JPH08305006A - Production of photosensitive resin plate - Google Patents
Production of photosensitive resin plateInfo
- Publication number
- JPH08305006A JPH08305006A JP7114280A JP11428095A JPH08305006A JP H08305006 A JPH08305006 A JP H08305006A JP 7114280 A JP7114280 A JP 7114280A JP 11428095 A JP11428095 A JP 11428095A JP H08305006 A JPH08305006 A JP H08305006A
- Authority
- JP
- Japan
- Prior art keywords
- exposure
- transparent substrate
- plate
- photosensitive resin
- relief
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はダンボ−ル印刷、フィル
ム印刷、プレプリント印刷、ラベル印刷のような凸版印
刷用の感光性樹脂版の製造方法に関わるものであり、特
に感光性樹脂版の版厚精度を改良する為の方法に関わる
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a photosensitive resin plate for letterpress printing such as cardboard printing, film printing, preprint printing and label printing, and particularly to a method for producing a photosensitive resin plate. It relates to a method for improving plate thickness accuracy.
【０００２】[0002]
【従来の技術】一般に、この液状感光性樹脂を用いて印
刷版を製造するには、先ず図１のように、下部透明基版
１の上にネガフィルム３及びカバーフィルム４を真空等
の手段により密着して置き、その上に感光性樹脂層５を
積層し、これにベースフィルム６とマスキングフィルム
７を重ねる。その後、感光性樹脂版の厚みを決めるため
にセットされたスペーサー８の上に置かれた上部透明基
板２を通して活性光を照射してレリーフ部分の基部を形
成させるためのマスキング露光を行い、次にレリーフ部
分の画像を形成させるために下部透明基板１側からネガ
フィルム３を介して活性光を照射してレリーフ露光を行
なった後、図２のようにマスキングフィルム７を取り除
いて、形成されたレリーフ部Ａ，Ｂをベースフィルム６
に安定的に固定させるためのバック露光を上部透明基板
２側から行なう。2. Description of the Related Art Generally, in order to manufacture a printing plate using this liquid photosensitive resin, first, as shown in FIG. 1, a negative film 3 and a cover film 4 are placed on the lower transparent base plate 1 by means such as vacuum. Then, the photosensitive resin layer 5 is laminated thereon, and the base film 6 and the masking film 7 are superposed thereon. Then, active light is irradiated through the upper transparent substrate 2 placed on the spacer 8 set to determine the thickness of the photosensitive resin plate, and masking exposure for forming the base of the relief portion is performed. Relief exposure is performed by irradiating active light from the lower transparent substrate 1 side through the negative film 3 to form an image of the relief portion, and then the masking film 7 is removed as shown in FIG. Parts A and B are base film 6
Back exposure is performed from the upper transparent substrate 2 side so as to be stably fixed to.
【０００３】次に、適当な洗剤で未硬化部分を洗い出し
て現像し、後露光及び乾燥処理を施せば、印刷版が得ら
れる。または、マスキングフィルムを使用しないで、下
部透明基版１の上にネガフィルム３及びカバーフィルム
４を密着して置き、その上に感光性樹脂層５を積層し、
これにベースフィルム６を重ねる。その後、感光性樹脂
版の厚みを決めるためにセットされたスペーサー８の上
に置かれた上部透明基板２を通して活性光を照射して版
の基部を形成させるためのバック露光を行い、次に下部
透明基板１側からネガフィルム３を介して活性光を照射
してレリーフ露光を行ない、現像、後露光及び乾燥処理
して版を得る方法も広く用いられている。Next, the uncured portion is washed out with a suitable detergent, developed, and post-exposed and dried to obtain a printing plate. Alternatively, without using a masking film, the negative film 3 and the cover film 4 are placed in close contact with each other on the lower transparent base plate 1, and the photosensitive resin layer 5 is laminated thereon.
The base film 6 is superposed on this. After that, back exposure is performed to irradiate active light through the upper transparent substrate 2 placed on the spacer 8 set to determine the thickness of the photosensitive resin plate to form the base of the plate, and then to the lower part. A method of irradiating active light from the transparent substrate 1 side through the negative film 3 to perform relief exposure, and performing development, post-exposure and drying to obtain a plate is also widely used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記の技
術で得られる印刷版には、通常版面画像面積すなわち印
刷時に被印刷物と接触する部分の面積の異なるレリーフ
部分がふくまれるが、このようなレリーフ部分において
は、図３に示す断面図のように版面画像面積の小さいレ
リーフ部分Ｂ（以下小面積レリーフ部と略記）が版面画
像面積の大きいレリーフ部分Ａ（以下大面積レリーフ部
と略記）よりも版厚が高くなる傾向がみられ、また大面
積レリーフ部においては、その中心部が周囲部よりも低
く、陥没した状態になる傾向がある。この現象は感光性
樹脂が光硬化する際に発生する熱による透明基板の熱変
形及び感光性樹脂が硬化する際の収縮に起因する。そし
て、このような各レリーフ部分間の版厚の高低や同一レ
リーフ部分の画像に凹凸を生じると、これを用いて印刷
したときに大面積レリーフ部の中心部等で印刷インキの
着肉及び転移が不十分になり、その結果、鮮明な印刷画
像が得られ難くなり、また印刷インキの着肉及び転移を
十分にするために印圧を増加すると小面積レリーフ部が
変形するため、印刷ゲイン（原稿に対する画像の太り）
が大きくなるのを免れない。However, the printing plate obtained by the above technique usually includes relief parts having different plate surface image areas, that is, the areas of the parts which come into contact with the material to be printed at the time of printing. In FIG. 3, a relief portion B having a small plate image area (hereinafter abbreviated as small area relief portion) has a larger plate than a relief portion A having a large plate image area (hereinafter abbreviated as large area relief portion) as shown in the sectional view of FIG. The thickness tends to increase, and in the large-area relief portion, the central portion is lower than the peripheral portion, and the relief portion tends to be depressed. This phenomenon is caused by thermal deformation of the transparent substrate due to heat generated when the photosensitive resin is photocured and contraction when the photosensitive resin is cured. When unevenness occurs in the image of the same relief portion or the height of the plate thickness between such relief portions, when printing is performed using this, inking and transfer of printing ink at the central portion of the large area relief portion, etc. Is insufficient, and as a result, it is difficult to obtain a clear printed image, and when the printing pressure is increased in order to sufficiently deposit and transfer the printing ink, the small area relief portion is deformed. The image is thicker than the original)
Is inevitable.
【０００５】従来、このような欠点を克服するために、
硬化時の収縮の少ない感光性樹脂組成の開発が行われて
きたが、特殊な化合物を用いたり、印刷版ごとに適合す
る組成物を用意する必要がある上に、効果上の限界があ
り、必ずしも満足のしうるものではなかった。そこで本
発明はこのような従来方法における欠点を克服し、小面
積レリーフ部の高さが大面積レリーフ部の高さと同じ
で、かつ大面積レリーフ部における中心部と周囲部との
高低差のない版面を形成させることにより、鮮明でしか
も印刷ゲインの小さい印刷画像を与える印刷用凸版を製
造する方法を提供することを課題とするものである。Conventionally, in order to overcome such drawbacks,
Development of a photosensitive resin composition with less shrinkage during curing has been carried out, but it is necessary to use a special compound or prepare a composition suitable for each printing plate, and there is a limit to its effect. It was not always satisfactory. Therefore, the present invention overcomes the drawbacks of the conventional method, the height of the small area relief portion is the same as the height of the large area relief portion, and there is no difference in height between the central portion and the peripheral portion of the large area relief portion. An object of the present invention is to provide a method for producing a printing relief plate that forms a printing surface and forms a clear printing image with a small printing gain.
【０００６】[0006]
【課題を解決するための手段】本願発明は、下部透明基
板の上にネガフィルム、カバーフィルム、液状感光性樹
脂、ベースフィルム、マスキングフィルム、上部透明基
板をこの順序に積層し、先ず上部透明基板を通してマス
キング露光を行ない、次いで下部透明基板を通してレリ
ーフ露光を行ない、更にマスキングフィルムを除去した
上で、上部透明基板を通してバック露光を行なった後、
未硬化の液状感光性樹脂を除去して感光性樹脂版を作成
する方法であって、マスキング露光とレリーフ露光との
間に２分以上、レリーフ露光待時間を設ける感光性樹脂
版の製造方法であり、または、下部透明基板の上にネガ
フィルム、カバーフィルム、液状感光性樹脂、ベースフ
ィルム、上部透明基板をこの順序に積層し、先ず上部透
明基板を通してバック露光を行ない、次いで下部透明基
板を通してレリーフ露光を行なった後、未硬化の液状感
光性樹脂を除去して感光性樹脂版を作成する方法であっ
て、バック露光とレリーフ露光との間に２分以上、レリ
ーフ露光待時間を設ける感光性樹脂版の製造方法であ
る。さらには、マスキング露光中又はレリーフ露光待時
間中の少なくとも一方の間に、２枚の透明基板間距離を
減少させる請求項１または２に記載の感光性樹脂版の製
造方法である。According to the present invention, a negative film, a cover film, a liquid photosensitive resin, a base film, a masking film, and an upper transparent substrate are laminated in this order on a lower transparent substrate. Through the lower transparent substrate, then the relief exposure through the lower transparent substrate, after removing the masking film, back exposure through the upper transparent substrate,
A method for producing a photosensitive resin plate by removing an uncured liquid photosensitive resin, comprising a relief exposure waiting time of 2 minutes or more between masking exposure and relief exposure. Yes, or a negative film, a cover film, a liquid photosensitive resin, a base film, and an upper transparent substrate are laminated in this order on the lower transparent substrate, and back exposure is performed through the upper transparent substrate first, and then relief is performed through the lower transparent substrate. A method of producing a photosensitive resin plate by removing an uncured liquid photosensitive resin after exposure, wherein a relief exposure waiting time of 2 minutes or more is provided between back exposure and relief exposure. It is a method of manufacturing a resin plate. Furthermore, the method for producing a photosensitive resin plate according to claim 1 or 2, wherein the distance between the two transparent substrates is reduced during at least one of the masking exposure and the relief exposure waiting time.
【０００７】すなわち、本願発明の製造方法は、感光性
樹脂を成型・露光するに際して、第１次露光である背面
露光（マスキング露光又はバック露光）の後に２分以
上、好ましくは３分以上の待時間を入れた後にレリーフ
露光することを特徴とするものである。以下、本願発明
をさらに詳細に説明する。That is, according to the manufacturing method of the present invention, when molding and exposing the photosensitive resin, after the back exposure (masking exposure or back exposure) which is the first exposure, a waiting time of 2 minutes or more, preferably 3 minutes or more is waited. It is characterized in that relief exposure is performed after a certain period of time. Hereinafter, the present invention will be described in more detail.
【０００８】本願発明の製造方法においては、感光性樹
脂、例えば特公昭５２−７７６１号、特開昭６０−１９
１２３７号、特開昭６３−８８５５５号、特開平１−２
４５２４５号公報等で示される液状感光性樹脂を使用す
る事ができる。通常版厚が４ｍｍ以上のいわゆる厚手版
を製造する場合は、先ず図１のように、透明基板１の上
にネガフィルム３及びカバーフィルム４を重ねて置き、
透明基板１に加工された穴・溝及び真空配管によりネガ
フィルム４を透明基板１に真空密着する。その上に感光
性樹脂層５を積層し、これにベースフィルム６とマスキ
ングフィルム７を重ねる。その後、感光性樹脂版の厚み
を決めるためにセットされたスペーサー８の上に透明基
板２を乗せ、この透明基板２を通して活性光を照射して
レリーフ部分の基部を形成させるための背面露光（マス
キング露光）を行ない、次に１分以上、好ましくは２分
以上の全く露光を行なわない時間、言わば「レリーフ露
光待時間」を設け、しかる後に画像のレリーフ部分を形
成させるために透明基板１側からネガフィルム３を介し
て活性光を照射するレリーフ露光を行なう。次にマスキ
ングフィルム７を取り除いて、形成されたレリーフ部Ａ
・Ｂとベースフィルム６とを固定させるためのバック露
光を透明基板２側から行なう。In the production method of the present invention, a photosensitive resin such as Japanese Patent Publication No. 52-7761 and Japanese Patent Laid-Open No. 60-19 is used.
1237, JP-A-63-88555, JP-A 1-2.
The liquid photosensitive resin disclosed in Japanese Patent No. 45245 can be used. When manufacturing a so-called thick plate having a normal plate thickness of 4 mm or more, first, as shown in FIG. 1, a negative film 3 and a cover film 4 are placed on the transparent substrate 1 in a stacked manner,
The negative film 4 is vacuum-adhered to the transparent substrate 1 through the holes / grooves and the vacuum piping processed in the transparent substrate 1. A photosensitive resin layer 5 is laminated thereon, and a base film 6 and a masking film 7 are superposed on this. After that, the transparent substrate 2 is placed on the spacer 8 set to determine the thickness of the photosensitive resin plate, and active light is radiated through the transparent substrate 2 to form the base of the relief portion by back exposure (masking). Exposure), and then a time for which no exposure is performed for 1 minute or more, preferably 2 minutes or more, that is, a "relief exposure waiting time" is provided, and then, from the transparent substrate 1 side to form a relief portion of an image. Relief exposure is performed by irradiating active light through the negative film 3. Next, the masking film 7 is removed to form the relief portion A formed.
Back exposure for fixing B and the base film 6 is performed from the transparent substrate 2 side.
【０００９】次に、適当な洗剤で未硬化の感光性樹脂を
洗浄除去し、後露光及び乾燥処理を施す事により、印刷
版が得られる。又、通常版厚が４ｍｍ未満の比較的薄い
版を製造する場合には、上記したマスキングフィルム７
を使用しないで、先ず透明基板２を通して版全面にレリ
ーフ部分の基部を形成させるための背面露光（バック露
光）を行ない、次いで画像のレリーフ部分を形成させる
ために透明基板１側からレリーフ露光を行なう方法が行
なわれる。この場合にも、背面露光（バック露光）とレ
リーフ露光の間に１分以上、好ましくは２分以上の「レ
リーフ露光待時間」を設ける。Next, the uncured photosensitive resin is washed off with a suitable detergent, and post-exposure and drying treatments are carried out to obtain a printing plate. When a relatively thin plate having a plate thickness of less than 4 mm is usually manufactured, the masking film 7 described above is used.
Backside exposure (back exposure) for forming the base of the relief portion on the entire surface of the plate through the transparent substrate 2, and then the relief exposure from the transparent substrate 1 side for forming the relief portion of the image. The method is carried out. Also in this case, a "relief exposure waiting time" of 1 minute or more, preferably 2 minutes or more is provided between the back side exposure (back exposure) and the relief exposure.
【００１０】このようにして得られた印刷版は、従来の
方法によって製造された版に比べて、特に大面積レリー
フ部における中心部と周囲部との厚み差が少なく、更に
は小面積レリーフ部と大面積レリーフ部の厚さがほぼ同
一であって、鮮明でしかもゲインの小さい、原稿に対し
て高度の再現性を有する印刷画像を与えることができ
る。レリーフ露光待ち時間としては、通常２分以上、好
ましくは３分から７分の間の時間が前記画像間の厚み差
が極小化でき、しかも従来に比べての製版時間の延長が
過大とならない、有効性・実用性の高い条件である。更
に、露光中又はレリーフ露光待ち時間中の少なく共一方
の間に、２枚の透明基板間距離を適当量減少させる事に
より、より厚み精度の向上した版を製造する事ができ
る。The printing plate thus obtained has a smaller difference in thickness between the central portion and the peripheral portion in the large area relief portion than the plate produced by the conventional method, and further has a small area relief portion. It is possible to provide a printed image having a high reproducibility with respect to an original, which has a large area relief portion with substantially the same thickness and is clear and has a small gain. The relief exposure waiting time is usually 2 minutes or more, preferably 3 minutes to 7 minutes, because the thickness difference between the images can be minimized, and the plate-making time is not extended excessively compared to the conventional one. It is a condition that is highly practical and practical. Further, by reducing the distance between the two transparent substrates by an appropriate amount during the exposure or during the relief exposure waiting time, at least on the other hand, it is possible to manufacture a plate having more improved thickness accuracy.
【００１１】この製版に使用される透明基板としては、
ガラス及びアクリル樹脂、ポリカーボネート樹脂、ポリ
塩化ビニール樹脂などのプラスチックや透明セラミック
が用いられる。本発明によれば、マスキング露光の後、
レリーフ露光前に全く露光しない時間を設ける事によ
り、この待ち時間中に、マスキング露光中に樹脂の硬化
によって発生した熱による上下の透明基板の変形が回復
し、更には両透明基板間に拘束されている感光性樹脂の
硬化に伴なう収縮によって発生する未硬化樹脂の流動が
停止し、樹脂層の厚みが平準化する事によって、画像部
間の厚み差が極小化した版を製造する事ができる。更
に、露光中又はレリーフ露光待時間中の少なくとも一方
の間に、感光性樹脂の硬化収縮率に見合った量だけ、２
枚の透明基板間距離を減少させる事により、露光中の樹
脂層の厚みの平準化が一層促進され、より厚み精度の向
上した版を製造する事ができる。As the transparent substrate used for this plate making,
Glass and plastics such as acrylic resin, polycarbonate resin, polyvinyl chloride resin and transparent ceramics are used. According to the invention, after masking exposure,
By providing a time during which no exposure is performed before the relief exposure, the deformation of the upper and lower transparent substrates due to the heat generated by the curing of the resin during the masking exposure is restored during this waiting time, and further the binding between the transparent substrates is restrained. The flow of the uncured resin that occurs due to the shrinkage of the photosensitive resin during curing stops, and the thickness of the resin layer is leveled to produce a plate in which the thickness difference between the image areas is minimized. You can Further, during at least one of the exposure time and the relief exposure waiting time, an amount corresponding to the curing shrinkage ratio of the photosensitive resin is 2
By reducing the distance between the transparent substrates, it is possible to further promote the leveling of the thickness of the resin layer during exposure, and it is possible to manufacture a plate having an improved thickness accuracy.
【００１２】[0012]
【実施例】以下に本発明の実施例を説明する。なお、各
実施例における版厚精度△Ｔ及び大面積レリーフ内版厚
差△ｔは次のように定める。 （１）版厚精度△Ｔ；全体のレリーフ部の版厚を、５０
ｍｍ以上１５０ｍｍ以下の間隔の格子状に配設された個
所で測定し、その最小値と最大値の差。 （２）大面積レリーフ内版厚差△ｔ；最も大きい版面画
像面積のレリ−フ部の中心部と外周部の版厚の差。Embodiments of the present invention will be described below. The plate thickness accuracy ΔT and the large area relief inner plate thickness difference Δt in each example are determined as follows. (1) Plate thickness accuracy ΔT; the plate thickness of the entire relief part is 50
The difference between the minimum value and the maximum value measured at points arranged in a grid pattern with an interval of mm or more and 150 mm or less. (2) Large area relief inner plate thickness difference Δt; difference in plate thickness between the central portion and outer peripheral portion of the relief portion having the largest plate surface image area.
【００１３】[0013]
【実施例１】高精度に研磨されたパイレックスガラス製
下部硬質透明基板の上にネガフィルム及びカバーフィル
ムを介して液状感光製樹脂ＡＰＲ（登録商標） Ｆー４
７（旭化成工業株式会社製）を積層して厚さ７ｍｍ（カ
バーフィルム・ベースフィルム含む）の感光性樹脂層を
形成させ、その上にポリエステルベースフィルム及びマ
スキングフィルムを介して高精度に研磨されたパイレッ
クスガラス製上部硬質基板を載置した。２枚の硬質基板
の間隔はスペーサにより保持した。次いで上下硬質基板
より真空吸引して、ネガフィルム及びマスキングフィル
ムの密着性を保ちながら３分保持した後、上部透明基板
及びマスキングフィルムを透して活性光を照射してマス
キング露光を１５０秒行なった後に、５分間全く露光し
ない時間を設けた。その後、下部透明基板及びネガフィ
ルムを透して活性光を照射するレリーフ露光を１２０秒
行ない、マスキングフィルムを除去した。次に、上部透
明基板を透して活性光を照射するバック露光を２５秒行
ない画像形成露光を完了した。Example 1 Liquid photosensitive resin APR (registered trademark) F-4 on a lower hard transparent substrate made of Pyrex glass, which was highly accurately polished, with a negative film and a cover film interposed therebetween.
7 (manufactured by Asahi Kasei Co., Ltd.) was laminated to form a photosensitive resin layer having a thickness of 7 mm (including a cover film and a base film), which was ground with high accuracy through a polyester base film and a masking film. An upper rigid substrate made of Pyrex glass was placed. The space between the two hard substrates was held by a spacer. Then, vacuum suction was performed from the upper and lower hard substrates, and the negative film and the masking film were held for 3 minutes while maintaining the adhesiveness, and then the upper transparent substrate and the masking film were passed through to irradiate active light for masking exposure for 150 seconds. After that, a time was set for 5 minutes in which no exposure was performed. After that, relief exposure of irradiating active light through the lower transparent substrate and the negative film was performed for 120 seconds to remove the masking film. Next, back exposure was performed for 25 seconds by irradiating active light through the upper transparent substrate to complete the image forming exposure.
【００１４】次に、このようにして露光処理した感光層
を常法に従って洗浄液で洗い出し、現像したのち、後露
光し、乾燥することにより、版厚７ｍｍの印刷版を得
た。この版の版厚精度△Ｔ及び大面積レリーフ内版厚差
△Ｔを表１に示す。Then, the photosensitive layer thus exposed was washed out with a washing solution according to a conventional method, developed, and then post-exposed and dried to obtain a printing plate having a plate thickness of 7 mm. Table 1 shows the plate thickness accuracy ΔT and the large area relief inner plate thickness difference ΔT of this plate.
【００１５】[0015]
【比較例１】実施例１において、マスキング露光の後に
待ち時間を設けず、続けてレリーフ露光を行なった以外
は、実施例１と全く同様にして７ｍｍの印刷版を得た。
結果を表１に示す。Comparative Example 1 A 7 mm printing plate was obtained in the same manner as in Example 1 except that the masking exposure was not followed by the waiting time and the relief exposure was continuously performed.
The results are shown in Table 1.
【００１６】[0016]
【実施例２】実施例１と同様の製造方法で、マスキング
露光中に、上下の透明基板の間隔を０．０４ｍｍ縮小さ
せる条件で版厚７ｍｍの印刷版を得た。その結果を表２
に示す。Example 2 By the same manufacturing method as in Example 1, a printing plate having a plate thickness of 7 mm was obtained under the condition that the interval between the upper and lower transparent substrates was reduced by 0.04 mm during masking exposure. The results are shown in Table 2.
Shown in
【００１７】[0017]
【実施例３】実施例１と同様の製造方法で、マスキング
露光中に、上下の透明基板の間隔を０．１ｍｍ縮小さ
せ、更にレリ−フ露光待ち時間５分のうちの初めの２
分、上部透明基板からの真空吸引を中断する条件で版厚
７ｍｍの版を得た。その結果を表２に示す。[Embodiment 3] In the same manufacturing method as in Embodiment 1, the distance between the upper and lower transparent substrates is reduced by 0.1 mm during masking exposure, and the first 2 of the relief exposure waiting time of 5 minutes.
Therefore, a plate having a plate thickness of 7 mm was obtained under the condition that the vacuum suction from the upper transparent substrate was stopped. The results are shown in Table 2.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【発明の効果】本発明により、版面画像面積の大小に関
係なく良好なインキの着肉性及び転移性を示し、全体に
わたって鮮明でしかも小画像部におけるゲインが小さ
い、原稿に対する忠実度の高い印刷画像を与える感光性
樹脂版が、装置の部品精度等性能を上げる事なく、また
作業者の負担を増す事なく簡単に得られるので、ダンボ
ール印刷用、フィルム印刷用、プレプリント印刷用、ラ
ベル印刷用などの印刷版の製版方法として好適である。According to the present invention, good ink receptivity and transferability are exhibited irrespective of the size of the image area on the plate surface, printing is clear throughout, and the gain in the small image area is small, and printing with high fidelity to the original is performed. A photosensitive resin plate that gives an image can be easily obtained without increasing the performance of parts such as the precision of the device and without increasing the burden on the operator, so it can be used for cardboard printing, film printing, preprint printing, label printing. It is suitable as a method for making a printing plate for printing.
【図１】感光性樹脂版の露光工程の説明用断面図（マス
キング露光とレリーフ露光を終えた状態。）FIG. 1 is a sectional view for explaining an exposure process of a photosensitive resin plate (a state in which masking exposure and relief exposure have been completed).
【図２】バック露光を終えた状態の断面図。FIG. 2 is a sectional view showing a state in which back exposure has been completed.
【図３】従来の製造方法で得られる感光性樹脂版の断面
図。FIG. 3 is a sectional view of a photosensitive resin plate obtained by a conventional manufacturing method.
【図４】本発明の製造方法により得られる感光性樹脂版
の断面図。FIG. 4 is a cross-sectional view of a photosensitive resin plate obtained by the manufacturing method of the present invention.
１．下部透明基板 ２．上部透明基板 ３．ネガフィルム ４．カバーフィルム ５．感光性樹脂層 ６．ベースフィルム ７．マスキングフィルム ８．スペーサー ９．スペーサー １０．スポンジテープ １１．スポンジテープ Ａ．大面積レリーフ部 Ｂ．小面積レリーフ部 1. Lower transparent substrate 2. Upper transparent substrate 3. Negative film 4. Cover film 5. Photosensitive resin layer 6. Base film 7. Masking film 8. Spacer 9. Spacer 10. Sponge tape 11. Sponge tape A. Large area relief part B. Small area relief
Claims (3)
ーフィルム、液状感光性樹脂、ベースフィルム、マスキ
ングフィルム、上部透明基板をこの順序に積層し、先ず
上部透明基板を通してマスキング露光を行ない、次いで
下部透明基板を通してレリーフ露光を行ない、更にマス
キングフィルムを除去した上で、上部透明基板を通して
バック露光を行なった後、未硬化の液状感光性樹脂を除
去して感光性樹脂版を作成する方法であって、マスキン
グ露光とレリーフ露光との間に２分以上、レリーフ露光
待時間を設ける感光性樹脂版の製造方法。1. A negative film, a cover film, a liquid photosensitive resin, a base film, a masking film, and an upper transparent substrate are laminated in this order on a lower transparent substrate, and first masking exposure is performed through the upper transparent substrate, and then the lower portion. A method of making a photosensitive resin plate by performing relief exposure through a transparent substrate, further removing the masking film, then performing back exposure through an upper transparent substrate, and then removing the uncured liquid photosensitive resin. A method for producing a photosensitive resin plate, wherein a relief exposure waiting time of 2 minutes or more is provided between masking exposure and relief exposure.
ーフィルム、液状感光性樹脂、ベースフィルム、上部透
明基板をこの順序に積層し、先ず上部透明基板を通して
バック露光を行ない、次いで下部透明基板を通してレリ
ーフ露光を行なった後、未硬化の液状感光性樹脂を除去
して感光性樹脂版を作成する方法であって、バック露光
とレリーフ露光との間に２分以上、レリーフ露光待時間
を設ける感光性樹脂版の製造方法。2. A negative film, a cover film, a liquid photosensitive resin, a base film, and an upper transparent substrate are laminated in this order on the lower transparent substrate, and back exposure is performed through the upper transparent substrate first, and then through the lower transparent substrate. A method for producing a photosensitive resin plate by removing an uncured liquid photosensitive resin after performing a relief exposure, which comprises a relief exposure waiting time of 2 minutes or more between the back exposure and the relief exposure. Of producing a flexible resin plate.
間中の少なくとも一方の間に、２枚の透明基板間距離を
減少させる請求項１または２に記載の感光性樹脂版の製
造方法。3. The method for producing a photosensitive resin plate according to claim 1, wherein the distance between the two transparent substrates is reduced during at least one of the masking exposure and the relief exposure waiting time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11428095A JP3562865B2 (en) | 1995-05-12 | 1995-05-12 | Manufacturing method of photosensitive resin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11428095A JP3562865B2 (en) | 1995-05-12 | 1995-05-12 | Manufacturing method of photosensitive resin plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08305006A true JPH08305006A (en) | 1996-11-22 |
| JP3562865B2 JP3562865B2 (en) | 2004-09-08 |
Family
ID=14633887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11428095A Expired - Lifetime JP3562865B2 (en) | 1995-05-12 | 1995-05-12 | Manufacturing method of photosensitive resin plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3562865B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333142B1 (en) | 1998-06-24 | 2001-12-25 | Fujitsu Limited | Master for barrier rib transfer mold, and method for forming barrier ribs of plasma display panel using the same |
| JP2002268230A (en) * | 2001-03-09 | 2002-09-18 | Asahi Kasei Corp | Method and device for manufacturing photosensitive resin letterpress |
| JP2007279325A (en) * | 2006-04-05 | 2007-10-25 | Asahi Kasei Chemicals Corp | Device and method for manufacturing photosensitive resin plate |
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| EP3368949B1 (en) | 2015-10-26 | 2022-02-16 | Esko-Graphics Imaging GmbH | System and method for controlled exposure of flexographic printing plates |
| US11333980B2 (en) | 2015-10-26 | 2022-05-17 | Esko-Graphics Imaging Gmbh | Method and apparatus for exposure of flexographic printing plates using light emitting diode (LED) radiation sources |
| EP3583470B1 (en) | 2017-03-20 | 2022-09-21 | Esko-Graphics Imaging GmbH | Process and apparatus for adjusting the floor of a flexographic printing plate in a controlled exposure system or process |
-
1995
- 1995-05-12 JP JP11428095A patent/JP3562865B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333142B1 (en) | 1998-06-24 | 2001-12-25 | Fujitsu Limited | Master for barrier rib transfer mold, and method for forming barrier ribs of plasma display panel using the same |
| WO2004075232A1 (en) * | 1998-06-24 | 2004-09-02 | Osamu Toyoda | Original form for partition transfer intaglio and method for forming partitions of plasma display panel using the original form |
| JP2002268230A (en) * | 2001-03-09 | 2002-09-18 | Asahi Kasei Corp | Method and device for manufacturing photosensitive resin letterpress |
| JP4698044B2 (en) * | 2001-03-09 | 2011-06-08 | 旭化成イーマテリアルズ株式会社 | Manufacturing method and apparatus for photosensitive resin relief printing plate |
| JP2007279325A (en) * | 2006-04-05 | 2007-10-25 | Asahi Kasei Chemicals Corp | Device and method for manufacturing photosensitive resin plate |
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| EP3368949B1 (en) | 2015-10-26 | 2022-02-16 | Esko-Graphics Imaging GmbH | System and method for controlled exposure of flexographic printing plates |
| EP3800508B1 (en) | 2015-10-26 | 2022-05-04 | Esko-Graphics Imaging GmbH | System and method for controlled exposure of flexographic printing plates |
| US11333980B2 (en) | 2015-10-26 | 2022-05-17 | Esko-Graphics Imaging Gmbh | Method and apparatus for exposure of flexographic printing plates using light emitting diode (LED) radiation sources |
| EP3583470B1 (en) | 2017-03-20 | 2022-09-21 | Esko-Graphics Imaging GmbH | Process and apparatus for adjusting the floor of a flexographic printing plate in a controlled exposure system or process |
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|---|---|
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