JPS6130279Y2 - - Google Patents
Info
- Publication number
- JPS6130279Y2 JPS6130279Y2 JP17258781U JP17258781U JPS6130279Y2 JP S6130279 Y2 JPS6130279 Y2 JP S6130279Y2 JP 17258781 U JP17258781 U JP 17258781U JP 17258781 U JP17258781 U JP 17258781U JP S6130279 Y2 JPS6130279 Y2 JP S6130279Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin material
- molding
- shape
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 121
- 229920005989 resin Polymers 0.000 claims description 121
- 239000000463 material Substances 0.000 claims description 61
- 238000000465 moulding Methods 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17258781U JPS5877046U (ja) | 1981-11-18 | 1981-11-18 | 半導体樹脂封入成形用の樹脂材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17258781U JPS5877046U (ja) | 1981-11-18 | 1981-11-18 | 半導体樹脂封入成形用の樹脂材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5877046U JPS5877046U (ja) | 1983-05-24 |
| JPS6130279Y2 true JPS6130279Y2 (en, 2012) | 1986-09-05 |
Family
ID=29964482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17258781U Granted JPS5877046U (ja) | 1981-11-18 | 1981-11-18 | 半導体樹脂封入成形用の樹脂材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877046U (en, 2012) |
-
1981
- 1981-11-18 JP JP17258781U patent/JPS5877046U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5877046U (ja) | 1983-05-24 |
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