JPS61276333A - Manufacture of semiconductor device and resin molding device used therefor - Google Patents

Abstract

PURPOSE:To equalize resin filling state by disposing a core of a mold at the center, equalizing the distances to cavities, thereby equalizing times until resin is filled in the cavities and pressure is applied thereto. CONSTITUTION:The lead frame 11 of a resin molding machine is composed of concentric inner and outer frames 12, 22, and islands 13 and leads 14 for surrounding the islands are disposed between the frames 12 and 22. Semiconductor elements are mounted on the islands of the frame 11, and electrodes are connected with leads 14. A core 16 filled with resin of the molding machine 15 is disposed at the center, and cavities 19 are communicated through gates 18 with radial liners 17 coupled with the core 16. The distances from the central core 16 to the cavities 19 are equalized, the times until the resin is cast in the cavities 19 and pressure is applied thereto are equalized to form uniform filling state of the resin.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a resin mold type semiconductor device assembled using a lead frame, and a resin mold die apparatus used therein.

[Technical background of the invention]

Conventionally, in semiconductor devices, for example, DIP (Dual I
(nline package) type ICs are assembled using a lead frame, and some have an envelope formed by resin molding using a resin molding machine.

FIG. 3 shows a lead frame used for assembling the above IC. The lead frame 101 in the figure has parallel frame parts (
102, 112), and a semiconductor element (not shown) is mounted between these frames.
3 and a plurality of conductive lead portions 104, 104, . . . are arranged.

The lead frame 101 has a semiconductor element mounted on its island portion 103, and its electrodes are connected to the corresponding lead portions 104, 104, etc. using bonding wires, and then the portions surrounded by broken lines in the figure are resin molded with, for example, epoxy resin. to form an envelope. Next, cut out the tie band and frame part that connect the leads and make DIP type I.
I got a C.

The resin molding is performed by a resin molding device that becomes a molding die 105 made of, for example, epoxy resin as shown in FIG. 4. Reference numeral 106 in FIG. 1 is a cull for loading the molding resin material.

A runner 107 extends from this and branches, each communicating with a cavity 109 via a gate 108. Each cavity forms a resin mold configured to correspond to each island portion and lead portion of the lead frame.

[Problems with background technology]

According to the above-mentioned manufacturing method using the conventional lead frame, the distance from when the mold resin is loaded into the cull until the resin reaches the cavity varies depending on the cavity. There are some drawbacks.

Next, since the runner portion is long, a large amount of resin is required to fill the runner portion, resulting in a disadvantage that the material efficiency of the molding resin is poor.

In response to the above, a multi-plunger system has been proposed, but there are problems in terms of maintenance and management of the device, and there are also problems in terms of uniformity. Furthermore, since the diameter of the plunger in this method is smaller than that of a normal mold, it is necessary to mold the molded resin tablet into a small size, which has the drawback of poor resin molding efficiency and high cost.

[Purpose of the invention]

In view of the above conventional problems, the present invention improves a method of manufacturing a semiconductor device formed by resin molding using a lead frame, and a resin molding apparatus used therein.

[Summary of the invention]

The method of manufacturing a semiconductor device according to the present invention includes a method of manufacturing a semiconductor device using a lead frame in which a lead frame portion is formed into an annular shape, and a method of manufacturing a semiconductor device using a lead frame in which a lead frame portion is formed into an annular shape. To provide a resin molding device including a mold having cavities arranged around a circumference around a cull.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

A lead frame 11 shown in FIG. 1 prepared for manufacturing a semiconductor device according to the present invention has a concentric ring-shaped frame portion 12.
．． 22, and includes an island part 13 between the inner frame part 12 and the outer frame part 22, and lead parts 14.

As described above, the semiconductor element (not shown) is attached to the island part 13 of the -de frame 11, and its electrodes are connected to the corresponding lead parts 14, 14, etc. with bonding wires, and then the part surrounded by the broken line in the figure is For example, a resin mold is applied to the epoxy resin to form an envelope. Next, remove the tie band and frame that connect the leads and perform DI.
Obtain a P-type IC.

The resin mold is made using a resin molding machine, for example, a mold 15 made of epoxy resin as shown in FIG. Runners 17, 17... extend radially from the center, and each connects to a cavity 19, 19 via a gate 18, 18...
It has a shape that communicates with... Each cavity is arranged to correspond to the island portion and lead portion of the lead frame, and is equally spaced from the cull.

【Effect of the invention〕

According to this invention, first, since the cull of the mold is located in the center and the distance from each cavity is equal, it takes a long time from when the resin starts being pumped until the resin is filled into the cavities and pressure is applied. is the same for all cavities, so the state of resin filling can be made uniform.

Next, since the distance from the cull to the gate is shortened, the usage efficiency of the molding resin is significantly improved.

Furthermore, mold resin tablets loaded in multi-plunger single molding have to be made small and expensive, but this is not necessary in the method of the present invention, so the mold resin can be inexpensive.

As mentioned above, the method of the present invention solves all the drawbacks of the conventional method, has the effect of making it possible to maintain a constant mold condition of the envelope of a semiconductor device, and reducing the cost of the resin for the molding device. .

[Brief explanation of drawings]

FIG. 1 is a front view of a lead frame according to an embodiment of the present invention, FIG. 2 is a top view of a part of a mold according to an embodiment of the present invention, and FIG. 3 is a front view of a conventional lead frame. FIG. 4 is a top view of a part of a conventional mold. 11 Lead frame 12 Inner frame part 13 Island part 14 Lead part 15 Mold die 16 Cal 17 Runner 18 Gate 19 Cavity

Claims (2)

[Claims] (1) A lead frame is prepared in which an island part on which a semiconductor element is mounted and a conductive lead part are arranged and bonded to the lead part of a lead frame having a ring-shaped frame part, and the electrodes of the semiconductor element are led out to the leads, A method of manufacturing a semiconductor device, comprising applying a resin mold to the semiconductor device to form an envelope. (2) A resin molding device comprising a mold in which a cull into which molding resin is loaded is provided in the center and cavities are arranged on the circumference through gates from runners extending radially from the cull.