(B) On the lower surface plate 10, a rectangular groove that combines vacuum suction and pressure introduction is engraved outside the image area. Below that, vacuum suction connected to a vacuum pump and an air compressor, etc. A pressurized air introduction pipe 90 is provided. By these mechanisms, the cover film 200 can be easily peeled by suction fixing or introducing pressurized air.
[0013]
(C) FIG. 2, the carriage mechanism 20 is supported on carriage guide rails 30 and 31 with height adjustment functions at both ends, and includes moving means for horizontally sweeping the lower surface plate 10. The bucket 21 to be accommodated is held. The tip of the fixed plate 22 constituting the bucket 21 is linearly processed as a doctor blade with high accuracy, and the opening / closing plate 23 facing the fixed plate 22 has a rotating mechanism, and is indicated by an arrow of the carriage mechanism 20. As shown in FIG. 4, the bottom of the bucket 21 opens when the opening / closing plate 23 rotates in one direction, and closes when rotated in the other direction, as shown in FIG. 4, and the coating thickness of the photosensitive resin 300 is as follows. The structure is controlled by a gap between the doctor blade at the tip of the bucket fixing plate 22 and the lower surface plate 10.
(D) FIG. 3, the support 400 is supplied in the form of a sheet made of a thin and flexible film such as polyester capable of transmitting actinic rays, and has an adhesive layer with a photosensitive resin on one side. The sheet is fed by a laminating roll 25 which is held by a support guide 26 provided in the carriage mechanism 20 and rotates at a constant speed in synchronization with the movement of the carriage mechanism 20.
[0014]
(E) In FIG. 1, the upper surface plate 40 is a surface plate capable of transmitting an actinic ray having high rigidity supported by an upper surface plate support mechanism 41 connected to an upper surface plate elevating mechanism 42 having an up / down mechanism. In addition, the bottom surface of the surface plate is subjected to high-precision surface polishing as with the lower surface plate 10.
The upper surface plate 40 is released from the upper surface plate support mechanism 41 at its lowermost lower limit position and is supported on the carriage guide rails 30 and 31. The height of the carriage guide rails 30 and 31 can be adjusted in advance to a predetermined position with respect to the lower limit position of the upper platen 40 lowering, and the clearance between the upper platen 40 and the lower platen 10 is adjusted by this height adjustment. Can be controlled.
[0015]
(F) In FIG. 1, the lower surface of the upper surface plate 40 has a rectangular groove formed outside the image area that serves both as vacuum suction and introduction of air pressure, as on the lower surface plate 10. A vacuum suction and pressure air introduction pipe 100 connected to a pump and an air compressor is provided. With these mechanisms, the support 400 can be easily fixed by suction in vacuum, or can be easily peeled off by introducing pressurized air.
(G) FIG. 2, the controller 70 divides the image forming area of the photosensitive resin 300 applied on the cover film 200 into a two-dimensional matrix composed of, for example, rectangular blocks, and all the divided blocks This is a device for calculating a plane coordinate of the digital signal and transmitting a control signal for moving the digital exposure head 50 to a predetermined block position based on the plane coordinate.
[0016]
(H) FIG. 2 The X-axis linear motor mechanism 60 and the Y-axis linear motor mechanism 62 receive two control signals from the controller 70 and move the digital exposure head 50 to a predetermined block position in two axes ( X, Y) part of the drive mechanism. The X-axis linear motor mechanism 60 holds the digital exposure head 50 on the support table 61 and is connected to the Y-axis linear motor mechanism 62 and the Y-axis guide mechanism 63, and the X-axis linear motor drive and the Y-axis The digital exposure head 50 is moved along the X axis and the Y axis, respectively, by linear motor driving.
FIG. 2 shows an example in which the digital exposure head 50 is provided above the upper surface plate 40 and actinic rays are irradiated only from above the coated photosensitive resin 300, but the lower surface plate 10 and the cover film 200 are shown. If the material is capable of transmitting actinic rays, the exposure head 50 and its driving mechanism are provided below the lower surface plate 10 to irradiate actinic rays from below, or the actinic rays can be emitted simultaneously from above / below. Irradiation is also possible.
[0017]
(I) FIG. 1, the digital exposure head 50 receives the digital image recording signal transferred from the RIP server 80, stores it in its block memory, and stores the stored digital image on the basis of a preset exposure time table. This is an apparatus for converting a recording signal into a sequential light modulation electronic control signal, generating active light based on this signal, and irradiating the photosensitive resin 300 with it.
[0018]
The RIP server 80, together with RIP (Raster Image Processor) software, generates a function for expanding the image forming area equally from the peripheral portion at arbitrary intervals based on the image information after RIP, and the image information of a plurality of layers. The software that converts the digital image recording signals necessary for digital image recording is installed, and the image data that is impositioned and edited by DTP (Desk Top Publishing) or another computer incorporated in an electronic typesetting machine, etc. It is received as a digital exposure image forming signal via a network, converted into a digital image recording signal, and transmitted to the block memory of the digital exposure head 50 as appropriate.
[0019]
In the digital exposure apparatus 50, based on the digital image recording signal, the active light is independently modulated for each portion corresponding to each pixel constituting one block for exposure in a two-dimensional matrix, for example, An apparatus for selectively exposing the coated photosensitive resin 300, such as DMD (digital micromirror device) sold by TI (Texas Instruments), other transmissive liquid crystal, or reflective type A liquid crystal or the like can be used.
[0020]
Here, the DMD type digital exposure head will be described in more detail. FIG. 5 shows an example in which actinic rays are irradiated from above the upper surface plate 40, and FIG. 6 shows an example in which actinic rays are irradiated from below the lower surface plate 10. As shown in the figure, the active light source 51 is provided with a reflection mirror behind, a lens 52, a reflection mirror 53, a two-dimensional micromirror array (DMD main body) 54, and a projection lens mechanism 55.
The DMD 54 is an assembly of micromirrors, which are minute reflecting mirrors, and irradiates a portion corresponding to one pixel on the photosensitive resin 300 with actinic rays reflected by one micromirror.
[0021]
As the active light source 51, a short arc metal halide lamp or a xenon short arc lamp of about 100 to 600 W (watts) is used as a light source that efficiently generates ultraviolet light in a wavelength range of 300 to 450 nm (nanometers) close to a point light source. It is preferable to select a lamp that emits light in an efficient wavelength region according to the absorption spectrum of the photosensitizer added to the photosensitive resin 300.
[0022]
(J) In FIG. 9, in the uncured resin removal / recovery device 120, uncured resin adhering to the photocured photosensitive resin (hereinafter referred to as a photosensitive resin plate) integrated with the support 400. Removal and collection are performed by moving the hot air knife 122. Further, the cleaning device 130 in FIG. 9 has a mechanism for eluting uncured resin remaining on the photosensitive resin plate with the cleaning liquid 133 ejected from the cleaning nozzle 132.
[0023]
Moreover, in this apparatus, the mechanism described below can also be added as needed in addition to the blocks (A) to (J).
In FIG. 1, when the entire surface of the photosensitive resin 300 applied on the cover film 200 is uniformly excited and exposed with active light, an active light source 110 is installed above the upper surface plate 40 as shown in FIG. Excitation exposure is performed from above. In this case, the material of the upper surface plate 40 corresponding to the transmission path of the active light is made of glass and the support 400 is made of a transparent material instead of metal.
The active light source 110 installed on the upper part can also be used for exposure of a partially hardened layer to be described later.
[0024]
A method for producing the photosensitive resin relief plate of the present invention using such an apparatus will be described below.
In FIG. 1, the cover film 200 supplied from the roll-wrapping cover film original fabric supply mechanism 1 is placed on the lower surface plate 10 and cut into a predetermined size, and the cover film 200 is laid on the cover film 200 with a squeezing plate or the like. The air interposed between the cover film 200 and the lower surface plate 10 is pushed out, and the pushed air is vacuum-sucked from the groove on the lower surface plate 10 and discharged from the vacuum pump through the vacuum exhaust pipe 90 to the outside air. The cover film 200 is adsorbed and fixed on the lower surface plate 10 in a smooth state free from air pockets and wrinkles. Thereafter, the sheet-like support 400 with the adhesive layer on top is set at a fixed position on the support guide 26.
[0025]
When the cover film 200 and the support 400 are prepared by the above operation, as shown in FIG. 1, image data that has been impositioned and edited in advance by another computer is transferred to the RIP server 80 via a network or the like, and RIP processing is performed. The data converted into the digital image recording signal through the above is transferred to the block memory of the digital exposure head 50, and becomes a start signal for starting plate making.
When the start signal is input, the bottom of the bucket 21 is opened and the photosensitive resin 300 contained therein is supplied onto the cover film 200, and the carriage mechanism 20 moves at a predetermined speed in the direction shown in FIG. The support 400 set on the support guide 26 in synchronism with the movement is laminated on the coated photosensitive resin 300 which is fed by the laminating roll 25 at a speed equal to the moving speed of the carriage mechanism 20. . After a predetermined area on the cover film 200 is applied with the photosensitive resin 300, the bottom of the bucket 21 is controlled to be closed. In this way, the photosensitive resin 300 applied on the cover film 200 has a constant thickness by maintaining a constant gap between the lower surface plate 10 and the doctor blade at the tip of the bucket fixing plate 22.
[0026]
After the movement of the carriage mechanism 20 stops, the upper surface plate 40 in the upper standby position is lowered by the upper surface plate lifting mechanism 42, and the upper surface plate 40 reaches the position supported by the carriage guide rails 30 and 31. The surface plate elevating mechanism 42 stops. Next, the air interposed between the upper surface plate 40 and the photosensitive resin plate structure is expelled from the groove on the lower surface of the upper surface plate 40 by vacuum suction, and the air passes from the vacuum pump through the vacuum exhaust pipe 100 to the outside air. Discharged. Thus, the photosensitive resin plate structure integrated with the cover film 200 is held in a sandwich shape with no gap between the lower surface plate 10 and the upper surface plate 40.
[0027]
When the photosensitive resin plate structure is molded, the image forming area of the photosensitive resin plate structure is formed by, for example, a rectangular block in FIG. The plane coordinates of all the divided blocks are calculated, and a control signal for moving the digital exposure head 50 to a predetermined block position is transmitted based on the plane coordinates.
The digital exposure head 50 receives the control signal and moves to the first block position on the photosensitive resin plate structure by the linear motors 60 and 62 in FIG. 2, which moves two axes (X, Y). . Thereafter, the active light beam 500 irradiated from the active light source 51 is condensed, shaped while passing through the lens 52 and the reflection mirror 53, and guided to the two-dimensional micromirror array 54.
[0028]
Each micromirror is individually rotated based on the digital image recording signal stored in the block memory of the exposure head 50, and the active ray 500 incident on the micromirror tilted toward the exposure side in the process of rotation. Only the optical path is changed by the mirror, and after passing through the projection lens mechanism 55 and the upper surface plate 40, it reaches the photosensitive resin plate structure and performs exposure.
Further, in the image data sent from the RIP server 80 to the block memory of the exposure device 50, a plurality of data corresponding to exposure irradiation with different exposure areas in the same pixel or block can be accumulated. By performing exposure irradiation while processing the plurality of data according to a predetermined order, the exposure irradiation can be performed while changing the exposure area with time in the same pixel or block. At this time, the exposure time of the exposure irradiation corresponding to each of the plurality of data can be individually set by a control signal generated based on a preset exposure time table.
In this way, for example, a relief image having a stepped shoulder with a relief cross-section narrowing stepwise from the support 400 to the cover film 200 side in FIG. 8 can be formed in the photosensitive resin 300.
[0029]
When the pixels constituting the first block of the photosensitive resin plate structure in a two-dimensional matrix are selectively exposed with the actinic ray 500 for the required time by the above operation, each micro that has been tilted to the exposure side. The first block exposure is completed by reversely rotating the mirror and returning to the light blocking position. When this exposure operation is completed, the digital exposure head 50 transmits an exposure end control signal to the controller 70, and the controller 70 A plane movement control signal to the second block is transmitted to the biaxial (X, Y) drive mechanism of the digital exposure mechanism 50 by the control signal, and the drive mechanism receives the control signal and causes the digital exposure head 50 to move to the second block. The second block image layer is formed by moving to the block position and repeating the block exposure. By repeating the exposure operation for all blocks, a digital image layer is formed over the entire image forming area of the photosensitive resin plate structure. Further, in a block where it is not necessary to form a digital image at all, the exposure time is shortened and efficient by omitting the block exposure operation.
[0030]
In the case where the photosensitive resin plate structure is subjected to excitation exposure with active light, the entire surface of the photosensitive resin plate structure is excited and exposed from the upper active light source 110 before the digital exposure process is started. In the next digital exposure process, the excitation exposure means that the photosensitive resin 300 is light activated so that the photosensitive resin 300 is not yet photocured, and the energy level is increased by photoactivating the photosensitive resin 300 in advance. It can be photocured with less active light energy.
[0031]
Further, when a part of the photosensitive resin plate constituting body is photocured from the support side, it can be obtained by exposing the entire surface of the photosensitive resin plate constituting body from the upper active light source 110 in the same manner as the excitation exposure.
When all the exposure operations are completed, the vacuum suction state between the photosensitive resin plate and the upper surface plate 40 is destroyed by cutting the vacuum suction of the groove on the lower surface of the upper surface plate 40 and introducing the pressurized air, and the peeling becomes easy. The upper surface plate 40 is raised to the standby position. Next, similarly, the vacuum suction of the groove on the lower surface plate 10 is turned off, and the air is introduced to peel the photosensitive resin plate integrated with the cover film 200 from the lower surface plate 10, and then the uncured resin recovery mechanism 120 is removed. The photosensitive resin plate from which the cover film 200 has been peeled off is fixed to the collecting plate 121 and the uncured resin is removed by the hot air knife 122. The removed uncured resin is collected and reused. Next, the photosensitive resin plate is fixed to the cleaning plate 131 of the cleaning device 130, and the remaining uncured resin is eluted by the cleaning liquid 133 ejected from the cleaning nozzle 132. Thereafter, the photosensitive resin plate is subjected to a water washing / drying / post-exposure process. A resin letterpress is obtained.
[0032]
【The invention's effect】
According to the present invention, when manufacturing a photosensitive resin relief printing plate, a negative film production process output from a conventional image setter or the like is used to expose a photosensitive resin applied directly by a digital exposure mechanism from image data. This eliminates the need for streamlining and resource saving, and eliminates the need to wait for a negative film to make a plate, thus enabling quick delivery.
In addition, because the shoulder shape of the relief image can be stepped, the printing resistance required for the printing plate, such as chipping resistance, can be remarkably improved, it can withstand printing stress, and the printed image has less weight and high definition. High-quality printing plates can be manufactured.
In addition, since a general photosensitive resin having anaerobic properties can be used, the plate making system is compatible with various photosensitive resins.
[Brief description of the drawings]
FIG. 1 is a front view showing a schematic configuration of an exposure apparatus suitable for carrying out the present invention.
FIG. 2 is a perspective view showing a schematic configuration of an exposure apparatus suitable for implementing the present invention.
FIG. 3 is a diagram illustrating a state where a bucket bottom is open.
FIG. 4 is a diagram illustrating a state where a bucket bottom is closed.
FIG. 5 is a diagram for explaining an irradiation state of actinic rays to the photosensitive resin from above the upper surface plate by the DMD method according to the embodiment of the present invention.
FIG. 6 is a diagram for explaining an irradiation state of actinic rays to the photosensitive resin from below the lower surface plate by the DMD method according to the embodiment of the present invention.
FIG. 7 is a diagram showing an installation example of an active light source used for performing excitation exposure and formation exposure of a partially cured layer on the photosensitive resin of the present invention.
FIG. 8 is a view for explaining an example of forming a relief image on the photosensitive resin layer in which the relief cross-section is narrowed stepwise from the support of the present invention toward the cover film.
FIG. 9 is a diagram showing a schematic configuration of a conventionally known uncured photosensitive resin recovery and cleaning apparatus.
[Explanation of symbols]
1: Roll cover film original fabric supply mechanism 10: Lower surface plate 11: Lower surface plate support mechanism 20: Carriage mechanism 21: Bucket 22: Fixed plate 23: Opening / closing plate 25: Laminate roll 26: Support guide 30: Height Carriage guide rail with adjustment function 1
31: Carriage guide rail 2 with height adjustment function
40: Upper platen 41: Upper platen support mechanism 42: Upper platen lifting mechanism 50: Digital exposure head 51: Active light source 52: Lens 53: Reflection mirror 54: Micromirror array 55: Projection lens mechanism 60: X-axis linear Motor mechanism 61: Support table 62: Y axis linear motor mechanism 63: Y axis guide mechanism 70: Controller 80: RIP server 90: Lower surface plate vacuum suction / pressure air introduction pipe 100: Upper surface plate vacuum suction / pressure air introduction pipe 110: Upper active light irradiator 120: recovery device 121: recovery plate 122: hot air knife mechanism 130: cleaning device 131: cleaning plate 132: cleaning nozzle 133: cleaning liquid 200: cover film 300: resin liquid 400: support 500: active light

Claims (2)

(A) a fixing process for fixing the cover film on the lower surface plate;
(B) A coating process in which a photosensitive resin is coated on the cover film with a certain thickness,
(C) a support lamination step of laminating a support on the coated photosensitive resin;
(D) a sandwich process in which a photosensitive resin plate structure formed by laminating at least a cover film, a photosensitive resin, and a support is held between the lower surface plate and the upper surface plate;
(E) a calculation step of dividing the image forming area of the photosensitive resin plate structure into rectangular basic sections (hereinafter referred to as blocks) and calculating plane coordinates of each block;
(F)
(F-1) a plane scanning step in which the digital exposure means is moved in a plane to the calculated predetermined block position;
(F-2) The block is further divided into rectangular minute sections (hereinafter referred to as pixels), and actinic rays are emitted from the upper surface plate via the surface plate by the digital exposure device based on the digital image recording signal. Then, each pixel is selectively exposed , and the exposure area of the exposure by the device is sequentially decreased over time based on the digital image recording signal, so that the photosensitive resin plate structure is moved from the support side to the cover film side. A photosensitive resin including a digital image forming process for forming an image on the entire surface of the photosensitive resin plate structure by repeating a block image forming process in which a stepped relief shoulder having a relief cross-section in a step shape is formed for each block. A method for producing a letterpress. After the sandwich step (d) and before the calculation step (e), the photosensitive resin plate structure is exposed all over the entire surface with an actinic ray having a light quantity that does not allow the photosensitive resin to be photocured from above the upper platen. 2. The photosensitive property according to claim 1, comprising a step comprising: an excitation exposure step to perform, or a partial curing exposure step in which a part of the photosensitive resin is photocured entirely from the support side of the photosensitive resin plate structure. Manufacturing method of resin letterpress.

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