JPH0560251B2 - - Google Patents
Info
- Publication number
- JPH0560251B2 JPH0560251B2 JP60090899A JP9089985A JPH0560251B2 JP H0560251 B2 JPH0560251 B2 JP H0560251B2 JP 60090899 A JP60090899 A JP 60090899A JP 9089985 A JP9089985 A JP 9089985A JP H0560251 B2 JPH0560251 B2 JP H0560251B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mask
- exposed
- holding means
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Description
【発明の詳細な説明】
［発明の分野］
本発明は、被露光体に原板上のパターン像、例
えば半導体回路を焼付ける露光装置に関し、特に
大画面を分割焼きする分割走査（ステツプアンド
スキヤン）形として好適な投影露光装置に関す
る。[Detailed Description of the Invention] [Field of the Invention] The present invention relates to an exposure apparatus that prints a pattern image on an original plate, such as a semiconductor circuit, onto an exposed object, and in particular a step-and-scan method that prints a large screen in sections. The present invention relates to a projection exposure apparatus having a suitable shape.
［従来の技術の説明］
ミラープロジエクシヨン方式の半導体焼付装置
においては、マスクと基板（またはウエハ）をキ
ヤリツジ上に乗せこれを露光面上にスキヤン移動
させることにより画面全体を露光している。[Description of the Prior Art] In a mirror projection type semiconductor printing apparatus, a mask and a substrate (or wafer) are placed on a carriage, and the entire screen is exposed by scanning the same onto an exposure surface.
しかし、最近の傾向として、チツプコストの低
減を目的としたウエハの大口径化や液晶TV用等
の大型の液晶表示板の製造のため、画面が大型化
してくると、露光範囲を大きくし、かつスキヤン
長を伸ばさなければならないことにより装置が大
型化してくるという問題があつた。 However, as the screens have become larger due to the recent trend of increasing the diameter of wafers to reduce chip costs and manufacturing large LCD panels for LCD TVs, the exposure range has become larger and There was a problem in that the device became larger due to the need to increase the scan length.
この対策として、画面を分割してスキヤン焼き
を複数回に分けて行なうステツプアンドスキヤン
焼方式が考えられている。そしてこのステツプア
ンドスキヤン焼きをより高速かつ高精度に行なう
ために、キヤリツジに基板ステージ（Ｘ，Ｙ，θ
ステージ）を搭載することが考えられている。 As a countermeasure to this problem, a step-and-scan printing method has been considered in which the screen is divided and scan printing is performed in multiple steps. In order to perform this step-and-scan baking at higher speed and with higher precision, a substrate stage (X, Y, θ) is installed on the carriage.
It is being considered that it will be equipped with a stage.
第３図は、ステツプアンドスキヤン焼方式によ
るパターンの焼付手段を示す。同図において、１
はフオトマスク、３は基板またはウエハ、４は基
板ステージ、２１はパターンの有効焼付範囲、２
２はパターン焼付のための照明光の照明範囲であ
る。２３はパターン焼付時の基板３のスキヤン方
向を示す。 FIG. 3 shows a pattern printing means using a step-and-scan printing method. In the same figure, 1
3 is a photomask, 3 is a substrate or wafer, 4 is a substrate stage, 21 is an effective printing range of a pattern, 2
2 is an illumination range of illumination light for pattern printing. Reference numeral 23 indicates the scanning direction of the substrate 3 during pattern printing.
パターンの焼付は以下のように行なう。まず、
マスク１と基板３の位置合わせを行なうため、基
板ステージ４を動かして、基板３の位置を第３図
１のように設定する。そして、基板ステージ４を
搭載したキヤリツジをスキヤン方向２３に動かす
と、例えば基板３の左上の四半分２１が焼付けら
れる。 The pattern is printed as follows. first,
In order to align the mask 1 and the substrate 3, the substrate stage 4 is moved to set the position of the substrate 3 as shown in FIG. 31. When the carriage carrying the substrate stage 4 is moved in the scanning direction 23, for example, the upper left quarter 21 of the substrate 3 is printed.
次にマスクを変え、さらに基板ステージ４を動
かすことにより、第２図２に示すように位置設定
し、前回と反対方向のキヤリツジをスキヤンさせ
る。これにより、例えば左下の四半分２１′が焼
付けられる。 Next, by changing the mask and further moving the substrate stage 4, the position is set as shown in FIG. 2, and the carriage is scanned in the opposite direction from the previous time. Thus, for example, the lower left quadrant 21' is burned.
以下、同様にして、右上の四半分２１″（第３
図３）、右下の四半分２１ Hereafter, in the same way, the upper right quadrant 21'' (3rd
Figure 3), lower right quadrant 21
Claims (1)
し、マスクと該基板保持手段とを移送するための
移送部材を駆動して該マスクと該基板保持手段と
を一体的に移送せしめることにより照明光に対し
て該マスクと該被露光基板とを走査し、該マスク
のパターンを該被露光基板上に転写する露光方法
において、前記基板保持手段を移動させて前記被
露光基板を前記マスクに対し位置合わせする際、
前記基板保持手段の移動により生じる前記移送部
材の姿勢変化による位置合わせ誤差を補正するこ
とを特徴とする露光方法。 ２ マスクと被露光基板の位置合わせを行い、照
明光に対して該マスクと該被露光基板とを走査す
ることにより該マスクのパターンを該被露光基板
上に転写するための露光装置において、前記マス
クを保持するマスク保持手段と、前記被露光基板
を保持し、移動可能な基板保持手段と、前記マス
ク保持手段と前記基板保持手段とを一体的に移送
せしめる移送部材と、前記基板保持手段の移動に
より生じる前記移送部材の姿勢変化による位置合
わせ誤差を補正する補正手段を有することを特徴
とする露光装置。 ３ 前記補正手段が、前記基板保持部材の移動に
より生じる前記移送部材の姿勢変化による前記被
露光基板上への前記パターンの結像位置のずれ量
を予め記憶する記憶手段と、前記記憶手段に記憶
した前記ずれ量を用いて前記基板保持手段のステ
ツプ送り量を補正し、前記基板保持手段をステツ
プ移動せしめる駆動手段とを有することを特徴と
する特許請求の範囲第２項記載の露光装置。[Claims] 1. A substrate to be exposed is held by a movable substrate holding means, and a transfer member for transferring the mask and the substrate holding means is driven to integrally integrate the mask and the substrate holding means. In the exposure method, the mask and the substrate to be exposed are scanned with respect to illumination light by moving the substrate, and the pattern of the mask is transferred onto the substrate to be exposed. When aligning the substrate with the mask,
An exposure method comprising correcting a positioning error caused by a change in the posture of the transfer member caused by movement of the substrate holding means. 2. In an exposure apparatus for aligning a mask and a substrate to be exposed and transferring a pattern of the mask onto the substrate to be exposed by scanning the mask and the substrate to be exposed with respect to illumination light, A mask holding means for holding a mask; a movable substrate holding means for holding the substrate to be exposed; a transfer member for integrally transferring the mask holding means and the substrate holding means; An exposure apparatus comprising a correction means for correcting a positioning error due to a change in the posture of the transfer member caused by movement. 3. The correction means includes a storage means for storing in advance an amount of deviation in the imaging position of the pattern on the exposed substrate due to a change in the posture of the transfer member caused by movement of the substrate holding member; 3. The exposure apparatus according to claim 2, further comprising a drive means for correcting the step feed amount of the substrate holding means using the amount of deviation, and moving the substrate holding means in steps.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60090899A JPS61251031A (en) | 1985-04-30 | 1985-04-30 | Projection exposing apparatus |
| US06/856,222 US4748477A (en) | 1985-04-30 | 1986-04-28 | Exposure apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60090899A JPS61251031A (en) | 1985-04-30 | 1985-04-30 | Projection exposing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61251031A JPS61251031A (en) | 1986-11-08 |
| JPH0560251B2 true JPH0560251B2 (en) | 1993-09-01 |
Family
ID=14011246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60090899A Granted JPS61251031A (en) | 1985-04-30 | 1985-04-30 | Projection exposing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61251031A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752712B2 (en) * | 1989-12-27 | 1995-06-05 | 株式会社東芝 | Exposure equipment |
-
1985
- 1985-04-30 JP JP60090899A patent/JPS61251031A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61251031A (en) | 1986-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |