JPS61284933A - ヒ−タブロツク - Google Patents
ヒ−タブロツクInfo
- Publication number
- JPS61284933A JPS61284933A JP12569085A JP12569085A JPS61284933A JP S61284933 A JPS61284933 A JP S61284933A JP 12569085 A JP12569085 A JP 12569085A JP 12569085 A JP12569085 A JP 12569085A JP S61284933 A JPS61284933 A JP S61284933A
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- recess
- inert gas
- projections
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12569085A JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12569085A JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61284933A true JPS61284933A (ja) | 1986-12-15 |
| JPH0558567B2 JPH0558567B2 (enExample) | 1993-08-26 |
Family
ID=14916277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12569085A Granted JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61284933A (enExample) |
-
1985
- 1985-06-10 JP JP12569085A patent/JPS61284933A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0558567B2 (enExample) | 1993-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4894752A (en) | Lead frame for a semiconductor device | |
| JPH0341428B2 (enExample) | ||
| EP0226315B1 (en) | Countergravity casting apparatus | |
| US5877546A (en) | Semiconductor package with transparent window and fabrication method thereof | |
| JPS5832518A (ja) | 押出型材の製造方法 | |
| JPS61284933A (ja) | ヒ−タブロツク | |
| KR930006129B1 (ko) | 반도체 장치의 제조방법 및 그 장치 | |
| JPS60244034A (ja) | ワイヤボンデイング用雰囲気形成装置 | |
| JPH07146195A (ja) | 圧力センサの製造方法 | |
| JPS60257159A (ja) | 半導体装置 | |
| JPH0195887A (ja) | ワイヤ送給ノズル | |
| JPH0722888A (ja) | 圧電素子容器 | |
| US6210548B1 (en) | Apparatus for partially removing plating films of leadframe | |
| JPH047102B2 (enExample) | ||
| JPS6021028B2 (ja) | 立向き溶接方法 | |
| JPH04250640A (ja) | ボンダー用ワーク加熱装置 | |
| JPH04176156A (ja) | 半導体装置用リードフレーム | |
| SU517393A1 (ru) | Способ наплавки сплава на изделие | |
| JPH023625Y2 (enExample) | ||
| JPS60222016A (ja) | 金属製魔法瓶の製造法 | |
| JPS644052A (en) | Semiconductor device | |
| JPH03155487A (ja) | レーザ溶接方法 | |
| KR830000975Y1 (ko) | 반도체 장치의 제조장치 | |
| JPH0553566B2 (enExample) | ||
| JPH05335455A (ja) | 半導体装置用リードフレーム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |