JPS6130741B2 - - Google Patents

Info

Publication number
JPS6130741B2
JPS6130741B2 JP53127980A JP12798078A JPS6130741B2 JP S6130741 B2 JPS6130741 B2 JP S6130741B2 JP 53127980 A JP53127980 A JP 53127980A JP 12798078 A JP12798078 A JP 12798078A JP S6130741 B2 JPS6130741 B2 JP S6130741B2
Authority
JP
Japan
Prior art keywords
element piece
semiconductor element
semiconductor
semiconductor device
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53127980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5555550A (en
Inventor
Hidenori Nishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP12798078A priority Critical patent/JPS5555550A/ja
Publication of JPS5555550A publication Critical patent/JPS5555550A/ja
Publication of JPS6130741B2 publication Critical patent/JPS6130741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12798078A 1978-10-18 1978-10-18 Semiconductor device Granted JPS5555550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12798078A JPS5555550A (en) 1978-10-18 1978-10-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12798078A JPS5555550A (en) 1978-10-18 1978-10-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5555550A JPS5555550A (en) 1980-04-23
JPS6130741B2 true JPS6130741B2 (show.php) 1986-07-15

Family

ID=14973449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12798078A Granted JPS5555550A (en) 1978-10-18 1978-10-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5555550A (show.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064325B2 (ja) * 1984-06-11 1994-01-19 キヤノン株式会社 液体噴射ヘッド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531494B2 (show.php) * 1971-09-13 1980-08-19
JPS5414576Y2 (show.php) * 1973-04-26 1979-06-15
JPS5345973A (en) * 1976-10-06 1978-04-25 Sharp Corp Resin-sealing-type semiconductor device
JPS5360762U (show.php) * 1976-10-25 1978-05-23

Also Published As

Publication number Publication date
JPS5555550A (en) 1980-04-23

Similar Documents

Publication Publication Date Title
US5939784A (en) Shielded surface acoustical wave package
US5867368A (en) Mounting for a semiconductor integrated circuit device
JP2569939B2 (ja) 樹脂封止型半導体装置
JPS61198769A (ja) 混成集積回路
JPS6130741B2 (show.php)
JPH02278752A (ja) 半導体装置
JPH04114455A (ja) 半導体装置及びその実装構造
JPH04267549A (ja) 樹脂封止型半導体装置
JPH0635924U (ja) 赤外線検出器
JP2726555B2 (ja) 樹脂封止型半導体装置
JPS6042619B2 (ja) 半導体装置
JPS6236299Y2 (show.php)
JP3016663B2 (ja) 半導体装置
JP2603384Y2 (ja) 焦電型赤外線検出器
JPH08330704A (ja) 電子装置
JP2994167B2 (ja) 半導体装置
JPS63263810A (ja) 表面波装置
JPS6011651Y2 (ja) 半導体装置
JPS5723254A (en) Semiconductor device
JPS631755B2 (show.php)
JPH0831968A (ja) 半導体装置及びその製造方法
JPS62286272A (ja) 半導体撮像装置
JPH0458713B2 (show.php)
JPS631756B2 (show.php)
JPH11163584A (ja) 実装基板