JPS6130665A - スパツタ装置 - Google Patents

スパツタ装置

Info

Publication number
JPS6130665A
JPS6130665A JP15106584A JP15106584A JPS6130665A JP S6130665 A JPS6130665 A JP S6130665A JP 15106584 A JP15106584 A JP 15106584A JP 15106584 A JP15106584 A JP 15106584A JP S6130665 A JPS6130665 A JP S6130665A
Authority
JP
Japan
Prior art keywords
electric arc
target
arc
sputtering
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15106584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0114312B2 (enrdf_load_stackoverflow
Inventor
Masao Tanaka
田中　誠夫
Kiyoshi Nashimoto
梨本　清
Kazuhiro Mimura
和弘 三村
Tetsuo Morita
森田　哲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd, Anelva Corp filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP15106584A priority Critical patent/JPS6130665A/ja
Publication of JPS6130665A publication Critical patent/JPS6130665A/ja
Publication of JPH0114312B2 publication Critical patent/JPH0114312B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP15106584A 1984-07-20 1984-07-20 スパツタ装置 Granted JPS6130665A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15106584A JPS6130665A (ja) 1984-07-20 1984-07-20 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15106584A JPS6130665A (ja) 1984-07-20 1984-07-20 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS6130665A true JPS6130665A (ja) 1986-02-12
JPH0114312B2 JPH0114312B2 (enrdf_load_stackoverflow) 1989-03-10

Family

ID=15510532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15106584A Granted JPS6130665A (ja) 1984-07-20 1984-07-20 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS6130665A (enrdf_load_stackoverflow)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314863A (ja) * 1986-07-04 1988-01-22 Shinku Kikai Kogyo Kk 真空装置
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US5576939A (en) * 1995-05-05 1996-11-19 Drummond; Geoffrey N. Enhanced thin film DC plasma power supply
US5645698A (en) * 1992-09-30 1997-07-08 Advanced Energy Industries, Inc. Topographically precise thin film coating system
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5747935A (en) * 1992-04-16 1998-05-05 Advanced Energy Industries, Inc. Method and apparatus for stabilizing switch-mode powered RF plasma processing
US5815388A (en) * 1996-06-21 1998-09-29 Sierra Applied Sciences, Inc. Polarity reversing circuit having energy compensation
US5882492A (en) * 1996-06-21 1999-03-16 Sierra Applied Sciences, Inc. A.C. plasma processing system
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US5910886A (en) * 1997-11-07 1999-06-08 Sierra Applied Sciences, Inc. Phase-shift power supply
US5990668A (en) * 1997-11-07 1999-11-23 Sierra Applied Sciences, Inc. A.C. power supply having combined regulator and pulsing circuits
US5993613A (en) * 1997-11-07 1999-11-30 Sierra Applied Sciences, Inc. Method and apparatus for periodic polarity reversal during an active state
US6011704A (en) * 1997-11-07 2000-01-04 Sierra Applied Sciences, Inc. Auto-ranging power supply
US6217717B1 (en) * 1992-12-30 2001-04-17 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US6368477B1 (en) 1995-04-07 2002-04-09 Advanced Energy Industries, Inc. Adjustable energy quantum thin film plasma processing system
WO2003103348A1 (ja) * 2002-05-31 2003-12-11 芝浦メカトロニクス株式会社 放電用電源、スパッタリング用電源及びスパッタリング装置
JP2004134376A (ja) * 2002-07-11 2004-04-30 Fuji Photo Film Bv 大気圧条件下でグロー放電プラズマを生成して維持するための改良された装置
WO2010008636A1 (en) * 2008-07-17 2010-01-21 Mks Instruments, Inc. Sputtering system and method including an arc detection system
US20100025230A1 (en) * 2006-04-11 2010-02-04 Hauzer Techno Coating Bv Vacuum Treatment Apparatus, A Bias Power Supply And A Method Of Operating A Vacuum Treatment Apparatus
US20110266143A1 (en) * 2010-04-28 2011-11-03 Hon Hai Precision Industry Co., Ltd. Sputtering system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5773346B2 (ja) * 2009-03-12 2015-09-02 株式会社アルバック セルフイオンスパッタリング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145170A (en) * 1979-04-28 1980-11-12 Tokuda Seisakusho Ltd Arc-breaking method of direct current electric discharge unit and its circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145170A (en) * 1979-04-28 1980-11-12 Tokuda Seisakusho Ltd Arc-breaking method of direct current electric discharge unit and its circuit

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314863A (ja) * 1986-07-04 1988-01-22 Shinku Kikai Kogyo Kk 真空装置
US5747935A (en) * 1992-04-16 1998-05-05 Advanced Energy Industries, Inc. Method and apparatus for stabilizing switch-mode powered RF plasma processing
US6046546A (en) * 1992-04-16 2000-04-04 Advanced Energy Industries, Inc. Stabilizer for switch-mode powered RF plasma
US6120656A (en) * 1992-09-30 2000-09-19 Advanced Energy Industries, Inc. Topographically precise thin film coating system
US5645698A (en) * 1992-09-30 1997-07-08 Advanced Energy Industries, Inc. Topographically precise thin film coating system
US6521099B1 (en) 1992-12-30 2003-02-18 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US6024844A (en) * 1992-12-30 2000-02-15 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US6217717B1 (en) * 1992-12-30 2001-04-17 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US6001224A (en) * 1993-04-02 1999-12-14 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US6368477B1 (en) 1995-04-07 2002-04-09 Advanced Energy Industries, Inc. Adjustable energy quantum thin film plasma processing system
US5576939A (en) * 1995-05-05 1996-11-19 Drummond; Geoffrey N. Enhanced thin film DC plasma power supply
US5882492A (en) * 1996-06-21 1999-03-16 Sierra Applied Sciences, Inc. A.C. plasma processing system
US5815388A (en) * 1996-06-21 1998-09-29 Sierra Applied Sciences, Inc. Polarity reversing circuit having energy compensation
US6011704A (en) * 1997-11-07 2000-01-04 Sierra Applied Sciences, Inc. Auto-ranging power supply
US5993613A (en) * 1997-11-07 1999-11-30 Sierra Applied Sciences, Inc. Method and apparatus for periodic polarity reversal during an active state
US5990668A (en) * 1997-11-07 1999-11-23 Sierra Applied Sciences, Inc. A.C. power supply having combined regulator and pulsing circuits
US5910886A (en) * 1997-11-07 1999-06-08 Sierra Applied Sciences, Inc. Phase-shift power supply
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
WO2003103348A1 (ja) * 2002-05-31 2003-12-11 芝浦メカトロニクス株式会社 放電用電源、スパッタリング用電源及びスパッタリング装置
US7695599B2 (en) 2002-05-31 2010-04-13 Shibaura Mechatronics Corporation Discharging power source, sputtering power source, and sputtering device
JP2004134376A (ja) * 2002-07-11 2004-04-30 Fuji Photo Film Bv 大気圧条件下でグロー放電プラズマを生成して維持するための改良された装置
US20100025230A1 (en) * 2006-04-11 2010-02-04 Hauzer Techno Coating Bv Vacuum Treatment Apparatus, A Bias Power Supply And A Method Of Operating A Vacuum Treatment Apparatus
WO2010008636A1 (en) * 2008-07-17 2010-01-21 Mks Instruments, Inc. Sputtering system and method including an arc detection system
US9613784B2 (en) 2008-07-17 2017-04-04 Mks Instruments, Inc. Sputtering system and method including an arc detection
US10607821B2 (en) 2008-07-17 2020-03-31 MKS Insturments, Inc. Sputtering system and method including an arc detection
US20110266143A1 (en) * 2010-04-28 2011-11-03 Hon Hai Precision Industry Co., Ltd. Sputtering system

Also Published As

Publication number Publication date
JPH0114312B2 (enrdf_load_stackoverflow) 1989-03-10

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Legal Events

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