JPH0558567B2 - - Google Patents
Info
- Publication number
- JPH0558567B2 JPH0558567B2 JP12569085A JP12569085A JPH0558567B2 JP H0558567 B2 JPH0558567 B2 JP H0558567B2 JP 12569085 A JP12569085 A JP 12569085A JP 12569085 A JP12569085 A JP 12569085A JP H0558567 B2 JPH0558567 B2 JP H0558567B2
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- main body
- recess
- inert gas
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011261 inert gas Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 5
- 210000002445 nipple Anatomy 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12569085A JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12569085A JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61284933A JPS61284933A (ja) | 1986-12-15 |
| JPH0558567B2 true JPH0558567B2 (enExample) | 1993-08-26 |
Family
ID=14916277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12569085A Granted JPS61284933A (ja) | 1985-06-10 | 1985-06-10 | ヒ−タブロツク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61284933A (enExample) |
-
1985
- 1985-06-10 JP JP12569085A patent/JPS61284933A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61284933A (ja) | 1986-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6578753B1 (en) | Ultrasonic transducer for a bonding apparatus and method for manufacturing the same | |
| JP2002270736A5 (enExample) | ||
| JPH0558567B2 (enExample) | ||
| JPS60137042A (ja) | 樹脂封止形半導体装置 | |
| US20010045638A1 (en) | Method of producing semiconductor device and configuration thereof, and lead frame used in said method | |
| JP3629124B2 (ja) | 半導体素子用冷却装置およびその製造方法 | |
| JPS60261163A (ja) | リードフレームの製造方法 | |
| JPH07254622A (ja) | 半導体装置とその製造方法 | |
| US5917237A (en) | Semiconductor integrated circuit device and lead frame therefor | |
| JPS54136179A (en) | Semiconductor device | |
| JPH022488Y2 (enExample) | ||
| JP3366280B2 (ja) | ボンディング装置 | |
| JPS5856359A (ja) | 半導体装置 | |
| KR19990075618A (ko) | 와이어 본딩 공정용 히터 블록 | |
| KR100259750B1 (ko) | 반도체 소자 탑재용의 히트 싱크가 돌설된 반도체 장치용 아이릿트의 제조방법 | |
| JP2001051083A (ja) | ヒートシンク | |
| JPH05246186A (ja) | Icカード | |
| JP2527840B2 (ja) | リ―ドフレ―ム | |
| JP2008300714A (ja) | 半導体レーザ装置 | |
| JPH07243927A (ja) | 圧力センサの製造方法 | |
| US6210548B1 (en) | Apparatus for partially removing plating films of leadframe | |
| JPS60195946A (ja) | ヒ−トブロツク | |
| JP3082568B2 (ja) | リードフレーム等の被接着材へのフィルム貼付け方法及び装置 | |
| JPH0510357Y2 (enExample) | ||
| JPH0793333B2 (ja) | 半導体装置の製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |