JPS6128572A - 半導体ウエハー用粘着シートの使用法 - Google Patents
半導体ウエハー用粘着シートの使用法Info
- Publication number
- JPS6128572A JPS6128572A JP59148566A JP14856684A JPS6128572A JP S6128572 A JPS6128572 A JP S6128572A JP 59148566 A JP59148566 A JP 59148566A JP 14856684 A JP14856684 A JP 14856684A JP S6128572 A JPS6128572 A JP S6128572A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pressure
- radiation
- sensitive adhesive
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 claims abstract description 89
- 230000005855 radiation Effects 0.000 claims abstract description 22
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 239000011247 coating layer Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 10
- 239000003522 acrylic cement Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 34
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 239000010410 layer Substances 0.000 abstract description 9
- 239000012790 adhesive layer Substances 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 3
- -1 polypropylene Polymers 0.000 description 11
- 239000000203 mixture Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 241000238366 Cephalopoda Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 231100000987 absorbed dose Toxicity 0.000 description 1
- 239000002260 anti-inflammatory agent Substances 0.000 description 1
- 229940121363 anti-inflammatory agent Drugs 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59148566A JPS6128572A (ja) | 1984-07-19 | 1984-07-19 | 半導体ウエハー用粘着シートの使用法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59148566A JPS6128572A (ja) | 1984-07-19 | 1984-07-19 | 半導体ウエハー用粘着シートの使用法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6128572A true JPS6128572A (ja) | 1986-02-08 |
| JPH0242393B2 JPH0242393B2 (enrdf_load_stackoverflow) | 1990-09-21 |
Family
ID=15455609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59148566A Granted JPS6128572A (ja) | 1984-07-19 | 1984-07-19 | 半導体ウエハー用粘着シートの使用法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6128572A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6254778A (ja) * | 1985-09-04 | 1987-03-10 | Bando Chem Ind Ltd | 感圧接着性シート |
| JPS6317981A (ja) * | 1986-07-09 | 1988-01-25 | F S K Kk | 粘着シ−ト |
| JPH01110584A (ja) * | 1987-10-22 | 1989-04-27 | Nichiban Co Ltd | 硬化型粘着テープまたはシート |
| JPH01252684A (ja) * | 1988-04-01 | 1989-10-09 | Furukawa Electric Co Ltd:The | 放射線硬化性粘着テープ |
| US4999242A (en) * | 1987-07-08 | 1991-03-12 | Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| JPH03278444A (ja) * | 1990-09-07 | 1991-12-10 | Bando Chem Ind Ltd | 半導体ウエハーのダイシング方法 |
| US5149586A (en) * | 1987-07-08 | 1992-09-22 | Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| US5187007A (en) * | 1985-12-27 | 1993-02-16 | Lintec Corporation | Adhesive sheets |
| US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| JPH06184521A (ja) * | 1992-12-21 | 1994-07-05 | Nichiban Co Ltd | 表面保護材及びその形成方法 |
| US5356949A (en) * | 1988-07-21 | 1994-10-18 | Lintec Corporation | Adhesive composition comprising (meth)acrylate polymer and epoxy resin |
| EP0715341A1 (en) | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| KR100351705B1 (ko) * | 2000-06-27 | 2002-09-11 | 한솔제지주식회사 | 다이싱테이프용 감광성 점착 조성물 |
| WO2009028455A1 (ja) * | 2007-08-27 | 2009-03-05 | Lintec Corporation | 再剥離型粘着シートおよび不完全硬化塗膜の保護方法 |
| US7906582B2 (en) | 2007-02-20 | 2011-03-15 | Fujifilm Corporation | Polymerizable composition, tacky material, and adhesive |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850164A (ja) * | 1981-09-19 | 1983-03-24 | Nippon Steel Corp | 連続鋳造設備 |
-
1984
- 1984-07-19 JP JP59148566A patent/JPS6128572A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850164A (ja) * | 1981-09-19 | 1983-03-24 | Nippon Steel Corp | 連続鋳造設備 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6254778A (ja) * | 1985-09-04 | 1987-03-10 | Bando Chem Ind Ltd | 感圧接着性シート |
| US5187007A (en) * | 1985-12-27 | 1993-02-16 | Lintec Corporation | Adhesive sheets |
| JPS6317981A (ja) * | 1986-07-09 | 1988-01-25 | F S K Kk | 粘着シ−ト |
| US4999242A (en) * | 1987-07-08 | 1991-03-12 | Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| US5149586A (en) * | 1987-07-08 | 1992-09-22 | Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| JPH01110584A (ja) * | 1987-10-22 | 1989-04-27 | Nichiban Co Ltd | 硬化型粘着テープまたはシート |
| JPH01252684A (ja) * | 1988-04-01 | 1989-10-09 | Furukawa Electric Co Ltd:The | 放射線硬化性粘着テープ |
| US5356949A (en) * | 1988-07-21 | 1994-10-18 | Lintec Corporation | Adhesive composition comprising (meth)acrylate polymer and epoxy resin |
| JPH03278444A (ja) * | 1990-09-07 | 1991-12-10 | Bando Chem Ind Ltd | 半導体ウエハーのダイシング方法 |
| JPH06184521A (ja) * | 1992-12-21 | 1994-07-05 | Nichiban Co Ltd | 表面保護材及びその形成方法 |
| EP0715341A1 (en) | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| KR100351705B1 (ko) * | 2000-06-27 | 2002-09-11 | 한솔제지주식회사 | 다이싱테이프용 감광성 점착 조성물 |
| US7906582B2 (en) | 2007-02-20 | 2011-03-15 | Fujifilm Corporation | Polymerizable composition, tacky material, and adhesive |
| WO2009028455A1 (ja) * | 2007-08-27 | 2009-03-05 | Lintec Corporation | 再剥離型粘着シートおよび不完全硬化塗膜の保護方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0242393B2 (enrdf_load_stackoverflow) | 1990-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |