JPH0242393B2 - - Google Patents

Info

Publication number
JPH0242393B2
JPH0242393B2 JP59148566A JP14856684A JPH0242393B2 JP H0242393 B2 JPH0242393 B2 JP H0242393B2 JP 59148566 A JP59148566 A JP 59148566A JP 14856684 A JP14856684 A JP 14856684A JP H0242393 B2 JPH0242393 B2 JP H0242393B2
Authority
JP
Japan
Prior art keywords
adhesive
wafer
radiation
adhesive sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59148566A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6128572A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59148566A priority Critical patent/JPS6128572A/ja
Publication of JPS6128572A publication Critical patent/JPS6128572A/ja
Publication of JPH0242393B2 publication Critical patent/JPH0242393B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP59148566A 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法 Granted JPS6128572A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59148566A JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59148566A JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Publications (2)

Publication Number Publication Date
JPS6128572A JPS6128572A (ja) 1986-02-08
JPH0242393B2 true JPH0242393B2 (enrdf_load_stackoverflow) 1990-09-21

Family

ID=15455609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59148566A Granted JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Country Status (1)

Country Link
JP (1) JPS6128572A (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0635569B2 (ja) * 1985-09-04 1994-05-11 バンドー化学株式会社 感圧接着性シート
US5187007A (en) * 1985-12-27 1993-02-16 Lintec Corporation Adhesive sheets
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
EP0298448B1 (en) * 1987-07-08 1994-06-29 The Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH01252684A (ja) * 1988-04-01 1989-10-09 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH01110584A (ja) * 1987-10-22 1989-04-27 Nichiban Co Ltd 硬化型粘着テープまたはシート
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
JPH03278444A (ja) * 1990-09-07 1991-12-10 Bando Chem Ind Ltd 半導体ウエハーのダイシング方法
JPH06184521A (ja) * 1992-12-21 1994-07-05 Nichiban Co Ltd 表面保護材及びその形成方法
JP3521099B2 (ja) 1994-11-29 2004-04-19 リンテック株式会社 ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート
KR100351705B1 (ko) * 2000-06-27 2002-09-11 한솔제지주식회사 다이싱테이프용 감광성 점착 조성물
JP5022731B2 (ja) 2007-02-20 2012-09-12 富士フイルム株式会社 重合性組成物、粘着性材料及び接着剤
US20110212328A1 (en) * 2007-08-27 2011-09-01 Lintec Corporation Releasable adhesive sheet and method for protecting incompletely cured coating film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備

Also Published As

Publication number Publication date
JPS6128572A (ja) 1986-02-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term