JP2010091867A - Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To continuously perform platemaking of a photosensitive resin letterpress plate while reliably controlling a plate thickness. <P>SOLUTION: The method for manufacturing a photosensitive resin letterpress plate includes exposing a photosensitive resin layer in a laminate including a first film layer (cover film) 24, the photosensitive resin layer 25 and a second film layer (base film) 26, while the laminate is interposed between a lower hard plate 14 and an upper hard plate 15, and the method includes the following steps (a) to (d). They are steps of: (a) directly or indirectly measuring the temperature of the upper hard plate and/or the lower hard plate, or the temperature of the lower hard plate through the first film layer laminated on the lower hard plate; (b) applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate; (c) adjusting the coating thickness of the liquid photosensitive resin; and (d) adjusting a gap between the lower hard plate and the upper hard plate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method and apparatus for producing a photosensitive resin relief printing plate used for printing corrugated cardboard, films, seals, labels and the like.

In general, in order to manufacture a photosensitive resin relief printing plate using a liquid photosensitive resin, a photosensitive resin relief printing plate production apparatus having an exposure device represented by the configuration illustrated in FIG. 1 is used (for example, And Patent Documents 1 to 4).
FIG. 1 shows a perspective view of a conventional photosensitive resin relief printing apparatus 10 for producing a photosensitive resin relief printing plate using a liquid photosensitive resin.
The photosensitive resin relief printing apparatus 10 includes an upper light source 11, an upper hard plate 13, a lower hard plate 14, and a lower light source 12.
In addition, the photosensitive resin relief printing apparatus 10 includes a cover film storage unit 15 for supplying a cover film disposed on a negative film (not shown) on the lower hard plate 14, and a mask on the upper hard plate 13. And a base film set unit 16 for supplying a base film disposed via a negative film.
Further, a liquid photosensitive resin coating bucket 17 for supplying the liquid photosensitive resin onto the lower hard plate 14 via the cover film is provided.
As the carriage 18 moves, the liquid photosensitive resin is applied onto the lower hard plate 14, and at the same time, the base film is supplied from the base film setting unit 16 onto the liquid photosensitive resin.

FIG. 2 is a schematic cross-sectional view showing a manufacturing process of the photosensitive resin relief printing plate.
First, the negative film 23 and the cover film 24 supplied from the cover film storage unit 15 are closely adhered to the lower hard plate 14 processed with high planar accuracy so as not to be wrinkled by means such as vacuum. It is fixed on the hard plate 14.
Next, the carriage 18 shown in FIG. 1 is moved to apply the liquid photosensitive resin 25 on the cover film 24.
In order to suppress the outflow of the liquid photosensitive resin 25 applied on the flat surface of the cover film 24, the dam material 30 having a height corresponding to the thickness of the liquid photosensitive resin 25 to be applied on the cover film 24. Is fixed to the cover film 24 by sticking it on the cover film 24 or the like.
Here, after applying the liquid photosensitive resin 25 in the frame formed by the dam material 30, the base film 26 and the mask negative film 27 are overlaid on the liquid photosensitive resin 25.
Thereafter, a negative film 23, a cover film 24, a dam material laminated on the lower hard plate 14 by the upper hard plate 13 placed on the spacer 28 set to determine the thickness of the photosensitive resin plate. 30. The liquid photosensitive resin 25, the base film 26, and the mask negative film 27 are sandwiched.

Next, active light from the upper light source 11 is irradiated through the upper hard plate 13 to perform masking exposure for forming the base of the relief portion of the target printing plate.
Next, in order to form an image of the relief portion, relief exposure is performed by irradiating active light from the lower light source 12 through the negative film 23 on the lower hard plate 14, and the exposure process is completed.

The cover film 24 is peeled off from the plate after the exposure, and the resin adhering to the cover film 24 and the uncured resin on the relief surface not irradiated with active light are scraped off with a rubber blade or the like.
In order to completely remove the uncured resin from the plate surface, the plate surface is washed out with an appropriate detergent and developed, followed by post-exposure and drying treatment, whereby the intended liquid photosensitive resin relief plate is produced.

JP-A-8-305006 JP-A-8-314126 Japanese Patent Laid-Open No. 11-84633 JP-A-11-151729

However, when the photosensitive resin relief printing plate is continuously made continuously, there arises a problem that the plate thickness gradually decreases.
The first cause is that the polymerization hardening heat of the photosensitive resin generated at the time of exposure is transmitted to the upper hard plate and the lower hard plate, and these are thermally deformed to narrow the interval between the upper and lower hard plates.
As a second cause, heat transfer from the upper hard plate and the lower hard plate, the temperature of which increases as the plate making is continuously performed, to the photosensitive resin, the resin viscosity is lowered and the resin layer is thinned by flowing. It can be mentioned.
In the actual plate making process, it is considered that the first and second causes are combined.
If the plate thickness decreases, it may cause printing defects such as ink fading, and it is necessary to adjust the printing pressure each time the plate is set on the plate cylinder of a printing press. Deteriorate production efficiency in Japan.

As a method for solving the above problems, the distance between the upper hard plate and the lower hard plate is measured for each plate making process, the degree of deformation of the upper and lower hard plates is calculated, and the thickness of the photosensitive resin layer due to resin flow is further calculated. It is possible to provide a mechanism for measuring the change in thickness and taking these into account, and correcting the plate thickness to a preset value.
However, in the continuous plate-making process, the temperature of the upper and lower hard plates and the photosensitive resin is constantly changing, so that it is substantially impossible to perform correction while measuring the individual state each time because the operation becomes complicated. is there.
Although a method of suppressing a temperature rise by providing a predetermined cooling mechanism is also conceivable, there is a practical disadvantage from the viewpoint of cost and energy consumption, and the time required for cooling causes a decrease in yield.

  Therefore, in the present invention, a method for producing a photosensitive resin relief plate capable of continuous plate making of a photosensitive resin relief plate while reliably controlling the plate thickness without performing the above complicated operation and at a low cost. Providing equipment.

  In the invention of claim 1, the photosensitive resin is exposed in a state where the laminate including the first film layer, the photosensitive resin layer, and the second film layer is sandwiched between the lower hard plate and the upper hard plate. A method for producing a relief plate, wherein (a) the temperature of the upper hard plate and / or the lower hard plate, or the temperature of the lower hard plate via the first film layer laminated on the lower hard plate is directly or indirectly A step of measuring, (b) a step of applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate, and (c) a step of adjusting the coating thickness of the liquid photosensitive resin. And (d) a method for producing a photosensitive resin relief printing plate, comprising a step of adjusting a distance between the lower hard plate and the upper hard plate.

  In the invention of claim 2, the adjustment of the coating thickness of the liquid photosensitive resin in the step (c) is performed by comparing the temperature measured in the step (a) with a preset temperature, and according to the difference. A method for producing a photosensitive resin relief printing plate according to claim 1 is provided.

  In the invention of claim 3, the adjustment of the interval between the lower hard plate and the upper hard plate in the step (d) is performed by comparing the temperature measured in the step (a) with a preset temperature. The manufacturing method of the photosensitive resin letterpress of Claim 1 or 2 performed according to a difference is provided.

  In the invention of Claim 4, the photosensitive resin which exposes in the state which pinched | interposed the laminated body containing the 1st film layer, the photosensitive resin layer, and the 2nd film layer with the lower hard board and the upper hard board An apparatus for producing a letterpress, which directly or indirectly controls the temperature of a lower hard plate that transmits exposure light, an upper hard plate that is disposed opposite to the lower hard plate, and an upper hard plate and / or a lower hard plate. Temperature measurement mechanism to measure, electronic signal conversion mechanism to convert the measured temperature into an electronic signal, electronic signal of the measured temperature, and any corrected electronic signal corresponding to a preset temperature range, and measured temperature A control signal storage output mechanism for outputting an arbitrary corrected electronic signal corresponding to the above, a coating mechanism for applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate, and the lower hard plate The first to raise and lower Elevating mechanism, or to provide an apparatus for manufacturing a photosensitive resin relief printing plate and a second lifting mechanism for raising and lowering the spacer and the spacer has a function as a cradle coating mechanism running rail and the upper rigid plate.

  According to a fifth aspect of the present invention, there is provided the photosensitive resin relief printing plate manufacturing apparatus according to the fourth aspect, wherein the first elevating mechanism and the second elevating mechanism are configured to adjust a lifting amount in units of 1/100 mm. provide.

  6. The photosensitive resin relief printing plate according to claim 4, wherein the temperature measuring mechanism measures temperature at a position 20 mm or more inside from an end of the upper hard plate and / or the lower hard plate. A manufacturing apparatus is provided.

  According to a seventh aspect of the present invention, there is provided the photosensitive resin relief printing plate manufacturing apparatus according to any one of the fourth to sixth aspects, wherein the lower hard plate is moved up and down by the first lifting mechanism in accordance with the corrected electronic signal. .

  According to an eighth aspect of the present invention, there is provided the photosensitive resin relief printing plate manufacturing apparatus according to any one of the fourth to sixth aspects, wherein the spacer is moved up and down by the second lifting mechanism in accordance with the corrected electronic signal.

  According to a ninth aspect of the present invention, the photosensitive resin relief printing plate manufacturing apparatus according to any one of the fourth to sixth aspects or the eighth aspect, wherein the upper hard plate is moved up and down by the second lifting mechanism in accordance with the corrected electronic signal. I will provide a.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and manufacturing apparatus of the photosensitive resin letterpress which can perform continuous platemaking of the photosensitive resin letterpress while maintaining plate thickness uniform can be provided.

  Hereinafter, the best mode for carrying out the present invention (hereinafter, this embodiment) will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with various modifications within the scope of the gist.

[Method for producing photosensitive resin relief printing plate]
The method for producing a photosensitive resin relief printing plate according to this embodiment includes a laminate including a first film layer (cover film), a photosensitive resin layer, and a second film layer (base film), a lower hard plate and an upper hard plate. The photosensitive resin layer is exposed while being sandwiched between plates, and includes the following steps (a) to (d).
(A) A step of directly or indirectly measuring the temperature of the upper hard plate and / or the lower hard plate, or the temperature of the lower hard plate through the first film layer laminated on the lower hard plate.
(B) A step of applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate.
(C) A step of adjusting the coating thickness of the liquid photosensitive resin.
(D) A step of adjusting the distance between the lower hard plate and the upper hard plate.

[Production apparatus for photosensitive resin relief plate in first embodiment]
Exposure of the photosensitive resin layer in a state where the laminate including the first film layer (cover film), the photosensitive resin layer, and the second film layer (base film) is sandwiched between the lower hard plate and the upper hard plate. And a lower hard plate that transmits exposure light, an upper hard plate disposed opposite to the lower hard plate, an upper hard plate, and / or a lower hard plate. A temperature measurement mechanism that directly or indirectly measures the temperature of the sensor, an electronic signal conversion mechanism that converts the measured temperature into an electronic signal, an electronic signal of the measured temperature, and any modified electron corresponding to a preset temperature range A control signal storage output mechanism for storing a signal and outputting an arbitrary corrected electronic signal corresponding to the measured temperature, and a coating for applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate Machine When, and a first elevating mechanism for elevating said lower rigid plate.
The photosensitive resin relief printing plate manufacturing apparatus in the present embodiment has a plate thickness control function as an important function.
This is because the temperature of the upper hard plate and / or lower hard plate actually measured is compared with a preset temperature range, and a corrected electronic signal corresponding to the temperature range is output to output the first lifting mechanism. By controlling the operation amount, the plate thickness in continuous plate making is suppressed.

[Photosensitive resin relief plate manufacturing apparatus in the second embodiment]
Exposure of the photosensitive resin layer in a state where the laminate including the first film layer (cover film), the photosensitive resin layer, and the second film layer (base film) is sandwiched between the lower hard plate and the upper hard plate. And a lower hard plate that transmits exposure light, an upper hard plate disposed opposite to the lower hard plate, an upper hard plate, and / or a lower hard plate. A temperature measurement mechanism that directly or indirectly measures the temperature of the sensor, an electronic signal conversion mechanism that converts the measured temperature into an electronic signal, an electronic signal of the measured temperature, and any modified electron corresponding to a preset temperature range A control signal storage output mechanism for storing a signal and outputting it as an arbitrary corrected electronic signal corresponding to the measured temperature; and a coating for applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate. It has a mechanism, a spacer having a function as a cradle coating mechanism running rail and an upper rigid plate and a second lifting mechanism for raising and lowering the spacer.
The photosensitive resin relief printing plate manufacturing apparatus according to the second embodiment also has a plate thickness control function as an important function, similar to the photosensitive resin relief printing plate manufacturing apparatus according to the first embodiment described above. .
This is because the temperature of the upper hard plate and / or the lower hard plate actually measured is compared with a preset temperature range, and a corrected electronic signal corresponding to the temperature range is output to output the second lifting mechanism. By controlling the operation amount, the plate thickness in continuous plate making is suppressed.

  About the manufacturing method of the photosensitive resin letterpress in this embodiment, the case where the manufacturing apparatus of the photosensitive resin letterpress in the first embodiment is used, and the case where the manufacturing apparatus of the photosensitive resin letterpress in the second embodiment is used This will be explained separately.

[Manufacturing method using the photosensitive resin relief printing plate manufacturing apparatus in the first embodiment]
3 and 4 are schematic cross-sectional views for explaining the previous stage of the step (a) in the manufacturing method according to the present embodiment.
First, as shown in FIG. 3, the lower hard plate 14 placed on the first elevating mechanism 28 and the dam member 29 disposed around the lower hard plate 14 so as to have a gap d. The 1st film layer (cover film) 24 is stuck.
The negative film 23 for shaping the relief portion of the photosensitive resin relief plate is previously disposed between the lower hard plate 14 and the first film layer (cover film) 24.

The dam member 29 is a frame member disposed around the lower hard plate 14.
The material of the weir member 29 is not particularly limited, but is assumed to be a hard material that hardly changes in shape even when the upper hard plate 11 is placed. For example, metals, non-ferrous metals, resin molding materials and the like are preferable.
The contact surface of the dam member 29 with the first film layer 24 is preferably smoothed.
Since the dam member 29 itself is a frame member, the dam member 29 is arranged around the lower hard plate 14, the lower hard plate 14 is arranged in the dam member 29, and the first film layer 24 is formed of the lower hard plate. 14 and the upper surface of the weir member 29.
The gap d between the side surface of the weir member 29 and the side surface of the lower hard plate 14 is preferably 200 mm or less, and more preferably 5 mm or less. This is because when the concave portion is formed by the first film layer 24 and the liquid photosensitive resin is applied in the concave portion, the first film layer 24 sags due to the weight of the liquid photosensitive resin, and the liquid photosensitive resin is It is for suppressing flowing out of the molding range.

As shown in FIG. 3, the lower hard plate 14 and the dam member 29 preferably have grooves 36 and 35 on their upper surfaces. The first film layer 24 is desired by evacuating the air by a vacuum means or the like through the grooves 36, 35, or adjusting the position of the first film layer 24 by supplying air as necessary, and further evacuating. Can be brought into close contact with each other without generating wrinkles.
In FIG. 3, the grooves 36 and 35 are formed on the upper surfaces of the lower hard plate 14 and the dam member 29, but the positions of the grooves are not limited to these upper surfaces, and the first The film layer 24 may be in close contact with the lower hard plate 14 and the dam member 29, and may be, for example, a side surface of the lower hard plate 14 and the dam member 29.

Next, as shown in FIG. 4, the lower rigid plate 14 is moved downward by the first elevating mechanism 28, and the concave portion is formed by the first film layer 24.
Note that the dam member 29 may be moved upward to form a recess with the first film layer 24.
Further, when the lower hard plate 14 is moved by the first elevating mechanism 28, the first film layer 24 is brought into close contact with the lower hard plate 14 and the dam member 29 while maintaining a vacuum through the grooves 35 and 36 and positioned. It is preferable to maintain the accuracy.

  Here, the distance between the upper surface of the lower hard plate 14 and the upper surface of the dam member 29 corresponds to the depth of the recess formed by the first film layer 24, and is a photosensitive resin layer finally obtained by exposure curing. It affects the plate thickness of the photosensitive resin relief plate. Therefore, the distance between the upper surface of the lower hard plate 14 and the upper surface of the dam member 29 can be controlled within a range of, for example, 1 to 10 mm in consideration of the target plate thickness of the photosensitive resin relief plate. .

(Process (a))
As shown in FIG. 5, a coating mechanism (carriage) 51 having a temperature measuring mechanism 50 is moved in the direction of arrow A in the figure, and the temperature of the lower hard plate 14 is measured via the first film layer 24.
5 shows a state in which the temperature of the lower hard plate 14 is measured, but the temperature measurement mechanism 50 measures the temperature of the upper hard plate (not shown) disposed opposite to the lower hard plate 14. May be.
The temperature measurement is performed directly or indirectly, and may be performed in either a contact state or a non-contact state.

In the continuous engraving of the photosensitive resin relief plate, the temperature of the lower hard plate 14 and / or the upper hard plate 15 finally affects the plate thickness of the intended photosensitive resin relief plate. Temperature range) is determined in advance.
The temperature measured as described above is converted into an electronic signal by a predetermined electronic signal conversion mechanism (not shown), and this measured temperature is compared with a preset temperature (temperature range) determined in advance. Then, taking the difference amount into account, it is output as a corrected electronic signal by a predetermined control signal output mechanism (not shown).
When continuous plate making is performed, the plate thickness decreases as the temperature of the upper and lower hard plates increases with the progress of the process, but the temperature of the hard plate is generally lower than room temperature (about 20 ° C). If kept low, the plate thickness does not decrease.
However, once the temperature of the hard plate exceeds 20 ° C., the plate thickness decreases. Further, when the plate is continuously made, the hard plate temperature rises to around 50 ° C. at maximum and the plate thickness decreases. Becomes increasingly prominent. Since the plate thickness decreases in proportion to the temperature increase of the hard plate, for example, 20.0 ° C. is preset as the reference temperature, and the temperature is less than 20.0 ° C. and 20.0 ° C. or higher. In the case of
Specifically, in the temperature range of less than 20.0 ° C and in the temperature range of 20.0 ° C or higher, set in increments of 5 ° C, more strictly up to 60 ° C in increments of 1 ° C, and in each temperature range Corresponding correction electronic signal is arbitrarily set.
The corrected electronic signal is stored in the control signal storage and output mechanism, and the measured temperature is compared with a preset temperature range, and a corrected electronic signal corresponding to the temperature range is output.
The correction electronic signal to be output may be set as an indication data signal as an amount of mm for directly urging correction of plate thickness reduction, but preferably the operation of a pulse motor or a servo motor that drives the lifting mechanism You may set as a pulse signal which determines quantity.

(Process (b))
As shown in FIG. 6, the application mechanism (carriage) 51 is moved in the direction of arrow B in the figure, and the liquid photosensitive resin 25 is applied on the first film layer 24 laminated on the lower hard plate 14.
The liquid photosensitive resin 25 is not particularly limited, and conventionally known materials can be applied. Examples thereof include liquid photosensitive resins composed of an oligomer or polymer component, a polymerizable monomer component, a photoinitiator, and a stabilizer.
When the liquid photosensitive resin 25 is applied, the cover film 24 is brought into close contact with the lower hard plate 14 and the dam member 29 while maintaining a vacuum through the grooves 35 and 36, thereby increasing the positioning accuracy of the photosensitive resin relief plate. From the viewpoint of maintaining high.
The application method of the liquid photosensitive resin 25 is not particularly limited, but as illustrated in FIG. 1, when the application mechanism (carriage) 51 is moved on the lower hard plate 14, the liquid photosensitive resin coating bucket is used. The liquid photosensitive resin is preferably caused to flow out of the liquid 17 and applied to the recess formed by the first film layer 24.

(Process (c))
When applying the liquid photosensitive resin 25 described above, the coating thickness is adjusted. This is because the coating thickness of the liquid photosensitive resin finally affects the plate thickness of the target photosensitive resin relief printing plate.
In continuous plate-making, the temperature of the lower hard plate 14 or the upper hard plate (not shown) rises, and the interval between the upper and lower hard plates tends to be narrowed due to thermal deformation.
In addition, heat is transferred from the upper hard plate and the lower hard plate to the photosensitive resin, the viscosity decreases, and the resin layer tends to be thinned.
In order to solve the problem of causing the plate thickness to decrease due to these temperature effects, the height of the lower hard plate 14 is adjusted by the first elevating mechanism 28 in accordance with the corrected electronic signal obtained in the step (a). Specifically, by lowering the lower hard plate 14 in units of 1/100 mm, the interval between the lower hard plate 14 and the coating bucket 17 is slightly increased, and the resin coating thickness is slightly increased. Finally, the distance between the upper hard plate and the lower hard plate, that is, the molding thickness of the plate can be slightly increased.
As a result, a reduction in plate thickness can be suppressed, and a plate having a stable plate thickness can be continuously produced. For example, the operation amount of the first elevating mechanism 28 is corrected by a pulse signal and is added to the plate thickness to be manufactured at once, thereby suppressing the decrease in the plate thickness.
Further, as a method of correcting the coating thickness of the liquid photosensitive resin, for example, a method of adjusting the opening of the coating bucket 17 in the step (b) according to the corrected electronic signal obtained in the step (a), or a corrected electronic signal A method of correcting the coating thickness of the liquid photosensitive resin by adjusting the moving speed of the coating mechanism (carriage) 51 according to the above is also effective.
The amount of decrease in plate thickness varies slightly depending on the plate thickness to be manufactured, but is approximately 1/100 mm to a maximum of 15/100 mm when the hard plate temperature is in the range of 20.0 ° C. to 60.0 ° C.

In addition, when applying the liquid photosensitive resin 25 described above, a second film layer (base film) 26 is laminated on the liquid photosensitive resin 25.
The method of laminating the second film 26 is not particularly limited, but it is preferable to supply the second film 26 onto the liquid photosensitive resin 25 by the base film setting unit 16 as illustrated in FIG.
In addition, when laminating | stacking the 2nd film layer 26, it is preferable from a viewpoint of positioning accuracy to hold | maintain a vacuum via the grooves 35 and 36. FIG.
Further, when laminating the second film 26, it is preferable to press with the laminating roll 53.

(Process (d))
FIG. 7 is a schematic cross-sectional view of the steps of forming and exposing.
A mask negative film 27 and an upper hard plate 13 are disposed from above the liquid photosensitive resin layer 25 applied on the lower hard plate 14.
While maintaining the vacuum through the grooves 36 and 35 of the lower hard plate 14 and the dam member 29, the first film layer 24 is brought into close contact with the lower hard plate 14 and the dam member 29, and the mask negative film 27 and the upper hard plate 13. Is laminated on the liquid photosensitive resin layer 25 and compressed.

Subsequently, an actinic ray from the upper light source 11 is irradiated through the upper hard plate 13 to perform masking exposure for forming the base of the relief portion of the target photosensitive resin relief printing plate.
Next, in order to form an image of the relief portion, relief exposure is performed by irradiating an actinic ray from the lower light source 12 through the negative film 23 on the lower hard plate 14, and the molding and exposure process is completed.
Although it does not specifically limit as the upper and lower light sources 11 and 12, The light source which radiates | emits the ultraviolet-ray which is an example of actinic light is preferable. Specific examples include a high-pressure mercury lamp, an ultraviolet fluorescent lamp, a metal halide lamp, and a UV-LED. The light irradiated to the liquid photosensitive resin preferably has a wavelength of 300 to 400 nm.

After the exposure process, the upper hard plate 13 and the mask negative film 27 are removed, air is supplied to the grooves 35 and 36, and the first film layer 24 that has been in vacuum contact with the lower hard plate 14 and the dam member 29 is removed. The laminated body which consists of the 1st film layer (cover film) 24, the liquid photosensitive resin 25, and the 2nd film layer (base film) 26 peels.
Thereafter, the first film layer 24 is peeled off, and the adhering resin and the uncured resin on the relief surface not irradiated with active light are removed with a rubber blade or the like.
In order to completely remove the uncured resin, an appropriate detergent can be used. For example, developer W-13 (trademark, manufactured by Asahi Kasei Chemicals Corporation, an anionic surfactant aqueous solution) 2.0 mass%, surface treatment agent A-10 (trademark, manufactured by Asahi Kasei Chemicals Corporation, benzophenone-containing nonionic interface) Activating agent aqueous solution) is added to 0.33% by mass, and an antifoaming agent SH-4 (trademark: Asahi Kasei Chemicals Co., Ltd., silicon-based antifoaming agent) is added in an amount of 0.3% by mass. By washing, developing, post-exposure and drying treatment, the intended photosensitive resin relief printing plate is obtained.

[Manufacturing method using photosensitive resin relief plate manufacturing apparatus in the second embodiment]
8 and 9 are schematic cross-sectional views for explaining the previous stage of the step (a) in the manufacturing method according to the present embodiment.
In the photosensitive resin relief printing plate manufacturing apparatus according to this embodiment, the spacer 41 having functions as a coating mechanism (carriage) travel rail and an upper hard plate receiving base is parallel on the front side and the back side on the paper surface of FIG. The lower rigid board 14 is arrange | positioned between the spacers. The spacer 41 is supported by the second lifting mechanism 40 so as to be lifted and lowered.
As shown in FIG. 8, a first film layer (cover film) 24 is adhered to the lower hard plate 14.
The negative film 23 for shaping the relief portion of the photosensitive resin relief plate is previously disposed between the lower hard plate 14 and the first film layer (cover film) 24.

As shown in FIG. 8, the lower hard plate 14 preferably has a groove 36 on the upper surface.
The air is exhausted by a vacuum means or the like through the groove 36, or the first film layer (cover film) 24 is further exhausted after adjusting the position of the first film layer (cover film) 24 by supplying air if necessary. Cover film) 24 can be brought into close contact with a predetermined position of the lower hard plate 14 without wrinkles.
Next, as shown in FIG. 9, the spacer 41 is moved upward by the second elevating mechanism 40 to ensure an interval for the coating mechanism (carriage) 51 to travel on the surface of the cover film 24.

(Process (a))
As shown in FIG. 10, a coating mechanism (carriage) 51 having a temperature measuring mechanism 50 is moved in the direction of arrow A in the figure, and the temperature of the lower hard plate 14 is measured via the first film layer 24.
Although FIG. 10 shows a state in which the temperature of the lower hard plate 14 is measured, the temperature of the upper hard plate (not shown) disposed opposite to the lower hard plate 14 is measured by the temperature measuring mechanism 50. May be. The temperature measurement is performed directly or indirectly, and may be performed in either a contact state or a non-contact state.

In the continuous engraving of the photosensitive resin relief plate, the temperature of the lower hard plate 14 and / or the upper hard plate 15 finally affects the plate thickness of the intended photosensitive resin relief plate. It is determined in advance.
The temperature measured as described above is converted into an electronic signal by a predetermined electronic signal conversion mechanism (not shown), and this measured temperature is compared with a preset temperature (temperature range) determined in advance. Then, taking the difference amount into account, it is output as a corrected electronic signal by a predetermined control signal output mechanism (not shown).
When continuous plate making is performed, the plate thickness decreases as the temperature of the upper and lower hard plates increases with the progress of the process, but the temperature of the hard plate is generally lower than room temperature (about 20 ° C). If kept low, the plate thickness does not decrease.
However, once the temperature of the hard plate exceeds 20 ° C., the plate thickness decreases. Further, when the plate is continuously made, the hard plate temperature rises to around 50 ° C. at maximum and the plate thickness decreases. Becomes increasingly prominent. Since the plate thickness decreases in proportion to the temperature increase of the hard plate, for example, 20.0 ° C. is preset as the reference temperature, and the temperature is less than 20.0 ° C. and 20.0 ° C. or higher. In the case of
Specifically, in the temperature range of less than 20.0 ° C and in the temperature range of 20.0 ° C or higher, set in increments of 5 ° C, more strictly up to 60 ° C in increments of 1 ° C, and in each temperature range Corresponding correction electronic signal is arbitrarily set.
The corrected electronic signal is stored in the control signal storage output mechanism, the measured temperature is compared with a preset temperature range, and a corrected electronic signal corresponding to the temperature range is output.
The correction electronic signal to be output may be set in the sign data signal as an amount of mm for directly urging correction of plate thickness reduction, but preferably the operation of a pulse motor or a servo motor that drives the lifting mechanism You may set as a pulse signal which determines quantity.

  A dam material 30 having a height corresponding to the thickness of the liquid photosensitive resin 25 for suppressing the outflow of the liquid photosensitive resin 25 is fixed in a frame shape on the first film layer 24 in advance. .

(Process (b))
As shown in FIG. 11, the application mechanism (carriage) 51 is moved in the direction of arrow B in the figure, and the liquid photosensitive resin 25 is applied on the first film layer 24 laminated on the lower hard plate 14.
The liquid photosensitive resin 25 is not particularly limited, and conventionally known materials can be applied.
For example, a liquid photosensitive resin composed of an oligomer or polymer component, a polymerizable monomer component, a photoinitiator and a stabilizer can be used.
When applying the liquid photosensitive resin 25, the first film layer 24 is brought into close contact with the lower hard plate 14 while maintaining a vacuum through the groove 36, thereby maintaining high positioning accuracy of the photosensitive resin relief plate. It is preferable from the viewpoint.
The application method of the liquid photosensitive resin 25 is not particularly limited, but as illustrated in FIG. 1, when moving the application mechanism (carriage) 51 on the lower hard plate 14, the liquid photosensitive resin coating is applied. It is preferable that the liquid photosensitive resin flows out from the bucket 17 and is applied to the region surrounded by the dam material 30.

(Process (c))
When the liquid photosensitive resin 25 is applied, the application thickness is adjusted.
This is because the coating thickness of the liquid photosensitive resin finally affects the plate thickness of the target photosensitive resin relief printing plate.
In continuous plate-making, the temperature of the lower hard plate 14 or the upper hard plate (not shown) rises, and the interval between the upper and lower hard plates tends to be narrowed due to thermal deformation.
In addition, heat is transferred from the upper hard plate and the lower hard plate to the photosensitive resin, the viscosity decreases, and the resin layer tends to be thinned.
In order to solve the problem of the plate thickness reduction due to the temperature influence, the spacer 41 is adjusted by the second lifting mechanism 40 according to the above-described corrected electronic signal. Specifically, by raising the spacer 41 in units of 1/100 mm, the distance between the lower hard plate 14 and the coating bucket 17 can be slightly increased, and the coating thickness of the resin can be slightly increased. Thereby, the continuous plate-making of the plate | board of the stable plate | board thickness can be performed suppressing the fall of plate | board thickness.
That is, for example, the operation amount of the second lifting mechanism 40 is corrected by the above-described pulse signal, and the plate thickness is suppressed by being collectively added to the plate thickness to be manufactured.
In addition, as a method for correcting the coating thickness of the liquid photosensitive resin, for example, a method of adjusting the opening degree of the coating bucket 17 in the step (b) according to the correction electronic signal obtained in the step (a), or a correction electron A method of correcting the coating thickness of the liquid photosensitive resin by adjusting the moving speed of the coating mechanism (carriage) 51 according to the signal is also effective.
The amount of decrease in plate thickness varies slightly depending on the plate thickness to be manufactured, but is approximately 1/100 mm to a maximum of 15/100 mm when the hard plate temperature is in the range of 20.0 ° C. to 60.0 ° C.

In addition, when applying the liquid photosensitive resin 25 described above, a second film layer (base film) 26 is laminated on the liquid photosensitive resin 25.
The method of laminating the second film 26 is not particularly limited, but it is preferable to supply the second film 26 onto the liquid photosensitive resin 25 by the base film setting unit 16 as illustrated in FIG.
In addition, when laminating | stacking the 2nd film layer 26, it is preferable from a viewpoint of positioning accuracy to hold | maintain a vacuum through the groove | channel 36. FIG.
Further, when laminating the second film 26, it is preferable to press with the laminating roll 53.

(Process (d))
FIG. 12 is a schematic cross-sectional view of the steps of forming and exposing.
The upper hard plate 13 is arranged together with the mask negative film 27 from above the liquid photosensitive resin layer 25 applied on the lower hard plate 14.
The upper hard plate 13 is supported by a spacer 41 shown in FIG.
While maintaining the vacuum through the groove 36 of the lower hard plate 14, the first film layer 24 is closely attached to the lower hard plate 14, and the mask negative film 27 and the upper hard plate 13 are laminated on the liquid photosensitive resin layer 25. Compress.
At this time, according to the above-described corrected electronic signal, the spacer 41 is raised in units of 1/100 mm by the second elevating mechanism 40 to slightly increase the distance between the upper hard plate 13 and the lower hard plate 14 and to form the plate. Can be slightly increased. Thereby, the continuous plate-making of the plate | board of the stable plate | board thickness can be performed suppressing the fall of plate | board thickness.

Subsequently, an actinic ray from the upper light source 11 is irradiated through the upper hard plate 13 to perform masking exposure for forming the base of the relief portion of the target photosensitive resin relief printing plate.
Next, in order to form an image of the relief portion, relief exposure is performed by irradiating an actinic ray from the lower light source 12 through the negative film 23 on the lower hard plate 14, and the molding and exposure process is completed.
Although it does not specifically limit as the upper and lower light sources 11 and 12, The light source which radiates | emits the ultraviolet-ray which is an example of actinic light is preferable. Specific examples include a high-pressure mercury lamp, an ultraviolet fluorescent lamp, a metal halide lamp, and a UV-LED. The light irradiated to the liquid photosensitive resin preferably has a wavelength of 300 to 400 nm.

After the exposure process, the upper hard plate 13 and the mask negative film 27 are removed, air is supplied to the grooves 36, and the first film layer 24 that has been vacuum-adhered to the lower hard plate 14 is detached, and the first film layer 24 is removed. A laminate comprising a film layer (cover film) 24, a liquid photosensitive resin 25, and a second film layer (base film) 26 is obtained.
Thereafter, the first film layer 24 is peeled off, and the adhering resin and the uncured resin on the relief surface not irradiated with active light are removed with a rubber blade or the like.
In order to completely remove the uncured resin from the printing plate, an appropriate detergent can be used. For example, developer W-13 (trademark, manufactured by Asahi Kasei Chemicals Corporation, an anionic surfactant aqueous solution) 2.0 mass%, surface treatment agent A-10 (trademark, manufactured by Asahi Kasei Chemicals Corporation, benzophenone-containing nonionic interface) Activating agent aqueous solution) is added to 0.33% by mass, and an antifoaming agent SH-4 (trademark: Asahi Kasei Chemicals Co., Ltd., silicon-based antifoaming agent) is added in an amount of 0.3% by mass. By washing, developing, post-exposure and drying treatment, the intended photosensitive resin relief printing plate is obtained.

[First embodiment of manufacturing apparatus for photosensitive resin relief printing plate]
The manufacturing apparatus of the photosensitive resin relief plate in 1st Embodiment is demonstrated.
The photosensitive resin relief printing apparatus 100 shown in FIG. 13 is a photosensitive resin relief printing plate that performs exposure with a liquid photosensitive resin sandwiched between a lower rigid plate 14 and an upper rigid plate 13 that faces the lower rigid plate. It is a manufacturing device.
The lower hard plate 14 that transmits the exposure light beam, the upper hard plate 13 opposed to the lower hard plate, and the temperature measurement mechanism that directly or indirectly measures the temperature of the upper hard plate 13 and / or the lower hard plate 14. 50, an application mechanism 51 for applying the liquid photosensitive resin, an electronic signal conversion mechanism (not shown) for converting the measured temperature into an electronic signal, and a comparison between the measured temperature and a preset temperature And a control signal output mechanism (not shown) for outputting the difference amount as a corrected electronic signal, and a first raising / lowering mechanism (not shown) for raising and lowering the lower hard plate 14.
The set temperature can be changed as required by the user, and the measured temperature can be appropriately observed with a predetermined monitor 55.

FIG. 14: shows the schematic exploded view of the principal part of the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment.
As shown in FIG. 14, the photosensitive resin relief printing apparatus 100 includes an upper hard plate 13 and a lower hard plate 14 that face each other, and a weir member 29 and a negative film above the lower hard plate 14 disposed on the lower side. 23, the first film layer (cover film) 24, the liquid photosensitive resin 25, the second film layer (base film) 26, and the mask negative film 27 are laminated in this order and sandwiched between the upper hard plates 13 arranged on the upper side. It has a function of compressing and then performing exposure.
Both the upper hard plate 13 and the lower hard plate 14 are preferably plate members that transmit actinic rays.

The dam member 29 is arranged around the lower hard plate 14 with a gap from the lower hard plate 14. This gap is between the weir member 29 and the lower hard plate 14, and the sides adjacent to each other are arranged with a certain gap (corresponding to d in FIG. 3 described above).
Although not illustrated in FIG. 14, the manufacturing apparatus 100 according to the present embodiment includes a cover film storage unit 15, a base film setting unit 16, a liquid photosensitive resin coating bucket 17, and a coating mechanism (carriage) illustrated in FIG. 13. 51 is provided.

  The application mechanism (reference numeral 51 in FIG. 5) includes a temperature measurement mechanism (reference numeral 50 in FIG. 5) that directly or indirectly measures the temperature of the upper hard plate 13 and / or the lower hard plate 14. The manufacturing apparatus according to the embodiment compares an electronic signal conversion mechanism (not shown) that converts the temperature measured by the temperature measurement mechanism into an electronic signal, and compares the measured temperature with a preset temperature. A control signal output mechanism (not shown) for outputting the quantity as a corrected electronic signal is provided.

FIG. 15 is a schematic perspective view showing the relationship between the lower hard plate 14 and the weir member 29 provided in the photosensitive resin relief printing apparatus 100 and the first elevating mechanism 28 having a function of moving the lower hard plate 14 up and down.
In the photosensitive resin relief printing apparatus 100, the lower hard plate 14 is movable up and down by a first lifting mechanism 28, and as described with reference to FIGS. The coating thickness of the liquid photosensitive resin, that is, the interval between the lower hard plate 14 and the upper hard plate 13 can be adjusted.
Specifically, the movement amount of the first elevating mechanism 28 is controlled according to the control signal.
The first elevating mechanism 28 is preferably a so-called sheet pile type illustrated in FIG. 15 from the viewpoint that the amount of movement upward or downward of the lower hard plate 14 can be continuously variably controlled, but the shape of the first elevating mechanism 28 is It is not limited to this example.
Examples of a method for continuously moving the lower hard plate 14 upward or downward include a method using a ball screw in addition to the sheet pile type.

[Second embodiment of manufacturing apparatus for photosensitive resin relief printing plate]
An apparatus for producing a photosensitive resin relief plate in the second embodiment will be described.
As shown in FIG. 13, the photosensitive resin relief plate manufacturing apparatus in this embodiment exposes a liquid photosensitive resin sandwiched between a lower hard plate 14 and an upper hard plate 13 facing the lower hard plate 15. It is the manufacturing apparatus of the photosensitive resin letterpress which performs.
Temperature for directly or indirectly measuring the temperature of the lower hard plate 14 that transmits the exposure light beam, the upper hard plate 13 disposed opposite to the lower hard plate 14, and the upper hard plate 13 and / or the lower hard plate 14. The application mechanism 51 having the measurement mechanism 50, an electronic signal conversion mechanism (not shown) that converts the measured temperature into an electronic signal, and the measured temperature are compared with a preset temperature, and the difference amount is calculated. A control signal output mechanism (not shown) that outputs as a modified electronic signal, a spacer 41 that functions as a coating mechanism travel rail and an upper hard plate cradle, and a second lifting mechanism (not shown) that moves the spacer 41 up and down. )have.

FIG. 16: shows the schematic exploded view of the principal part of the manufacturing apparatus of the photosensitive resin relief printing plate in 2nd Embodiment.
As shown in FIG. 16, the photosensitive resin relief printing apparatus 100 includes two upper hard plates 13 and a lower hard plate 14 facing each other, and a negative film 23 is disposed above the lower hard plate 14 disposed on the lower side. The first film layer (cover film) 24, the liquid photosensitive resin 25, the second film layer (base film) 26, and the mask negative film 27 are laminated in this order, and compressed by sandwiching them with the upper hard plate 13 disposed on the upper side. And has a function of performing exposure.
In addition, on the surface of the 1st film layer 24, the dam material which has the height corresponding to the thickness of the liquid photosensitive resin 25 which has the function to prevent the outflow of the liquid photosensitive resin 25 (refer FIG. 10). ) Is fixed in a frame shape.
Both the upper hard plate 13 and the lower hard plate 14 are preferably plate members that transmit actinic rays.

  Although not illustrated in FIG. 16, the manufacturing apparatus 100 according to the present embodiment includes a cover film storage unit 15, a base film set unit 16, a liquid photosensitive resin coating bucket 17, and a coating mechanism (carriage) illustrated in FIG. 51 is provided.

  The coating mechanism (carriage: reference numeral 51 in FIG. 10) moves on the surface of the first film layer 24 along the spacer 41 that functions as a coating mechanism traveling rail and an upper hard plate cradle in FIG. The coating mechanism (carriage) is configured such that the distance from the first film layer 24 can be freely adjusted by a second lifting mechanism 40 that lifts and lowers the spacer 41.

The application mechanism (carriage: reference numeral 51 in FIG. 10) moves the temperature of the upper hard plate 13 and / or the lower hard plate 14 directly or indirectly as it moves along the spacer 41 on the first film layer. A temperature measurement mechanism (reference numeral 50 in FIG. 10) for measurement is provided.
The manufacturing apparatus in this embodiment includes an electronic signal conversion mechanism (not shown) that converts the temperature measured by the temperature measurement mechanism into an electronic signal, the measured temperature, and a preset temperature (temperature range). And a control signal output mechanism (not shown) for outputting the difference amount as a corrected electronic signal.

FIG. 17 is a schematic perspective view showing the relationship between the upper hard plate 13 and the spacer 41 included in the manufacturing apparatus 100 according to the second embodiment.
In the manufacturing apparatus 100 according to the present embodiment, the upper hard plate 13 is movable up and down by the second elevating mechanism 40, and as shown in FIG. The distance between the plate 14 and the upper hard plate 13 can be adjusted.
Specifically, the amount of movement of the second lifting mechanism 40 is controlled according to the modified electronic signal.
Although it does not specifically limit about the shape of the 2nd raising / lowering mechanism 40, suppose that the quantity which raises / lowers the upper hard board 13 can be controlled continuously.

  Hereinafter, the present invention will be described in detail with reference to specific examples and comparative examples, but the present invention is not limited to the following examples.

[Example] (with plate thickness correction)
(apparatus)
A coating mechanism (carriage) having the temperature measuring mechanism shown in FIG. 5 and FIG. 6 is provided, and an electronic signal converting mechanism for converting the measured temperature into an electronic signal is provided. A photosensitive resin relief printing plate manufacturing apparatus having a function of outputting a corrected electronic signal by a predetermined control signal storage output mechanism was used.
(operation)
Finally, a “7 mm plate” in which the thickness of the laminate (photosensitive resin relief plate) of the target base film and the photosensitive resin layer was set to 7.2 mm was continuously made.
As shown in FIG. 5, the coating mechanism (carriage) having a temperature measuring mechanism was moved on the lower hard plate, and the temperature was measured through a cover film (CF-87, manufactured by Asahi Kasei Chemicals Corporation).
The measured temperature is converted into a predetermined electronic signal by an electronic signal conversion mechanism, and this measured temperature and a preset temperature (19.9 ° C. or lower, 20.0 to 24.5 ° C., 25 to 29.9 ° C. , 30 to 34.9 ° C., 35 to 39.9 ° C., 40 ° C. or higher), and a corrected electronic signal corresponding to these temperature ranges is output by the control signal storage output mechanism, and the lower hard plate is set to 1 It was lowered in units of / 100 mm.
As shown in FIG. 6, the coating mechanism (carriage) was moved in the direction of arrow B in the figure, and a liquid photosensitive resin (manufactured by Asahi Kasei Chemicals Corporation, TENAFLEX F-600B) was coated on the cover film.
By lowering the lower hard plate according to the modified electronic signal, the distance between the lower hard plate 14 and the coating bucket 17 is slightly increased, and the coating thickness of the liquid photosensitive resin 25 is adjusted to be slightly increased, as shown in FIG. A base film (manufactured by Asahi Kasei Chemicals Corporation, BF-6A6 film thickness of 295 μm) was laminated on the liquid photosensitive resin and pressure-bonded by a laminating roller.
Subsequently, molding and exposure were performed as shown in FIG.
On the liquid photosensitive resin layer, a mask negative film (a thermal negative film manufactured by OYO, film thickness 130 μm) and an upper hard plate were arranged.
Here, by lowering the lower hard plate at the above time point, the interval between the upper and lower hard plates is slightly increased from the initially set interval, that is, the thickness for molding the plate is slightly increased in units of 1/100 mm. It has been adjusted to.
After that, masking exposure was performed by irradiating ultraviolet rays having an average illuminance of 4 to 5 mW / cm ² through the upper hard plate with an upper light source (a light source in which a plurality of ultraviolet fluorescent lamps having a central wavelength of 365 nm was arranged).
Next, relief exposure is performed by irradiating ultraviolet rays having an average illuminance of 4 to 5 mW / cm ² with a lower light source (a light source in which a plurality of ultraviolet fluorescent lamp lamps having a central wavelength of 365 nm is arranged) through a negative film on the lower hard plate. The molding and exposure process was completed.
Thereafter, the upper hard plate and the mask negative film were removed to obtain a laminate comprising a cover film, a photosensitive resin, and a base film.
In the subsequent step, the cover film was peeled off, and then the resin and uncured resin adhering to the cover film were removed, and then a photosensitive resin relief plate in which the base film and the photosensitive resin were laminated was obtained.
(result)
As shown in FIG. 18, the temperature of the lower hard plate increased from 24.1 ° C. to 35.6 ° C. during the four continuous plate-making processes, but the fluctuation range of the average plate thickness of the photosensitive resin relief plate was 1 / It was suppressed within 100 mm, and it was confirmed that the plate could be continuously made to a uniform plate thickness.

[Comparative example] (No plate thickness correction)
(apparatus)
The manufacturing apparatus for the photosensitive resin relief plate shown in FIGS. 5 and 6 was the same as that used in the above examples.
(operation)
Finally, a “7 mm plate” in which the thickness of the laminate (photosensitive resin relief plate) of the target base film and the photosensitive resin layer was set to 7.2 mm was continuously made.
Without measuring the temperature of the lower hard plate, as shown in FIG. 6, the coating mechanism (carriage) is moved in the direction of arrow B in the figure, and a liquid photosensitive resin (manufactured by Asahi Kasei Chemicals Corporation, F -600B) was applied.
As shown in FIG. 6, a base film (manufactured by Asahi Kasei Chemicals Co., Ltd., BF-6A6) was laminated on the liquid photosensitive resin and pressure-bonded with a laminating roller.
Subsequently, molding and exposure were performed as shown in FIG.
On the liquid photosensitive resin layer, a mask negative film (thermal negative film manufactured by OYO, film thickness 130 μm) and an upper hard plate were arranged.
Masking is performed by irradiating UV light with an average illuminance of 4 to 5 mW / cm ² through the upper hard plate with the upper light source (a light source in which a plurality of ultraviolet fluorescent lamps having a central wavelength of 365 nm is arranged) without correcting the distance between the upper and lower hard plates. Exposure was performed.
Next, relief exposure is performed by irradiating ultraviolet rays having an average illuminance of 4 to 5 mW / cm ² with a lower light source (a light source having a plurality of ultraviolet fluorescent lamps having a central wavelength of 365 nm) through a negative film on the lower hard plate. The molding and exposure process was completed.
Thereafter, the upper hard plate and the mask negative film were removed to obtain a laminate comprising a cover film, a photosensitive resin, and a base film.
In the subsequent step, the cover film was peeled off, and then the resin and uncured resin adhering to the cover film were removed, and then a photosensitive resin relief plate in which the base film and the photosensitive resin were laminated was obtained.
(result)
As shown in FIG. 19, the temperature of the lower hard plate rises from 20.1 ° C. to 33.6 ° C. during the continuous plate making process of 7 sheets, and the average plate thickness is finally reduced by 6/100 mm. It was confirmed that the plate could not be continuously made to have a uniform plate thickness.

  INDUSTRIAL APPLICABILITY The present invention has industrial applicability in the field of continuous plate making of photosensitive resin relief plates, particularly in technical fields that require precise printing accuracy.

The perspective view of the exposure apparatus which manufactures photosensitive resin letterpress using the liquid photosensitive resin in a prior art is shown. The schematic sectional drawing of one process of manufacturing a liquid photosensitive resin letterpress using the exposure apparatus in a prior art is shown. The schematic sectional drawing of the 1 process which manufactures the photosensitive resin relief printing plate using the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic sectional drawing of the 1 process which manufactures the photosensitive resin relief printing plate using the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic sectional drawing of the process of measuring the temperature of a hard plate with a temperature measurement mechanism using the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic sectional drawing of the process of apply | coating liquid photosensitive resin using the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic sectional drawing of the process of shaping | molding and exposure by an upper and lower hard plate using the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic sectional drawing of the 1 process which manufactures the photosensitive resin letterpress using the manufacturing apparatus of the photosensitive resin letterpress in 2nd Embodiment is shown. The schematic sectional drawing of the 1 process which manufactures the photosensitive resin letterpress using the manufacturing apparatus of the photosensitive resin letterpress in 2nd Embodiment is shown. The schematic sectional drawing of the process of measuring the temperature of a hard plate with a temperature measurement mechanism using the manufacturing apparatus of the photosensitive resin relief printing plate in 2nd Embodiment is shown. The schematic sectional drawing of the process of apply | coating liquid photosensitive resin using the manufacturing apparatus of the photosensitive resin relief printing plate in 2nd Embodiment is shown. The schematic sectional drawing of the process of shaping | molding and exposure with an up-and-down hard board using the manufacturing apparatus of the photosensitive resin relief printing plate in 2nd Embodiment is shown. The schematic perspective view of the manufacturing apparatus of the photosensitive resin relief printing plate is shown. The schematic exploded view of the principal part of the manufacturing apparatus of the photosensitive resin relief printing plate in 1st Embodiment is shown. The schematic perspective view showing the relationship between a lower hard board, a dam member, and a 1st raising / lowering mechanism is shown. The schematic exploded view of the principal part of the manufacturing apparatus of the photosensitive resin relief printing plate in 2nd Embodiment is shown. The schematic perspective view showing the relationship between an upper hard board, a spacer, and a 2nd raising / lowering mechanism is shown. The state of plate thickness variation at the time of continuous plate making in the examples is shown. The state of plate thickness variation at the time of continuous plate making in a comparative example is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,100: Manufacturing apparatus of photosensitive resin letterpress 11: Upper light source 12: Lower light source 13: Upper hard board 14: Lower hard board 15: Cover film storage part 16: Base film setting part 17: Liquid photosensitive resin coating bucket 18 : Carriage 23: Negative film 24: First film layer (cover film)
25: Liquid photosensitive resin 26: Second film layer (base film)
27: Mask negative film 28: First lifting mechanism 29: Weir member 30: Dam material 40: Second lifting mechanism 41: Spacer 35, 36: Groove 50: Temperature measuring mechanism 51: Coating mechanism (carriage)
53: Laminate roll 55: Monitor

Claims (9)

A method for producing a photosensitive resin relief printing, wherein a laminate including a first film layer, a photosensitive resin layer, and a second film layer is exposed while being sandwiched between a lower hard plate and an upper hard plate,
(A) a step of directly or indirectly measuring the temperature of the upper hard plate and / or the lower hard plate, or the temperature of the lower hard plate via the first film layer laminated on the lower hard plate;
(B) applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate;
(C) adjusting the coating thickness of the liquid photosensitive resin;
(D) adjusting the distance between the lower hard plate and the upper hard plate;
The manufacturing method of the photosensitive resin letterpress which has.   The adjustment of the coating thickness of the liquid photosensitive resin in the step (c) is performed according to a difference between the temperature measured in the step (a) and a preset temperature. Manufacturing method of photosensitive resin relief printing plate.   The distance between the lower hard plate and the upper hard plate in the step (d) is adjusted according to a difference between the temperature measured in the step (a) and a preset temperature. Or the manufacturing method of the photosensitive resin relief printing of 2. An apparatus for manufacturing a photosensitive resin relief printing plate that performs exposure in a state where a laminate including a first film layer, a photosensitive resin layer, and a second film layer is sandwiched between a lower hard plate and an upper hard plate,
A lower hard plate that transmits exposure light;
An upper hard plate disposed opposite to the lower hard plate;
A temperature measuring mechanism for directly or indirectly measuring the temperature of the upper hard plate and / or the lower hard plate;
An electronic signal conversion mechanism for converting the measured temperature into an electronic signal;
A control signal storage output mechanism for storing an electronic signal of the measured temperature and an arbitrary corrected electronic signal corresponding to a preset temperature range, and outputting an arbitrary corrected electronic signal corresponding to the measured temperature;
An application mechanism for applying a liquid photosensitive resin on the first film layer laminated on the lower hard plate;
A first elevating mechanism for elevating the lower hard plate, or a spacer having a function as a coating mechanism traveling rail and an upper hard plate cradle, and a second elevating mechanism for elevating the spacer,
An apparatus for producing a photosensitive resin relief printing plate.   The photosensitive resin relief printing plate manufacturing apparatus according to claim 4, wherein the first elevating mechanism and the second elevating mechanism are configured to adjust a lifting amount in units of 1/100 mm.   The said temperature measurement mechanism is a manufacturing apparatus of the photosensitive resin relief printing plate of Claim 4 or 5 which measures temperature in the position inside 20 mm or more from the edge part of the said upper hard board and / or a lower hard board.   The manufacturing apparatus of the photosensitive resin relief printing plate as described in any one of Claims 4 thru | or 6 which raises / lowers the said lower hard board with the said 1st raising / lowering mechanism according to the said correction | amendment electronic signal.   The manufacturing apparatus of the photosensitive resin relief printing plate as described in any one of Claims 4 thru | or 6 which raises / lowers the said spacer by the said 2nd raising / lowering mechanism according to the said correction | amendment electronic signal.   The manufacturing apparatus of the photosensitive resin relief printing plate as described in any one of Claim 4 thru | or 6 or 8 which raises / lowers the said upper hard board with the said 2nd raising / lowering mechanism according to the said correction | amendment electronic signal.